WO2008117350A1 - ワークハンドリング装置 - Google Patents

ワークハンドリング装置 Download PDF

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Publication number
WO2008117350A1
WO2008117350A1 PCT/JP2007/055831 JP2007055831W WO2008117350A1 WO 2008117350 A1 WO2008117350 A1 WO 2008117350A1 JP 2007055831 W JP2007055831 W JP 2007055831W WO 2008117350 A1 WO2008117350 A1 WO 2008117350A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
hand
carrying
handling device
hands
Prior art date
Application number
PCT/JP2007/055831
Other languages
English (en)
French (fr)
Inventor
Shinji Yokoyama
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to JP2009506063A priority Critical patent/JP5014417B2/ja
Priority to PCT/JP2007/055831 priority patent/WO2008117350A1/ja
Publication of WO2008117350A1 publication Critical patent/WO2008117350A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)

Abstract

　本発明のワークハンドリング装置は、ワークを異なる位置にてそれぞれ保持する複数のハンドとしての第１ハンド（１４０）及び第２ハンド（１５０）、複数のハンドを３次元的に移動させるハンド駆動機構（１０，２０，３０，４０，５０，６０，７０）を備え、第１ハンド（１４０）は、ワークを所定平面内において回転自在に担持する第１回転担持部（１４３）を含み、第２ハンド（１５０）は、第１回転担持部を支点として、ワークを担持しつつ所定平面内において移動させる担持駆動機構（１５２，１５４，１５５）を含む。これにより、ワークとして面積の大きな大型の基板等を取り扱う場合でも、ワークを確実に保持して、位置ずれを補正しつつ移載することができる。  
PCT/JP2007/055831 2007-03-22 2007-03-22 ワークハンドリング装置 WO2008117350A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009506063A JP5014417B2 (ja) 2007-03-22 2007-03-22 ワークハンドリング装置
PCT/JP2007/055831 WO2008117350A1 (ja) 2007-03-22 2007-03-22 ワークハンドリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055831 WO2008117350A1 (ja) 2007-03-22 2007-03-22 ワークハンドリング装置

Publications (1)

Publication Number Publication Date
WO2008117350A1 true WO2008117350A1 (ja) 2008-10-02

Family

ID=39788095

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/055831 WO2008117350A1 (ja) 2007-03-22 2007-03-22 ワークハンドリング装置

Country Status (2)

Country Link
JP (1) JP5014417B2 (ja)
WO (1) WO2008117350A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011131300A (ja) * 2009-12-22 2011-07-07 Canon Inc ロボットシステム、その制御装置及び方法
JP2012166314A (ja) * 2011-02-15 2012-09-06 Seiko Epson Corp ロボット用位置検出装置、ロボットシステム、及びロボット用位置検出方法
WO2013146763A1 (ja) * 2012-03-29 2013-10-03 株式会社ｉＺＡ 多関節ロボット、搬送装置
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
CN109946306A (zh) * 2019-03-21 2019-06-28 江苏杰士德精密工业有限公司 电池检测拍照设备
CN110280893A (zh) * 2018-03-13 2019-09-27 株式会社迪思科 定位方法
CN111937133A (zh) * 2018-05-25 2020-11-13 应用材料公司 具有长运动能力的精确动态调平机构
CN112928324A (zh) * 2021-01-29 2021-06-08 蜂巢能源科技有限公司 模组部件装配方法及模组部件装配装置
WO2022210940A1 (ja) * 2021-03-31 2022-10-06 東京エレクトロン株式会社 基板搬送装置、塗布処理装置および基板搬送方法
CN115488684A (zh) * 2022-09-23 2022-12-20 广东科杰技术股份有限公司 一种自动上下料的机床

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219650U (ja) * 1988-07-27 1990-02-08
JPH03281141A (ja) * 1990-03-28 1991-12-11 Hitachi Ltd 脆性材料ローディング装置
JPH04308104A (ja) * 1991-04-03 1992-10-30 Amada Co Ltd 材料搬出入装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0219650U (ja) * 1988-07-27 1990-02-08
JPH03281141A (ja) * 1990-03-28 1991-12-11 Hitachi Ltd 脆性材料ローディング装置
JPH04308104A (ja) * 1991-04-03 1992-10-30 Amada Co Ltd 材料搬出入装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011131300A (ja) * 2009-12-22 2011-07-07 Canon Inc ロボットシステム、その制御装置及び方法
JP2012166314A (ja) * 2011-02-15 2012-09-06 Seiko Epson Corp ロボット用位置検出装置、ロボットシステム、及びロボット用位置検出方法
WO2013146763A1 (ja) * 2012-03-29 2013-10-03 株式会社ｉＺＡ 多関節ロボット、搬送装置
US9561586B2 (en) 2012-03-29 2017-02-07 Ulvac, Inc. Articulated robot, and conveying device
JP6276449B1 (ja) * 2017-03-30 2018-02-07 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP2018168432A (ja) * 2017-03-30 2018-11-01 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
CN110280893B (zh) * 2018-03-13 2022-09-09 株式会社迪思科 定位方法
CN110280893A (zh) * 2018-03-13 2019-09-27 株式会社迪思科 定位方法
CN111937133A (zh) * 2018-05-25 2020-11-13 应用材料公司 具有长运动能力的精确动态调平机构
CN109946306A (zh) * 2019-03-21 2019-06-28 江苏杰士德精密工业有限公司 电池检测拍照设备
CN109946306B (zh) * 2019-03-21 2024-02-23 江苏杰士德精密工业有限公司 电池检测拍照设备
CN112928324B (zh) * 2021-01-29 2022-03-25 蜂巢能源科技有限公司 模组部件装配方法及模组部件装配装置
CN112928324A (zh) * 2021-01-29 2021-06-08 蜂巢能源科技有限公司 模组部件装配方法及模组部件装配装置
WO2022210940A1 (ja) * 2021-03-31 2022-10-06 東京エレクトロン株式会社 基板搬送装置、塗布処理装置および基板搬送方法
CN115488684A (zh) * 2022-09-23 2022-12-20 广东科杰技术股份有限公司 一种自动上下料的机床

Also Published As

Publication number Publication date
JPWO2008117350A1 (ja) 2010-07-08
JP5014417B2 (ja) 2012-08-29

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