WO2009044526A1 - 基板保持機構、基板受渡機構、及び基板処理装置 - Google Patents

基板保持機構、基板受渡機構、及び基板処理装置 Download PDF

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Publication number
WO2009044526A1
WO2009044526A1 PCT/JP2008/002707 JP2008002707W WO2009044526A1 WO 2009044526 A1 WO2009044526 A1 WO 2009044526A1 JP 2008002707 W JP2008002707 W JP 2008002707W WO 2009044526 A1 WO2009044526 A1 WO 2009044526A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate holding
holding
section
rollers
Prior art date
Application number
PCT/JP2008/002707
Other languages
English (en)
French (fr)
Inventor
Shinichiro Ishihara
Hajime Ashida
Akira Watanabe
Original Assignee
Evatech Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evatech Co., Ltd. filed Critical Evatech Co., Ltd.
Priority to US12/681,018 priority Critical patent/US20100272550A1/en
Priority to CN200880110294A priority patent/CN101815660A/zh
Priority to EP08836514A priority patent/EP2216277A4/en
Publication of WO2009044526A1 publication Critical patent/WO2009044526A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

　基板の確実な保持及び受け渡しを行うことのできる基板保持機構を提供する。 矩形基板（Ｗ）を保持するための基板保持部を備えた基板保持機構であって、基板（Ｗ）の対向する２辺に対応した基板保持部上の位置に配設され、該基板保持部に回動可能に軸支された複数の基板保持ローラ（１２０）と、該基板保持ローラ（１２０）を回転駆動するローラ駆動手段とを備え、前記基板保持ローラ（１２０）が、円筒部（１２１）とその両端面の外周の一部に設けられた保持フランジ（１２３ａ，ｂ）とを有し、前記ローラ駆動手段によって各基板保持ローラ（１２０）を回動させることにより、その回動角度に応じて前記保持フランジ（１２３ａ，ｂ）による基板（Ｗ）の端縁の保持及び保持解除を切り換え可能な構成とする。
PCT/JP2008/002707 2007-10-05 2008-09-29 基板保持機構、基板受渡機構、及び基板処理装置 WO2009044526A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/681,018 US20100272550A1 (en) 2007-10-05 2008-09-29 Substrate holding mechanism, substrate delivering/receiving mechanism, and substrate processing apparatus
CN200880110294A CN101815660A (zh) 2007-10-05 2008-09-29 基板保持机构、基板交接机构及基板处理装置
EP08836514A EP2216277A4 (en) 2007-10-05 2008-09-29 MECHANISM FOR HOLDING SUBSTRATES, SUBSTRATE LEADING / RECEIVING MECHANISM AND SUBSTRATE PROCESSING DEVICE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-262545 2007-10-05
JP2007262545A JP2009094242A (ja) 2007-10-05 2007-10-05 基板保持機構、基板受渡機構、及び基板処理装置

Publications (1)

Publication Number Publication Date
WO2009044526A1 true WO2009044526A1 (ja) 2009-04-09

Family

ID=40525958

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002707 WO2009044526A1 (ja) 2007-10-05 2008-09-29 基板保持機構、基板受渡機構、及び基板処理装置

Country Status (5)

Country Link
US (1) US20100272550A1 (ja)
EP (1) EP2216277A4 (ja)
JP (1) JP2009094242A (ja)
CN (1) CN101815660A (ja)
WO (1) WO2009044526A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120031333A1 (en) * 2010-04-30 2012-02-09 Applied Materials, Inc. Vertical inline cvd system
US20120300377A1 (en) * 2011-05-27 2012-11-29 Nitto Denko Corporation Turnover device of liquid crystal panel

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129332A (ja) * 2009-12-17 2011-06-30 Nissin Ion Equipment Co Ltd イオンビーム照射装置
CN101974737B (zh) * 2010-07-28 2014-04-16 常州亿晶光电科技有限公司 石墨舟防卡传输装置
JP5657376B2 (ja) * 2010-12-28 2015-01-21 キヤノンアネルバ株式会社 基板搬送装置
JP5727820B2 (ja) * 2011-03-02 2015-06-03 株式会社アルバック 成膜装置および成膜方法
CN102167227B (zh) * 2011-04-02 2012-09-05 东莞宏威数码机械有限公司 基片传输设备
CN102583050B (zh) * 2012-02-07 2014-05-21 深圳市华星光电技术有限公司 液晶面板基材的运输控制设备及其控制方法
JP2013187389A (ja) * 2012-03-08 2013-09-19 Nippon Electric Glass Co Ltd ガラス基板の搬送装置及び搬送方法
US20130251492A1 (en) * 2012-03-23 2013-09-26 Shenzhen China Star Optoelectronics Technology Co, Ltd. Transferring Apparatus for Glass Substrate
US8967369B2 (en) * 2012-12-04 2015-03-03 Shenzhen China Star Optoelectronics Technology Co., Ltd. Transferring apparatus
JP6054213B2 (ja) * 2013-03-11 2016-12-27 東京エレクトロン株式会社 支持部材及び半導体製造装置
CN104576472A (zh) * 2013-10-25 2015-04-29 英属开曼群岛商精曜有限公司 直立式基板传送装置
CN109768187B (zh) * 2017-12-04 2021-06-18 深圳市柯达科电子科技有限公司 一种自动化生产用oled面板制造设备
CN110921255B (zh) * 2018-09-19 2021-09-17 张掖征峰科技有限公司 一种回收电池输送以及朝向自动排列的装置
CN111029236A (zh) * 2018-10-09 2020-04-17 北京北方华创微电子装备有限公司 支撑装置及反应腔室
CN111824772A (zh) * 2019-04-19 2020-10-27 夏普株式会社 输送装置

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Publication number Priority date Publication date Assignee Title
JPH0669316A (ja) * 1992-06-15 1994-03-11 Nissin Electric Co Ltd 基板処理装置
JPH1050645A (ja) * 1996-07-29 1998-02-20 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000100901A (ja) * 1998-09-28 2000-04-07 Kokusai Electric Co Ltd 半導体製造装置
JP2002016127A (ja) * 2000-06-29 2002-01-18 Micronics Japan Co Ltd チャックトップ
JP2002167036A (ja) 2000-11-30 2002-06-11 Mitsubishi Heavy Ind Ltd 大型基板搬送装置及び搬送方法
JP2006327819A (ja) * 2005-05-30 2006-12-07 Central Glass Co Ltd ガラス板の移載装置および移載方法

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Title
See also references of EP2216277A4

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120031333A1 (en) * 2010-04-30 2012-02-09 Applied Materials, Inc. Vertical inline cvd system
CN102859655A (zh) * 2010-04-30 2013-01-02 应用材料公司 垂直直列cvd系统
US9922854B2 (en) * 2010-04-30 2018-03-20 Applied Materials, Inc. Vertical inline CVD system
US20120300377A1 (en) * 2011-05-27 2012-11-29 Nitto Denko Corporation Turnover device of liquid crystal panel
US8864435B2 (en) * 2011-05-27 2014-10-21 Nitto Denko Corporation Turnover device of liquid crystal panel

Also Published As

Publication number Publication date
US20100272550A1 (en) 2010-10-28
CN101815660A (zh) 2010-08-25
EP2216277A1 (en) 2010-08-11
EP2216277A4 (en) 2011-08-24
JP2009094242A (ja) 2009-04-30

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