JPH03157448A - 半導体封止用エポキシ樹脂組成物 - Google Patents

半導体封止用エポキシ樹脂組成物

Info

Publication number
JPH03157448A
JPH03157448A JP1297934A JP29793489A JPH03157448A JP H03157448 A JPH03157448 A JP H03157448A JP 1297934 A JP1297934 A JP 1297934A JP 29793489 A JP29793489 A JP 29793489A JP H03157448 A JPH03157448 A JP H03157448A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
corrosion
copper wire
calcium hydroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1297934A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Matsunaga
義弘 松永
Tadao Nishimori
西森　忠雄
Hiromasa Matsuoka
松岡　宏昌
Kozo Shimamoto
島本　幸三
Kiyoaki Tsumura
清昭 津村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1297934A priority Critical patent/JPH03157448A/ja
Priority to DE19904036096 priority patent/DE4036096A1/de
Priority to US07/611,585 priority patent/US5093712A/en
Priority to GB9024722A priority patent/GB2238660B/en
Publication of JPH03157448A publication Critical patent/JPH03157448A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP1297934A 1989-11-15 1989-11-15 半導体封止用エポキシ樹脂組成物 Pending JPH03157448A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1297934A JPH03157448A (ja) 1989-11-15 1989-11-15 半導体封止用エポキシ樹脂組成物
DE19904036096 DE4036096A1 (de) 1989-11-15 1990-11-13 Kunstharzversiegelte halbleitervorrichtung
US07/611,585 US5093712A (en) 1989-11-15 1990-11-13 Resin-sealed semiconductor device
GB9024722A GB2238660B (en) 1989-11-15 1990-11-14 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1297934A JPH03157448A (ja) 1989-11-15 1989-11-15 半導体封止用エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
JPH03157448A true JPH03157448A (ja) 1991-07-05

Family

ID=17852987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1297934A Pending JPH03157448A (ja) 1989-11-15 1989-11-15 半導体封止用エポキシ樹脂組成物

Country Status (4)

Country Link
US (1) US5093712A (enExample)
JP (1) JPH03157448A (enExample)
DE (1) DE4036096A1 (enExample)
GB (1) GB2238660B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995006085A1 (fr) * 1993-08-20 1995-03-02 Nitto Denko Corporation Dispositif a semi-conducteur
KR100296836B1 (ko) * 1993-08-20 2001-10-24 야마모토 히데키 반도체봉입용열경화성수지조성물및이를이용한반도체장치
US6319619B1 (en) 1997-04-21 2001-11-20 Nitto Denko Corporation Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device
JP2019134181A (ja) * 2009-06-18 2019-08-08 ローム株式会社 半導体装置

