GB2238660B - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
GB2238660B
GB2238660B GB9024722A GB9024722A GB2238660B GB 2238660 B GB2238660 B GB 2238660B GB 9024722 A GB9024722 A GB 9024722A GB 9024722 A GB9024722 A GB 9024722A GB 2238660 B GB2238660 B GB 2238660B
Authority
GB
United Kingdom
Prior art keywords
resin
semiconductor device
lead
sealed semiconductor
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9024722A
Other languages
English (en)
Other versions
GB9024722D0 (en
GB2238660A (en
Inventor
Matsunaga Yoshihiro
Tadao Nishimori
Hiromasa Matsuoka
Kozo Shimamoto
Kiyoaki Tsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9024722D0 publication Critical patent/GB9024722D0/en
Publication of GB2238660A publication Critical patent/GB2238660A/en
Application granted granted Critical
Publication of GB2238660B publication Critical patent/GB2238660B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y10T428/239—Complete cover or casing

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
GB9024722A 1989-11-15 1990-11-14 Resin-sealed semiconductor device Expired - Fee Related GB2238660B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1297934A JPH03157448A (ja) 1989-11-15 1989-11-15 半導体封止用エポキシ樹脂組成物

Publications (3)

Publication Number Publication Date
GB9024722D0 GB9024722D0 (en) 1991-01-02
GB2238660A GB2238660A (en) 1991-06-05
GB2238660B true GB2238660B (en) 1993-06-02

Family

ID=17852987

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9024722A Expired - Fee Related GB2238660B (en) 1989-11-15 1990-11-14 Resin-sealed semiconductor device

Country Status (4)

Country Link
US (1) US5093712A (enExample)
JP (1) JPH03157448A (enExample)
DE (1) DE4036096A1 (enExample)
GB (1) GB2238660B (enExample)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7431979B2 (en) 2002-11-12 2008-10-07 Kronotec Ag Wood fiberboard
US7484337B2 (en) 2002-11-15 2009-02-03 Kronotec. Ag Floor panel and method of laying a floor panel
US7506481B2 (en) 2003-12-17 2009-03-24 Kronotec Ag Building board for use in subfloors
US7550202B2 (en) 2004-03-11 2009-06-23 Kronotec Ag Insulation board made of a mixture of wood base material and binding fibers
US7562431B2 (en) 2004-01-30 2009-07-21 Flooring Technologies Ltd. Method for bringing in a strip forming a spring of a board
US7617651B2 (en) 2002-11-12 2009-11-17 Kronotec Ag Floor panel
US7621092B2 (en) 2006-02-10 2009-11-24 Flooring Technologies Ltd. Device and method for locking two building boards
US7641963B2 (en) 2002-11-12 2010-01-05 Kronotec Ag Panel and process for producing a panel
US7651751B2 (en) 2003-02-14 2010-01-26 Kronotec Ag Building board
US7678425B2 (en) 2003-03-06 2010-03-16 Flooring Technologies Ltd. Process for finishing a wooden board and wooden board produced by the process
US7827749B2 (en) 2005-12-29 2010-11-09 Flooring Technologies Ltd. Panel and method of manufacture
US7854986B2 (en) 2005-09-08 2010-12-21 Flooring Technologies Ltd. Building board and method for production
US7908816B2 (en) 2003-03-24 2011-03-22 Kronotec Ag Device for connecting building boards, especially floor panels
US8003168B2 (en) 2003-09-06 2011-08-23 Kronotec Ag Method for sealing a building panel
US8176698B2 (en) 2003-10-11 2012-05-15 Kronotec Ag Panel
US8475871B2 (en) 2005-09-08 2013-07-02 Flooring Technologies Ltd. Building board and method for production
US9365028B2 (en) 2006-02-21 2016-06-14 Flooring Technologies Ltd. Method for finishing a building board and building board

