WO2009034795A1 - 基板搬送ロボット、真空処理装置 - Google Patents

基板搬送ロボット、真空処理装置 Download PDF

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Publication number
WO2009034795A1
WO2009034795A1 PCT/JP2008/064008 JP2008064008W WO2009034795A1 WO 2009034795 A1 WO2009034795 A1 WO 2009034795A1 JP 2008064008 W JP2008064008 W JP 2008064008W WO 2009034795 A1 WO2009034795 A1 WO 2009034795A1
Authority
WO
WIPO (PCT)
Prior art keywords
rotating member
type rotating
driving shaft
processing apparatus
substrate transfer
Prior art date
Application number
PCT/JP2008/064008
Other languages
English (en)
French (fr)
Inventor
Kenji Ago
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN200880107039A priority Critical patent/CN101801615A/zh
Priority to JP2009532111A priority patent/JPWO2009034795A1/ja
Publication of WO2009034795A1 publication Critical patent/WO2009034795A1/ja
Priority to US12/717,331 priority patent/US20100178136A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • B25J9/1065—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links with parallelograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/20—Control lever and linkage systems
    • Y10T74/20207—Multiple controlling elements for single controlled element
    • Y10T74/20305—Robotic arm

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

　載置位置が多様な処理室との基板受渡を短時間で行なう。Ａ回転部材（１３）やＢ回転部材（１４）が静止した状態で、第一～第四の駆動軸（１１1～１１4）が回転すると、第一～第四の載置部（１５1～１５4）は、その一辺の延長線上を直線移動する。第一の駆動軸（１１1）とＡ回転部材（１３）、第二の駆動軸（１１2）とＢ回転部材（１４）、第三の駆動軸 （１１3）とＡ回転部材（１３）、第四の駆動軸（１１4）とＢ回転部材（１４）が同一角度同一方向に回転すると、第一～第四の載置部（１５1～１５4）は回転移動される。直線移動と回転移動を組み合わせると、第一～第四の載置部（１５1～１５4）を所望の場所に移動させることができる。
PCT/JP2008/064008 2007-09-10 2008-08-05 基板搬送ロボット、真空処理装置 WO2009034795A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880107039A CN101801615A (zh) 2007-09-10 2008-08-05 基板搬送机械手、真空处理装置
JP2009532111A JPWO2009034795A1 (ja) 2007-09-10 2008-08-05 基板搬送ロボット、真空処理装置
US12/717,331 US20100178136A1 (en) 2007-09-10 2010-03-04 Substrate transfer robot and vacuum processing apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007233543 2007-09-10
JP2007-233543 2007-09-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/717,331 Continuation US20100178136A1 (en) 2007-09-10 2010-03-04 Substrate transfer robot and vacuum processing apparatus

Publications (1)

Publication Number Publication Date
WO2009034795A1 true WO2009034795A1 (ja) 2009-03-19

Family

ID=40451805

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064008 WO2009034795A1 (ja) 2007-09-10 2008-08-05 基板搬送ロボット、真空処理装置

Country Status (6)

