JPS5756930A - Wafer washing and drying device - Google Patents

Wafer washing and drying device

Info

Publication number
JPS5756930A
JPS5756930A JP13199280A JP13199280A JPS5756930A JP S5756930 A JPS5756930 A JP S5756930A JP 13199280 A JP13199280 A JP 13199280A JP 13199280 A JP13199280 A JP 13199280A JP S5756930 A JPS5756930 A JP S5756930A
Authority
JP
Japan
Prior art keywords
wafer
carrier
arm
moved
adherence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13199280A
Other languages
Japanese (ja)
Other versions
JPS6317224B2 (en
Inventor
Mikio Nishihata
Katsumi Minazu
Kazuo Horie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13199280A priority Critical patent/JPS5756930A/en
Publication of JPS5756930A publication Critical patent/JPS5756930A/en
Publication of JPS6317224B2 publication Critical patent/JPS6317224B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

PURPOSE:To remarkably improve the cleanness of a wafer by mounting the wafer vertically on a carrier, conveying it from a washing tank to a clean bench and blowing laminar flow vertically thereto. CONSTITUTION:After an Si wafer 15 is lightly etched while mounting on a carrier 14 and is washed, it is dipped in a hot water washing tank 22. The arm 30 of a robot 24 is moved, a holder 3 is opened, the arm 30 is lowered, the holder is then closed, and the carrier 14 is hung up. The arm 30 is moved, and is conveyed to a clean bench 17. Dust having a size of larger than 0.3mum are removed by more than 99.7% from the air, which is blow as vertical laminar flow through filters 19, 18. Hot air having less than 20% of moisture is used. When the carrier 14 is moved to the bench 17, a gear 34 of droplet absorbing cylinder body 26 is driven to contact the absorbing cylinder 32 with the wafer 15 thus driven. The cylinder 32 absorbs by vacuum the droplets through a pipe 25. According to this structure, since no rotary motion is employed at the drying time, no adherence of dusts due to turbulent flow occurs, no water flying trace is produced, and the adherence of dusts due to static electricity can be prevented.
JP13199280A 1980-09-22 1980-09-22 Wafer washing and drying device Granted JPS5756930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13199280A JPS5756930A (en) 1980-09-22 1980-09-22 Wafer washing and drying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13199280A JPS5756930A (en) 1980-09-22 1980-09-22 Wafer washing and drying device

Publications (2)

Publication Number Publication Date
JPS5756930A true JPS5756930A (en) 1982-04-05
JPS6317224B2 JPS6317224B2 (en) 1988-04-13

Family

ID=15071017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13199280A Granted JPS5756930A (en) 1980-09-22 1980-09-22 Wafer washing and drying device

Country Status (1)

Country Link
JP (1) JPS5756930A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129374A (en) * 1983-01-17 1984-07-25 株式会社日立製作所 Washing drier
JPS59215729A (en) * 1983-05-21 1984-12-05 Ulvac Corp Cleaning method of substrate for semiconductor or magnetic recording medium, etc. and device therefor
JPS60223130A (en) * 1984-04-19 1985-11-07 Sharp Corp Method and apparatus for washing and drying substrate for semiconductor
JPS60254620A (en) * 1984-05-31 1985-12-16 Fujitsu Ltd Drying method and apparatus of wafer
JPS6143430A (en) * 1984-08-07 1986-03-03 Mitsubishi Electric Corp Cassette cleaner
JPS61170034A (en) * 1985-01-23 1986-07-31 Hitachi Ltd Cleaning device
JPS62293617A (en) * 1986-06-13 1987-12-21 Oki Electric Ind Co Ltd Wafer centrifugal drying device
JPH01130771A (en) * 1987-10-05 1989-05-23 Nukem Gmbh Method and apparatus for washing process
USRE37627E1 (en) 1986-06-12 2002-04-09 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
JP2014103274A (en) * 2012-11-20 2014-06-05 Shindengen Electric Mfg Co Ltd Resist developing device, resist developing method and method for manufacturing semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831886U (en) * 1971-08-21 1973-04-18
JPS5389671A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Continuous treating apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4831886U (en) * 1971-08-21 1973-04-18
JPS5389671A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Continuous treating apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH052914B2 (en) * 1983-01-17 1993-01-13 Hitachi Ltd
JPS59129374A (en) * 1983-01-17 1984-07-25 株式会社日立製作所 Washing drier
JPH0129054B2 (en) * 1983-05-21 1989-06-07 Ulvac Corp
JPS59215729A (en) * 1983-05-21 1984-12-05 Ulvac Corp Cleaning method of substrate for semiconductor or magnetic recording medium, etc. and device therefor
JPS60223130A (en) * 1984-04-19 1985-11-07 Sharp Corp Method and apparatus for washing and drying substrate for semiconductor
JPH0458686B2 (en) * 1984-04-19 1992-09-18 Shaapu Kk
JPH0216006B2 (en) * 1984-05-31 1990-04-13 Fujitsu Ltd
JPS60254620A (en) * 1984-05-31 1985-12-16 Fujitsu Ltd Drying method and apparatus of wafer
JPS6143430A (en) * 1984-08-07 1986-03-03 Mitsubishi Electric Corp Cassette cleaner
JPS61170034A (en) * 1985-01-23 1986-07-31 Hitachi Ltd Cleaning device
USRE37627E1 (en) 1986-06-12 2002-04-09 Oki Electric Industry Co., Ltd. Wafer centrifugal drying apparatus
JPS62293617A (en) * 1986-06-13 1987-12-21 Oki Electric Ind Co Ltd Wafer centrifugal drying device
JPH01130771A (en) * 1987-10-05 1989-05-23 Nukem Gmbh Method and apparatus for washing process
JP2014103274A (en) * 2012-11-20 2014-06-05 Shindengen Electric Mfg Co Ltd Resist developing device, resist developing method and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS6317224B2 (en) 1988-04-13

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