JPS60223130A - Method and apparatus for washing and drying substrate for semiconductor - Google Patents

Abstract

PURPOSE:To wipe off a treating liquid and a washing liquid in a preprocess adhering on a substrate for a semiconductor positively, and to prevent the generation of dust on drying by pulling up the semiconductor substrate at slow speed from the washing liquid while being slightly rocked and making dried air to collide against the substrate. CONSTITUTION:Semiconductor substrates 20 are set to a carrier 21, a motor for a rest 7 is driven, the carrier 21 is lowered in a washing liquid tank 25, and a movable base 8 is descended until the semiconductor substrates 20 are dipped uniformly in a washing liquid. The carrier 21 is pulled up at slow speed from the washing liquid and extracted while reciprocating the substrate 20 for the semiconductor by rocking a rocking bar 12 being in contact with said substrate 20 for the semiconductor, dried air from a blower 31 is made to collide against the substrate when being pulled up, and the washing liquid is wiped off.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention utilizes the surface tension of the cleaning solution used when cleaning and drying silicon semiconductors, glass masks, etc. (hereinafter referred to as semiconductor substrates). The present invention relates to an effective method and apparatus for wiping off cleaning liquid pipes adhering to semiconductor substrates.

Conventionally, in order to finish processed semiconductor substrates by chemically treating them, and then washing and drying them, the wafer supported on a carrier is passed through a high-speed rotating device K, and the wafer is washed and dried using centrifugal force. It is. however,
This method prevents chips generated from the rotating shaft of rotating equipment from adhering to the semiconductor substrate during rotation, adjacent semiconductor substrates coming into contact with each other during rotation and causing chipping, or chips from other semiconductor substrates. The problem was that the product adhered to the surface and caused stains, resulting in poor product yield.

Therefore, an object of the present invention is to immerse a semiconductor substrate in a cleaning solution, then lift it out of the cleaning solution at a very low speed while shaking the semiconductor substrate slightly, and at the same time remove the drying air. , by effectively utilizing the surface tension of the cleaning solution, it reliably wipes away the processing solution and cleaning solution from the previous process adhering to the semiconductor substrate, eliminating any debris during drying and eliminating chipping on the semiconductor substrate. It is an object of the present invention to provide a method for cleaning and drying a semiconductor substrate and an apparatus therefor, which can perform cleaning and drying without causing any problems, and has an extremely high yield.

The present invention will be explained below along with examples.

1 and 2, a device 1 according to the present invention includes a base 2 and four columns 3 whose base ends are fixed to the base 2.
．． 4.5 (the other one is not shown), and a pedestal 7 supported and fixed to the upper end of the column. Further, a movable table 8 is provided between the base 2 and the main table 7, and is guided by the four pillars and can be freely raised and lowered by a height L.

Of these, a round bar rack 9 is disposed approximately at the center of the movable base 8, and a motor disposed on the large base 7 is driven to engage a pinion 10 with the rack 9. This movable table 8 can be freely raised and lowered. Further, on the front side of this movable table 8, there is a carrier 21 carrying a semiconductor substrate 20.
A holding means 11 that moves the semiconductor substrate 20 while holding it in contact with the lower end of the semiconductor substrate 20,
A swing means 15 for slightly swinging in the -X direction is provided (see FIG. 4).

The clamping means 11 has a 1 member that clamps the carrier 21 at its tip.
A pair of L-shaped clamping rods 12, 12, and the clamping rods 12゜1
an opening/closing power 13 for opening and closing 2, and the clamping rod 12°1.
It is composed of mounting plates 14 and 14 to which the base end portions of two are fixed.

Therefore, due to the opening/closing power 13, the mounting plate 14°1
4 in the Y-Y direction to move the pair of clamping rods 1.
It is possible to adjust the spacing between 2 and 12.

For this reason, depending on the carrier 21 used, the clamping rod 12゜
Intervals of I+12 can be selected.

Further, the swinging means 15 includes a swinging rod 16 disposed approximately in the middle of the clamping rods 12 and substantially parallel to the clamping rods 12 , 12 , and a swinging rod 16 disposed in a position substantially parallel to the clamping rods 12 , 12 , and A first driving means 1 that applies a swinging force in the X-X direction at
7, and a second driving means 18 for moving this swing rod 16 in the z-2 direction. Of these, the swing rod 16 is bent into an inverted U-shape as shown in FIG. 4, and an inverted T-shaped plate member 19 is attached to its free end.

Thus, the plate member 19 of the hip movement rod 16 is moved to the second position.
The first drive means 17 is operated to bring the semiconductor substrate 20 into contact with the lower end of the semiconductor substrate 20 in the carrier 21 held by the clamping rods 12, 12, and then the first drive means 17 is operated to swing the semiconductor substrate 20. By swinging the rod 16, it is possible to swing the carrier 21 slightly in the XX direction.

30 is a means for sending clean dry air; 6;
1 is a blower, 32 is a filter, and 33 is a heater.