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0760839B2 (ja) * 1990-03-15 1995-06-28 株式会社東芝 半導体装置
JP3656198B2 (ja) * 1994-04-28 2005-06-08 東都化成株式会社 改良されたノボラック型エポキシ樹脂及び電子部品封止用樹脂組成物
JPH08111478A (ja) * 1994-10-06 1996-04-30 Toshiba Corp 樹脂封止型半導体装置
GB2344934A (en) * 1995-10-24 2000-06-21 Altera Corp Integrated circuit package
US6653672B1 (en) * 1998-07-14 2003-11-25 Winbond Electronics Corp. Semiconductor die pad placement and wire bond
JP2003092379A (ja) * 2001-09-18 2003-03-28 Hitachi Ltd 半導体装置
DE10252866B3 (de) 2002-11-12 2004-04-29 Kronotec Ag Paneel und Verfahren zur Herstellung eines Paneels
DE10252863B4 (de) 2002-11-12 2007-04-19 Kronotec Ag Holzfaserplatte, insbesondere Fussbodenpaneel
US7617651B2 (en) 2002-11-12 2009-11-17 Kronotec Ag Floor panel
DE50309830D1 (de) 2002-11-15 2008-06-26 Flooring Technologies Ltd Einrichtung bestehend aus zwei miteinander verbindbaren Bauplatten und einem Einsatz zum Verriegeln dieser Bauplatten
DE10306118A1 (de) 2003-02-14 2004-09-09 Kronotec Ag Bauplatte
US7678425B2 (en) 2003-03-06 2010-03-16 Flooring Technologies Ltd. Process for finishing a wooden board and wooden board produced by the process
DE20304761U1 (de) 2003-03-24 2004-04-08 Kronotec Ag Einrichtung zum Verbinden von Bauplatten, insbesondere Bodenpaneele
DE10341172B4 (de) 2003-09-06 2009-07-23 Kronotec Ag Verfahren zum Versiegeln einer Bauplatte
DE20315676U1 (de) 2003-10-11 2003-12-11 Kronotec Ag Paneel, insbesondere Bodenpaneel
US7506481B2 (en) 2003-12-17 2009-03-24 Kronotec Ag Building board for use in subfloors
DE102004005047B3 (de) 2004-01-30 2005-10-20 Kronotec Ag Verfahren und Einrichtung zum Einbringen eines die Feder einer Platte bildenden Streifens
DE102004011931B4 (de) 2004-03-11 2006-09-14 Kronotec Ag Dämmstoffplatte aus einem Holzwerkstoff-Bindemittelfaser-Gemisch
DE102005042657B4 (de) 2005-09-08 2010-12-30 Kronotec Ag Bauplatte und Verfahren zur Herstellung
US7854986B2 (en) 2005-09-08 2010-12-21 Flooring Technologies Ltd. Building board and method for production
DE102005063034B4 (de) 2005-12-29 2007-10-31 Flooring Technologies Ltd. Paneel, insbesondere Bodenpaneel
DE102006006124A1 (de) 2006-02-10 2007-08-23 Flooring Technologies Ltd. Einrichtung zum Verriegeln zweier Bauplatten
DE102006007976B4 (de) 2006-02-21 2007-11-08 Flooring Technologies Ltd. Verfahren zur Veredelung einer Bauplatte
CN101284265B (zh) * 2007-04-13 2010-09-08 欧利速精密工业股份有限公司 热熔黏胶粉末用于非金属物体表面的处理方法及处理装置
FR2917236B1 (fr) * 2007-06-07 2009-10-23 Commissariat Energie Atomique Procede de realisation de via dans un substrat reconstitue.
KR100893487B1 (ko) * 2007-09-06 2009-04-17 삼성모바일디스플레이주식회사 발광 표시 장치 및 그의 제조 방법
CN102666724B (zh) * 2009-12-07 2015-10-14 住友电木株式会社 半导体密封用环氧树脂组合物、其固化体及半导体装置
DE102017121485A1 (de) * 2017-09-15 2019-03-21 Infineon Technologies Austria Ag Halbleitervorrichtung mit Kupferkorrosionsinhibitoren
DE102022115817A1 (de) 2022-06-24 2024-01-04 Infineon Technologies Ag Halbleiterpackage-Einkapselung mit metallaktivierten anorganischen Füllpartikeln

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58174434A (ja) * 1982-04-08 1983-10-13 Sumitomo Bakelite Co Ltd エポキシ樹脂系成形材料
JPS5933319A (ja) * 1982-08-20 1984-02-23 Shin Etsu Chem Co Ltd 難燃性エポキシ樹脂組成物
JPS61110451A (ja) * 1984-11-02 1986-05-28 Nitto Electric Ind Co Ltd 半導体装置
JPS61166823A (ja) * 1985-01-19 1986-07-28 Toshiba Chem Corp 封止用樹脂組成物
JPH0214236A (ja) * 1988-06-30 1990-01-18 Kyocera Corp 電子部品封止用樹脂組成物
JPH02178347A (ja) * 1988-12-28 1990-07-11 Kyocera Corp 電子部品封止用樹脂組成物

