JPH0322057B2 - - Google Patents

Info

Publication number
JPH0322057B2
JPH0322057B2 JP62321180A JP32118087A JPH0322057B2 JP H0322057 B2 JPH0322057 B2 JP H0322057B2 JP 62321180 A JP62321180 A JP 62321180A JP 32118087 A JP32118087 A JP 32118087A JP H0322057 B2 JPH0322057 B2 JP H0322057B2
Authority
JP
Japan
Prior art keywords
wafer
blade
chamber
elevator
lock chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62321180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63252439A (ja
Inventor
Meidan Dan
Sameku Satsuson
Nin Kuu Wan Deiuitsudo
Chan Deiuitsudo
Toshima Masato
Harari Aizatsuku
Deii Hotsupu Piitaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JPS63252439A publication Critical patent/JPS63252439A/ja
Publication of JPH0322057B2 publication Critical patent/JPH0322057B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/0454—
    • H10P72/0461—
    • H10P72/0464—
    • H10P72/0466—
    • H10P72/3302—
    • H10P72/3306—
    • H10P72/3308—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Threshing Machine Elements (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
JP62321180A 1986-12-19 1987-12-18 多チャンバの統合処理システム Granted JPS63252439A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94480386A 1986-12-19 1986-12-19
US944803 1986-12-19

Publications (2)

Publication Number Publication Date
JPS63252439A JPS63252439A (ja) 1988-10-19
JPH0322057B2 true JPH0322057B2 (cg-RX-API-DMAC10.html) 1991-03-26

Family

ID=25482099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62321180A Granted JPS63252439A (ja) 1986-12-19 1987-12-18 多チャンバの統合処理システム

Country Status (4)

Country Link
EP (1) EP0272141B1 (cg-RX-API-DMAC10.html)
JP (1) JPS63252439A (cg-RX-API-DMAC10.html)
AT (1) ATE102397T1 (cg-RX-API-DMAC10.html)
DE (1) DE3789212T2 (cg-RX-API-DMAC10.html)

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US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
US6267423B1 (en) 1995-12-08 2001-07-31 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
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JP3769802B2 (ja) * 1996-02-09 2006-04-26 株式会社日立製作所 半導体装置の製造方法
JPH09323276A (ja) * 1996-06-03 1997-12-16 Toyota Autom Loom Works Ltd 搬送装置及びロボットアーム
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JPH10163295A (ja) * 1996-11-26 1998-06-19 Tokyo Electron Ltd ウエハ搬送装置
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US6068441A (en) * 1997-11-21 2000-05-30 Asm America, Inc. Substrate transfer system for semiconductor processing equipment
US7253109B2 (en) 1997-11-26 2007-08-07 Applied Materials, Inc. Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
JP4947834B2 (ja) 1997-11-26 2012-06-06 アプライド マテリアルズ インコーポレイテッド ダメージフリー被覆刻設堆積法
JP3286240B2 (ja) * 1998-02-09 2002-05-27 日本エー・エス・エム株式会社 半導体処理用ロードロック装置及び方法
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
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JP2003060005A (ja) * 2001-08-20 2003-02-28 Ulvac Japan Ltd 真空処理装置
JP3883929B2 (ja) 2001-09-25 2007-02-21 大日本スクリーン製造株式会社 薄膜形成装置および薄膜形成方法
US7001468B1 (en) 2002-02-15 2006-02-21 Tokyo Electron Limited Pressure energized pressure vessel opening and closing device and method of providing therefor
US7387868B2 (en) 2002-03-04 2008-06-17 Tokyo Electron Limited Treatment of a dielectric layer using supercritical CO2
US7677859B2 (en) * 2002-07-22 2010-03-16 Brooks Automation, Inc. Substrate loading and uploading station with buffer
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US7021635B2 (en) 2003-02-06 2006-04-04 Tokyo Electron Limited Vacuum chuck utilizing sintered material and method of providing thereof
US7225820B2 (en) 2003-02-10 2007-06-05 Tokyo Electron Limited High-pressure processing chamber for a semiconductor wafer
US7077917B2 (en) 2003-02-10 2006-07-18 Tokyo Electric Limited High-pressure processing chamber for a semiconductor wafer
US7270137B2 (en) 2003-04-28 2007-09-18 Tokyo Electron Limited Apparatus and method of securing a workpiece during high-pressure processing
US7163380B2 (en) 2003-07-29 2007-01-16 Tokyo Electron Limited Control of fluid flow in the processing of an object with a fluid
US7186093B2 (en) 2004-10-05 2007-03-06 Tokyo Electron Limited Method and apparatus for cooling motor bearings of a high pressure pump
US7491662B2 (en) * 2004-05-17 2009-02-17 Hitachi Kokusai Electric Inc. Substrate processing apparatus
US7250374B2 (en) 2004-06-30 2007-07-31 Tokyo Electron Limited System and method for processing a substrate using supercritical carbon dioxide processing
US7307019B2 (en) 2004-09-29 2007-12-11 Tokyo Electron Limited Method for supercritical carbon dioxide processing of fluoro-carbon films
US7491036B2 (en) 2004-11-12 2009-02-17 Tokyo Electron Limited Method and system for cooling a pump
US7434590B2 (en) 2004-12-22 2008-10-14 Tokyo Electron Limited Method and apparatus for clamping a substrate in a high pressure processing system
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US7435447B2 (en) 2005-02-15 2008-10-14 Tokyo Electron Limited Method and system for determining flow conditions in a high pressure processing system
US7767145B2 (en) 2005-03-28 2010-08-03 Toyko Electron Limited High pressure fourier transform infrared cell
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DE102005056323A1 (de) * 2005-11-25 2007-05-31 Aixtron Ag Prozesskammermodul zum gleichzeitigen Abscheiden von Schichten auf mehreren Substraten
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WO2008140093A1 (ja) * 2007-05-15 2008-11-20 Ulvac, Inc. 搬送装置及びこれを用いた真空処理装置
WO2009034795A1 (ja) * 2007-09-10 2009-03-19 Ulvac, Inc. 基板搬送ロボット、真空処理装置
TWI499725B (zh) * 2010-12-30 2015-09-11 Au Optronics Corp 潔淨風扇節能系統
JP5314789B2 (ja) * 2012-06-13 2013-10-16 株式会社日立製作所 真空処理装置及び真空処理方法
WO2014025918A1 (en) * 2012-08-08 2014-02-13 Applied Materials, Inc Linked vacuum processing tools and methods of using the same
CN111254418B (zh) * 2020-02-10 2020-12-29 深圳市拉普拉斯能源技术有限公司 一种pecvd镀膜机
CN114256124A (zh) * 2021-12-27 2022-03-29 无锡邑文电子科技有限公司 晶圆真空顶升装置以及半导体设备
CN119993867B (zh) * 2025-02-08 2025-10-31 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 集束型高真空晶圆键合设备

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Also Published As

Publication number Publication date
DE3789212D1 (de) 1994-04-07
EP0272141A2 (en) 1988-06-22
EP0272141B1 (en) 1994-03-02
EP0272141A3 (en) 1989-10-11
DE3789212T2 (de) 1994-06-01
ATE102397T1 (de) 1994-03-15
JPS63252439A (ja) 1988-10-19

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