JPH0246312B2 - - Google Patents

Info

Publication number
JPH0246312B2
JPH0246312B2 JP62053228A JP5322887A JPH0246312B2 JP H0246312 B2 JPH0246312 B2 JP H0246312B2 JP 62053228 A JP62053228 A JP 62053228A JP 5322887 A JP5322887 A JP 5322887A JP H0246312 B2 JPH0246312 B2 JP H0246312B2
Authority
JP
Japan
Prior art keywords
aluminum
alloy
thermal expansion
substrate
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62053228A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62263881A (ja
Inventor
Setsudo Maamoodo Isa
Shurotsutoku Gasutabu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS62263881A publication Critical patent/JPS62263881A/ja
Publication of JPH0246312B2 publication Critical patent/JPH0246312B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
JP62053228A 1986-05-01 1987-03-10 プリント回路基板の製造方法 Granted JPS62263881A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/857,870 US4750262A (en) 1986-05-01 1986-05-01 Method of fabricating a printed circuitry substrate
US857870 1986-05-01

Publications (2)

Publication Number Publication Date
JPS62263881A JPS62263881A (ja) 1987-11-16
JPH0246312B2 true JPH0246312B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-10-15

Family

ID=25326904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62053228A Granted JPS62263881A (ja) 1986-05-01 1987-03-10 プリント回路基板の製造方法

Country Status (4)

Country Link
US (1) US4750262A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0243709B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS62263881A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3770985D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4025373A1 (de) * 1990-03-28 1991-10-02 Licentia Gmbh Verfahren zum herstellen einer reflexionsarmen leuchtstoffschicht
AUPQ605900A0 (en) * 2000-03-06 2000-03-30 Silverbrook Research Pty Ltd Thermal expansion compensation for printhead assemblies
US8198540B2 (en) * 2006-06-06 2012-06-12 Mitsubishi Materials Corporation Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power module
WO2010070390A1 (en) * 2008-12-16 2010-06-24 Freescale Semiconductor, Inc. High power semiconductor device for wireless applictions and method of forming a high power semiconductor device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices
IT1002973B (it) * 1973-02-21 1976-05-20 Sumitomo Bakelite Co Laminati placcati di metallo fles sibili e metodo per produrli
JPS5075554A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-11-08 1975-06-20
JPS5871645A (ja) * 1981-10-23 1983-04-28 Sumitomo Electric Ind Ltd ＩＣリ−ドフレ−ム用Ａｌクラツド板及びその製造法
JPS5896758A (ja) * 1981-12-03 1983-06-08 Daido Steel Co Ltd クラツド板の製造方法
JPS58179582A (ja) * 1982-04-13 1983-10-20 Nippon Steel Corp アルミニウム被覆鋼板の製造法
JPS591078A (ja) * 1982-06-25 1984-01-06 Daido Steel Co Ltd クラツド帯の製造方法
GB2122650B (en) * 1982-06-28 1986-02-05 Nisshin Steel Co Ltd Aluminum coated sheet and process for producing the same
JPS597489A (ja) * 1982-07-07 1984-01-14 Daido Steel Co Ltd クラツド帯の製造方法
JPS5925257A (ja) * 1982-07-30 1984-02-09 Shinko Electric Ind Co Ltd 低融点ガラス封止型半導体装置用リ−ドフレ−ムの製造方法
US4649083A (en) * 1983-02-17 1987-03-10 Olin Corporation Electrical component forming process
US4500605A (en) * 1983-02-17 1985-02-19 Olin Corporation Electrical component forming process
JPS6059758A (ja) * 1983-09-13 1985-04-06 Nec Corp 半導体装置の製造方法
JPS6068797A (ja) * 1983-09-26 1985-04-19 Toshiba Corp 音響部品
JPS60170287A (ja) * 1984-02-14 1985-09-03 信越化学工業株式会社 銅張積層基板
JPS60177979A (ja) * 1984-02-21 1985-09-11 Hitachi Cable Ltd Ｆｅ−Νｉ合金帯上へのＡｌ薄帯のロ−ル圧接方法
JPS60211966A (ja) * 1984-04-06 1985-10-24 Sumitomo Electric Ind Ltd リ−ドフレ−ム素材の製造方法
US4542259A (en) * 1984-09-19 1985-09-17 Olin Corporation High density packages
DE3501372A1 (de) * 1985-01-17 1986-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Substrat fuer leiterplatten

Also Published As

Publication number Publication date
JPS62263881A (ja) 1987-11-16
DE3770985D1 (de) 1991-08-01
EP0243709B1 (en) 1991-06-26
EP0243709A1 (en) 1987-11-04
US4750262A (en) 1988-06-14

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