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0760839B2 (ja) * 1990-03-15 1995-06-28 株式会社東芝 半導体装置
JP3045775B2 (ja) * 1993-08-20 2000-05-29 日東電工株式会社 半導体装置
DE4496282T1 (de) * 1993-08-20 1995-09-21 Nitto Denko Corp Halbleiter-Einrichtung
JP3656198B2 (ja) * 1994-04-28 2005-06-08 東都化成株式会社 改良されたノボラック型エポキシ樹脂及び電子部品封止用樹脂組成物
JPH08111478A (ja) * 1994-10-06 1996-04-30 Toshiba Corp 樹脂封止型半導体装置
GB2344934A (en) * 1995-10-24 2000-06-21 Altera Corp Integrated circuit package
DE69838610T2 (de) 1997-04-21 2008-02-07 Nitto Denko Corp., Ibaraki Halbleiter-dichtharzzusammensetzung, damit versiegelte halbleiteranordnung, und verfahren zur herstellung einer halbleiteranordnung.
US6653672B1 (en) * 1998-07-14 2003-11-25 Winbond Electronics Corp. Semiconductor die pad placement and wire bond
JP2003092379A (ja) * 2001-09-18 2003-03-28 Hitachi Ltd 半導体装置
CN101284265B (zh) * 2007-04-13 2010-09-08 欧利速精密工业股份有限公司 热熔黏胶粉末用于非金属物体表面的处理方法及处理装置
FR2917236B1 (fr) * 2007-06-07 2009-10-23 Commissariat Energie Atomique Procede de realisation de via dans un substrat reconstitue.
KR100893487B1 (ko) * 2007-09-06 2009-04-17 삼성모바일디스플레이주식회사 발광 표시 장치 및 그의 제조 방법
CN105006462B (zh) * 2009-06-18 2019-03-01 罗姆股份有限公司 半导体装置
JPWO2011070739A1 (ja) * 2009-12-07 2013-04-22 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物、その硬化体及び半導体装置
DE102017121485A1 (de) * 2017-09-15 2019-03-21 Infineon Technologies Austria Ag Halbleitervorrichtung mit Kupferkorrosionsinhibitoren
DE102022115817A1 (de) 2022-06-24 2024-01-04 Infineon Technologies Ag Halbleiterpackage-Einkapselung mit metallaktivierten anorganischen Füllpartikeln

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1252601A (enExample) * 1968-02-14 1971-11-10
GB1549103A (en) * 1977-07-19 1979-08-01 Allied Chem Epoxy resin encapsulant compositions
GB2087159A (en) * 1980-11-08 1982-05-19 Plessey Co Ltd Plastics encapsulated electronic devices
GB2095268A (en) * 1981-01-05 1982-09-29 Western Electric Co Encapsulated electronic devices and encapsulating compositions
EP0120981A1 (en) * 1982-03-29 1984-10-10 Kabushiki Kaisha Toshiba Resin encapsulation type semiconductor device

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Publication number Priority date Publication date Assignee Title
DE2164100A1 (de) * 1971-12-23 1973-06-28 Semikron Gleichrichterbau Elektrisch isolierende einkapselungsmasse fuer halbleiteranordnungen
US4042550A (en) * 1975-11-28 1977-08-16 Allied Chemical Corporation Encapsulant compositions based on anhydride-hardened epoxy resins
US4111905A (en) * 1977-01-28 1978-09-05 M&T Chemicals Inc. Flame retarding agents and polymer compositions containing same
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
JPS58174434A (ja) * 1982-04-08 1983-10-13 Sumitomo Bakelite Co Ltd エポキシ樹脂系成形材料
JPS5933319A (ja) * 1982-08-20 1984-02-23 Shin Etsu Chem Co Ltd 難燃性エポキシ樹脂組成物
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
JPS6038847A (ja) * 1983-08-12 1985-02-28 Hitachi Ltd 樹脂封止半導体装置
JPS6080259A (ja) * 1983-10-07 1985-05-08 Hitachi Ltd 半導体装置
JPS6084322A (ja) * 1983-10-14 1985-05-13 Hitachi Ltd 半導体封止用樹脂組成物
JPS60190453A (ja) * 1984-03-13 1985-09-27 Toagosei Chem Ind Co Ltd 絶縁性保護材料
JPS6119625A (ja) * 1984-07-05 1986-01-28 Toshiba Corp 半導体封止用エポキシ樹脂組成物
JPS61110451A (ja) * 1984-11-02 1986-05-28 Nitto Electric Ind Co Ltd 半導体装置
JPS61166823A (ja) * 1985-01-19 1986-07-28 Toshiba Chem Corp 封止用樹脂組成物
JPS6234920A (ja) * 1985-08-07 1987-02-14 Toshiba Corp エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置
US4902732A (en) * 1985-09-30 1990-02-20 Shin-Etsu Chemical Co., Ltd. Epoxy resin-based curable compositions
JPS62150860A (ja) * 1985-12-25 1987-07-04 Hitachi Ltd 半導体装置
JPS62207319A (ja) * 1986-03-06 1987-09-11 Sumitomo Bakelite Co Ltd 難燃性エポキシ樹脂組成物の製造方法
JPS62285912A (ja) * 1986-06-04 1987-12-11 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0649817B2 (ja) * 1986-07-09 1994-06-29 住友ベ−クライト株式会社 半導体封止用エポキシ樹脂組成物
JPH0618985B2 (ja) * 1987-06-03 1994-03-16 信越化学工業株式会社 エポキシ樹脂組成物
JPH0648710B2 (ja) * 1987-08-03 1994-06-22 株式会社日立製作所 樹脂封止型半導体装置
US5008350A (en) * 1987-12-16 1991-04-16 Sumitomo Chemical Company, Limited Glycidyl ethers of phenolic compounds and process for producing the same
JP2660293B2 (ja) * 1988-06-30 1997-10-08 京セラ株式会社 電子部品封止用樹脂組成物
JP2640976B2 (ja) * 1988-12-28 1997-08-13 京セラ株式会社 電子部品封止用樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1252601A (enExample) * 1968-02-14 1971-11-10
GB1549103A (en) * 1977-07-19 1979-08-01 Allied Chem Epoxy resin encapsulant compositions
GB2087159A (en) * 1980-11-08 1982-05-19 Plessey Co Ltd Plastics encapsulated electronic devices
GB2095268A (en) * 1981-01-05 1982-09-29 Western Electric Co Encapsulated electronic devices and encapsulating compositions
EP0120981A1 (en) * 1982-03-29 1984-10-10 Kabushiki Kaisha Toshiba Resin encapsulation type semiconductor device

