JPH0216006B2 - - Google Patents

Info

Publication number
JPH0216006B2
JPH0216006B2 JP59109475A JP10947584A JPH0216006B2 JP H0216006 B2 JPH0216006 B2 JP H0216006B2 JP 59109475 A JP59109475 A JP 59109475A JP 10947584 A JP10947584 A JP 10947584A JP H0216006 B2 JPH0216006 B2 JP H0216006B2
Authority
JP
Japan
Prior art keywords
wafer
basket
drying
gas
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59109475A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60254620A (ja
Inventor
Masanori Kobayashi
Kunihiko Wada
Hitoshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59109475A priority Critical patent/JPS60254620A/ja
Publication of JPS60254620A publication Critical patent/JPS60254620A/ja
Publication of JPH0216006B2 publication Critical patent/JPH0216006B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP59109475A 1984-05-31 1984-05-31 ウエハーの乾燥方法および装置 Granted JPS60254620A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59109475A JPS60254620A (ja) 1984-05-31 1984-05-31 ウエハーの乾燥方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59109475A JPS60254620A (ja) 1984-05-31 1984-05-31 ウエハーの乾燥方法および装置

Publications (2)

Publication Number Publication Date
JPS60254620A JPS60254620A (ja) 1985-12-16
JPH0216006B2 true JPH0216006B2 (enExample) 1990-04-13

Family

ID=14511175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59109475A Granted JPS60254620A (ja) 1984-05-31 1984-05-31 ウエハーの乾燥方法および装置

Country Status (1)

Country Link
JP (1) JPS60254620A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0695512B2 (ja) * 1986-09-10 1994-11-24 株式会社芝浦製作所 熱風発生装置
JP2528111Y2 (ja) * 1991-12-04 1997-03-05 大日本スクリーン製造株式会社 ウエハ保持ホルダ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756930A (en) * 1980-09-22 1982-04-05 Mitsubishi Electric Corp Wafer washing and drying device

Also Published As

Publication number Publication date
JPS60254620A (ja) 1985-12-16

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