Country Link
US (1) US20100178136A1 (ja)
JP (1) JPWO2009034795A1 (ja)
KR (1) KR20100052525A (ja)
CN (1) CN101801615A (ja)
TW (1) TWI394647B (ja)
WO (1) WO2009034795A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2082853B1 (de) * 2008-01-23 2011-01-26 R+W Antriebselemente GmbH Ausgleichselement für eine Positioniereinrichtung
WO2011072577A1 (zh) * 2009-12-15 2011-06-23 北京北方微电子基地设备工艺研究中心有限责任公司 一种机械手臂装置及包括该机械手臂装置的基片处理系统
JP2013084823A (ja) * 2011-10-11 2013-05-09 Ulvac Japan Ltd 搬送ロボット及び真空装置
JP5286451B2 (ja) * 2010-08-24 2013-09-11 株式会社アルバック 搬送装置
CN104576474A (zh) * 2013-08-30 2015-04-29 罗普伺达机器人有限公司 具有多臂的搬运机器人
JP2016500473A (ja) * 2012-11-30 2016-01-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 不等長の前腕部を備えた多軸ロボット装置、電子デバイス製造システム、及び、電子デバイス製造において基板を搬送するための方法
JPWO2016035837A1 (ja) * 2014-09-03 2017-04-27 株式会社アルバック 搬送装置及び真空装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569140A (zh) * 2010-12-17 2012-07-11 北京北方微电子基地设备工艺研究中心有限责任公司 真空机械手和晶片处理系统
JP5871550B2 (ja) * 2011-10-07 2016-03-01 株式会社アルバック 搬送ロボット及び真空装置
US8814239B2 (en) * 2012-02-15 2014-08-26 Varian Semiconductor Equipment Associates, Inc. Techniques for handling media arrays
US9190306B2 (en) * 2012-11-30 2015-11-17 Lam Research Corporation Dual arm vacuum robot
CN104617028B (zh) * 2013-11-04 2017-09-15 沈阳芯源微电子设备有限公司 一种方形基片和圆形基片兼容的定位结构
US9889567B2 (en) 2015-04-24 2018-02-13 Applied Materials, Inc. Wafer swapper
JP6649768B2 (ja) * 2015-12-28 2020-02-19 日本電産サンキョー株式会社 産業用ロボット
CN107327551B (zh) * 2017-07-13 2024-04-30 四川昆仑石油设备制造有限公司 一种基于平行四边形原理的联动器及移送装置
NL2020044B1 (en) * 2017-12-08 2019-06-19 Vdl Enabling Tech Group B V A planar multi-joint robot arm system
CN109552881A (zh) * 2018-12-04 2019-04-02 武汉华星光电技术有限公司 一种显示面板真空吸取系统
KR102240925B1 (ko) * 2019-07-17 2021-04-15 세메스 주식회사 기판 처리 설비 및 기판 반송 장치
CN116238895B (zh) * 2022-12-12 2023-11-07 常州市大成真空技术有限公司 一种旋转避位装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63252439A (ja) * 1986-12-19 1988-10-19 アプライド　マテリアルズインコーポレーテッド 多チャンバの統合処理システム
JPH10249757A (ja) * 1997-03-18 1998-09-22 Komatsu Ltd 搬送用ロボット
JP2000323554A (ja) * 1999-05-14 2000-11-24 Tokyo Electron Ltd 処理装置
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JP2007015023A (ja) * 2005-07-05 2007-01-25 Daihen Corp リンク装置および搬送ロボット

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JP4411025B2 (ja) * 2003-07-11 2010-02-10 株式会社ダイヘン ２アーム式搬送ロボット
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JP4732716B2 (ja) * 2004-06-29 2011-07-27 株式会社アルバック 搬送装置及びその制御方法並びに真空処理装置

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* Cited by examiner, † Cited by third party
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JPS63252439A (ja) * 1986-12-19 1988-10-19 アプライド　マテリアルズインコーポレーテッド 多チャンバの統合処理システム
JPH10249757A (ja) * 1997-03-18 1998-09-22 Komatsu Ltd 搬送用ロボット
JP2000323554A (ja) * 1999-05-14 2000-11-24 Tokyo Electron Ltd 処理装置
JP2002362738A (ja) * 2001-06-04 2002-12-18 Jel:Kk 搬送アーム
JP2006120659A (ja) * 2004-10-19 2006-05-11 Jel:Kk 基板搬送装置
JP2007015023A (ja) * 2005-07-05 2007-01-25 Daihen Corp リンク装置および搬送ロボット

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2082853B1 (de) * 2008-01-23 2011-01-26 R+W Antriebselemente GmbH Ausgleichselement für eine Positioniereinrichtung
WO2011072577A1 (zh) * 2009-12-15 2011-06-23 北京北方微电子基地设备工艺研究中心有限责任公司 一种机械手臂装置及包括该机械手臂装置的基片处理系统
CN102092045B (zh) * 2009-12-15 2012-09-05 北京北方微电子基地设备工艺研究中心有限责任公司 一种基片处理系统及其机械手臂装置
JP5286451B2 (ja) * 2010-08-24 2013-09-11 株式会社アルバック 搬送装置
JP2013084823A (ja) * 2011-10-11 2013-05-09 Ulvac Japan Ltd 搬送ロボット及び真空装置
JP2016500473A (ja) * 2012-11-30 2016-01-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 不等長の前腕部を備えた多軸ロボット装置、電子デバイス製造システム、及び、電子デバイス製造において基板を搬送するための方法
CN104576474A (zh) * 2013-08-30 2015-04-29 罗普伺达机器人有限公司 具有多臂的搬运机器人
JPWO2016035837A1 (ja) * 2014-09-03 2017-04-27 株式会社アルバック 搬送装置及び真空装置

Also Published As

Publication number Publication date
TW200916287A (en) 2009-04-16
TWI394647B (zh) 2013-05-01
KR20100052525A (ko) 2010-05-19
US20100178136A1 (en) 2010-07-15
JPWO2009034795A1 (ja) 2010-12-24
CN101801615A (zh) 2010-08-11

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