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7641963B2 (en) 2002-11-12 2010-01-05 Kronotec Ag Panel and process for producing a panel
US8257791B2 (en) 2002-11-12 2012-09-04 Kronotec Ag Process of manufacturing a wood fiberboard, in particular floor panels
US7431979B2 (en) 2002-11-12 2008-10-07 Kronotec Ag Wood fiberboard
US7617651B2 (en) 2002-11-12 2009-11-17 Kronotec Ag Floor panel
US7484337B2 (en) 2002-11-15 2009-02-03 Kronotec. Ag Floor panel and method of laying a floor panel
US9169658B2 (en) 2002-11-15 2015-10-27 Kronotec Ag Floor panel and method of laying a floor panel
US7651751B2 (en) 2003-02-14 2010-01-26 Kronotec Ag Building board
US7790293B2 (en) 2003-03-06 2010-09-07 Flooring Technologies Ltd. Process for finishing a wooden board and wooden board produced by the process
US7678425B2 (en) 2003-03-06 2010-03-16 Flooring Technologies Ltd. Process for finishing a wooden board and wooden board produced by the process
US8016969B2 (en) 2003-03-06 2011-09-13 Flooring Technologies Ltd. Process for finishing a wooden board and wooden board produced by the process
US7908816B2 (en) 2003-03-24 2011-03-22 Kronotec Ag Device for connecting building boards, especially floor panels
US8003168B2 (en) 2003-09-06 2011-08-23 Kronotec Ag Method for sealing a building panel
US8176698B2 (en) 2003-10-11 2012-05-15 Kronotec Ag Panel
US7506481B2 (en) 2003-12-17 2009-03-24 Kronotec Ag Building board for use in subfloors
US7562431B2 (en) 2004-01-30 2009-07-21 Flooring Technologies Ltd. Method for bringing in a strip forming a spring of a board
US7816001B2 (en) 2004-03-11 2010-10-19 Kronotec Ag Insulation board made of a mixture of wood base material and binding fibers
US7550202B2 (en) 2004-03-11 2009-06-23 Kronotec Ag Insulation board made of a mixture of wood base material and binding fibers
US7854986B2 (en) 2005-09-08 2010-12-21 Flooring Technologies Ltd. Building board and method for production
US8475871B2 (en) 2005-09-08 2013-07-02 Flooring Technologies Ltd. Building board and method for production
US7827749B2 (en) 2005-12-29 2010-11-09 Flooring Technologies Ltd. Panel and method of manufacture
US9816278B2 (en) 2005-12-29 2017-11-14 Flooring Technologies Ltd. Panel and method of manufacture
US7621092B2 (en) 2006-02-10 2009-11-24 Flooring Technologies Ltd. Device and method for locking two building boards
US9365028B2 (en) 2006-02-21 2016-06-14 Flooring Technologies Ltd. Method for finishing a building board and building board

Also Published As

Publication number Publication date
DE4036096C2 (enExample) 1993-08-12
DE4036096A1 (de) 1991-05-16
GB9024722D0 (en) 1991-01-02
US5093712A (en) 1992-03-03
GB2238660A (en) 1991-06-05
JPH03157448A (ja) 1991-07-05

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19960611

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20091114