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DE1907017B2 (de) * 1968-02-14 1976-04-15 Hitachi Ltd.; Hitachi Chemical Co. Ltd.; Tokio Waermehaertbare formmasse auf basis von polykondensationsharzen mit pulverfoermigen fuellstoffen
DE2164100A1 (de) * 1971-12-23 1973-06-28 Semikron Gleichrichterbau Elektrisch isolierende einkapselungsmasse fuer halbleiteranordnungen
US4042550A (en) * 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
US4111905A (en) * 1977-01-28 1978-09-05 M&T Chemicals Inc. Flame retarding agents and polymer compositions containing same
GB1549103A (en) * 1977-07-19 1979-08-01 Allied Chem Epoxy resin encapsulant compositions
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
GB2087159B (en) * 1980-11-08 1984-05-10 Plessey Co Ltd Plastics encapsulated electronic devices
US4330637A (en) * 1981-01-05 1982-05-18 Western Electric Company, Inc. Encapsulated electronic devices and encapsulating compositions
JPS58166747A (ja) * 1982-03-29 1983-10-01 Toshiba Corp 樹脂封止型半導体装置
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS6038847A (ja) * 1983-08-12 1985-02-28 Hitachi Ltd 樹脂封止半導体装置
JPS6080259A (ja) * 1983-10-07 1985-05-08 Hitachi Ltd 半導体装置
JPS6084322A (ja) * 1983-10-14 1985-05-13 Hitachi Ltd 半導体封止用樹脂組成物
JPS60190453A (ja) * 1984-03-13 1985-09-27 Toagosei Chem Ind Co Ltd 絶縁性保護材料
JPS6119625A (ja) * 1984-07-05 1986-01-28 Toshiba Corp 半導体封止用エポキシ樹脂組成物
JPS6234920A (ja) * 1985-08-07 1987-02-14 Toshiba Corp エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置
US4902732A (en) * 1985-09-30 1990-02-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin-based curable compositions
JPS62150860A (ja) * 1985-12-25 1987-07-04 Hitachi Ltd 半導体装置
JPS62207319A (ja) * 1986-03-06 1987-09-11 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物の製造方法
JPS62285912A (ja) * 1986-06-04 1987-12-11 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0649817B2 (ja) * 1986-07-09 1994-06-29 住友ベ−クライト株式会社 半導体封止用エポキシ樹脂組成物
JPH0618985B2 (ja) * 1987-06-03 1994-03-16 信越化学工業株式会社 エポキシ樹脂組成物
JPH0648710B2 (ja) * 1987-08-03 1994-06-22 株式会社日立製作所 樹脂封止型半導体装置
US5008350A (en) * 1987-12-16 1991-04-16 Sumitomo Chemical Company, Limited Glycidyl ethers of phenolic compounds and process for producing the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58174434A (ja) * 1982-04-08 1983-10-13 Sumitomo Bakelite Co Ltd エポキシ樹脂系成形材料
JPS5933319A (ja) * 1982-08-20 1984-02-23 Shin Etsu Chem Co Ltd 難燃性エポキシ樹脂組成物
JPS61110451A (ja) * 1984-11-02 1986-05-28 Nitto Electric Ind Co Ltd 半導体装置
JPS61166823A (ja) * 1985-01-19 1986-07-28 Toshiba Chem Corp 封止用樹脂組成物
JPH0214236A (ja) * 1988-06-30 1990-01-18 Kyocera Corp 電子部品封止用樹脂組成物
JPH02178347A (ja) * 1988-12-28 1990-07-11 Kyocera Corp 電子部品封止用樹脂組成物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995006085A1 (fr) * 1993-08-20 1995-03-02 Nitto Denko Corporation Dispositif a semi-conducteur
KR100296836B1 (ko) * 1993-08-20 2001-10-24 야마모토 히데키 반도체봉입용열경화성수지조성물및이를이용한반도체장치
KR100332013B1 (ko) * 1993-08-20 2002-04-10 야마모토 히데키 반도체 장치
US6319619B1 (en) 1997-04-21 2001-11-20 Nitto Denko Corporation Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device
JP2019134181A (ja) * 2009-06-18 2019-08-08 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
GB9024722D0 (en) 1991-01-02
US5093712A (en) 1992-03-03
GB2238660A (en) 1991-06-05
DE4036096C2 (enExample) 1993-08-12
DE4036096A1 (de) 1991-05-16
GB2238660B (en) 1993-06-02

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