Next, the washing and drying method will be explained with reference to FIGS. 1 to 3. First, the movable base 8 of the device 1 is placed in the state shown in FIG. 3, and the opening/closing power 13 of the clamping means 11 is driven to adjust the clamping rod 12,
12 (see Figure 3). Next, the flanges formed on the upper lines of both side walls of the carrier 210 supporting the semiconductor substrate 20 are clamped by the clamping rods 12 12 , and then the second driving means 18 of the swinging means 15 is operated to move the swinging rod 16 is brought into contact with the lower end of the semiconductor substrate 20. After setting in this state, the motor of the stand 7 is driven to lower the carrier 21 into the cleaning liquid tank 25, and the semiconductor substrate 2 is lowered into the cleaning liquid tank 25.
The movable table 8 is lowered until the 0 is uniformly immersed in the cleaning liquid. Subsequently, the swinging rod 1 that is in contact with the semiconductor substrate 20
By swinging the semiconductor substrate 2 (to the extent that it makes one reciprocation over a distance of 2 seconds in 2 seconds), the semiconductor substrate 20 is slightly reciprocated in the XX direction in FIG. While giving such a motion,
When the carrier 21 is pulled up from the cleaning liquid at a very slow speed (about ltyn/min) and taken out, a dry air is applied to it when it is pulled up to wipe away the cleaning liquid, and the carrier 21 returns to its original state as shown in Fig. 3. The cleaning and drying of the semiconductor substrate 20 is completed. Note that fII between the carrier 21 and the semiconductor substrate 20
The cleaning liquid accumulated in the IK drips onto the carrier 21 while the semiconductor substrate 20 is rocked at a slow speed and reciprocated.

According to the present invention having the above-described structure and operation, it is possible to dry while effectively utilizing the surface tension of the cleaning solution, and the finished semiconductor substrate is clean because no waste is generated during cleaning and drying. Additionally, since chipping does not occur on the semiconductor substrate, the yield of semiconductor substrates after washing and drying is high, and the high quality of products equipped with integrated circuits can be maintained.

[Brief explanation of the drawing]

Fig. 1 is a side view showing an example of the use of the device according to the present invention;
The figure is a front view showing the main parts thereof, FIG. 3 is a front view showing the state in which the movable base of the device according to the present invention has been moved upward, and FIG. 4 is a clamping rod that constitutes the clamping means of the device according to the present invention. FIG. 2 is a perspective view showing a swinging rod constituting the swinging means. Figure 1 Figure 3 Figure 4 Procedural Amendment Written October 12, 1939, Manabu Shiga, Commissioner of the Japan Patent Office1, Indication of the case, Patent Application No. 1987-775162, Title of the invention: Method for cleaning and drying semiconductor substrates and its device 3. Relationship with the case of the person making the amendment Patent applicant address: 22-22 Nagaike-cho, Abeno-ku, Osaka City Name: Sharp Corporation Representative: Asahi Saeki (and one other person) 4. Agent 5: Amendment order Date ■ Column for detailed description of the invention ■ Column for brief explanation of drawings - (2) Regarding drawing 7, content of amendment (1) Regarding ■ 1) 8A thin tube, line 5, 9th line, "return motion"" is corrected to "oscillation." 1) Correct "swing rod 16" on the 7th line of page 6 and "swing rod 12" on the 12th line of the same page to read "plate member 19". 1) Insert the following sentence between the 3rd and 4th lines of page 7. Modifications of the plate member constituting the swinging means 15 to be used are described below based on FIG. 5 and the sixth factor.
i5i! I will clarify. As shown in FIG. 5, the plate member 5o of this modification has a groove in the longitudinal direction on the contact surface 52 with the semiconductor substrate, and this groove 54 communicates with a cavity 56 formed inside the plate member 5o. are doing. As shown in the sixth figure, a semiconductor substrate 2 is placed on the top surface of the plate member 5D having such a structure.
When the semiconductor substrate 20 is pulled up from the cleaning liquid 58 while bringing the lower surface of υ into contact and vibrating the plate member 50, the cleaning liquid remaining on the lower surface of the semiconductor substrate 20 passes through the groove 54 and into the cavity due to capillary action. Therefore, the drying effect of the semiconductor substrate 20 is promoted. Regarding (1) Page 7, lines 16 and 17 of the specification: ``A perspective view showing the stage and the swinging means, FIG. Fig. 6 is a sectional view showing a state in which the plate member shown in Fig. 5 is dried while being in contact with a semiconductor substrate.J is corrected. (2) Regarding #C, Figs. 5 and -6 Add as shown in the attached sheet.

Claims (1)

[Claims] 1. When cleaning and drying a semiconductor substrate such as a wafer or a mask supported on a carrier, the carrier is lowered to immerse the semiconductor substrate in a cleaning solution, and then the semiconductor substrate is immersed in a cleaning solution. While the semiconductor substrate is oscillated by a swing rod that contacts the semiconductor substrate, the carrier is pulled up from the cleaning liquid at a slow speed, and at this time, drying air is applied to wipe away the cleaning liquid. Method for cleaning and drying substrates. 2. A cleaning and drying device for semiconductor substrates such as wafers and masks, comprising the following elements: a. A holding means for holding a carrier carrying a semiconductor substrate is provided. b. A swinging means is provided which is in contact with the semiconductor substrate and swings the semiconductor substrate. C4: A movable platform is provided that supports the clamping means and the swinging means and is movable up and down while being guided by pillars erected on the base.