JPS55128834A - Method of ultrasonically cleaning semiconductor wafer - Google Patents

Method of ultrasonically cleaning semiconductor wafer

Info

Publication number
JPS55128834A
JPS55128834A JP3648579A JP3648579A JPS55128834A JP S55128834 A JPS55128834 A JP S55128834A JP 3648579 A JP3648579 A JP 3648579A JP 3648579 A JP3648579 A JP 3648579A JP S55128834 A JPS55128834 A JP S55128834A
Authority
JP
Japan
Prior art keywords
wafers
cleaning
tank
semiconductor wafer
elevationally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3648579A
Other languages
Japanese (ja)
Inventor
Nobuyuki Yamamichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3648579A priority Critical patent/JPS55128834A/en
Publication of JPS55128834A publication Critical patent/JPS55128834A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve the cleaning capacity of a method of ultrasonically cleaning a semiconductor wafer by dipping a plurality of wafers in an ultrasonic cleaning tank, mounting the wafers while disposing the wafers in parallel with liquid surface and elevationally vibrating the wafers when cleaning the wafers.
CONSTITUTION: An ultrasonic cleaning tank 3 of vertical shape is partitioned laterally at the intermediate portion thereof, a cleaning solution 7 is filled in the upper portion of the tank 3, and an ultrasonic vibrator 1 is arranged in the lower portion of the tank 3. A semiconductor wafer mounting jig 9 hung by an elevationally moving mechanism 6 is dipped in the solution 7 next. When a plurality of semiconductor wafers 2 contained in the jig 9 are elevationally vibrated, the wafers 2 are so arranged as to become on the surfaces in parallel with the liquid surface at an interval therebetween. Thus, standing ultrasonic wave 8 of equal intensity is transmitted to the surfaces to be cleaned of the wafers so as to effectively separate substances adhered onto the surfaces of the wafers 2.
COPYRIGHT: (C)1980,JPO&Japio
JP3648579A 1979-03-28 1979-03-28 Method of ultrasonically cleaning semiconductor wafer Pending JPS55128834A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3648579A JPS55128834A (en) 1979-03-28 1979-03-28 Method of ultrasonically cleaning semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3648579A JPS55128834A (en) 1979-03-28 1979-03-28 Method of ultrasonically cleaning semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS55128834A true JPS55128834A (en) 1980-10-06

Family

ID=12471115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3648579A Pending JPS55128834A (en) 1979-03-28 1979-03-28 Method of ultrasonically cleaning semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS55128834A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158440U (en) * 1982-04-16 1983-10-22 沖電気工業株式会社 Wafer cleaning equipment
US4514232A (en) * 1982-12-15 1985-04-30 International Business Machines Corporation Process for stripping silicon oil base thermal grease
JPS6079588U (en) * 1983-11-08 1985-06-03 海上電機株式会社 Vibration feedback type ultrasonic cleaning device
JPS6143430A (en) * 1984-08-07 1986-03-03 Mitsubishi Electric Corp Cassette cleaner
US4643774A (en) * 1984-04-19 1987-02-17 Sharp Corporation Method of washing and drying substrates

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158440U (en) * 1982-04-16 1983-10-22 沖電気工業株式会社 Wafer cleaning equipment
US4514232A (en) * 1982-12-15 1985-04-30 International Business Machines Corporation Process for stripping silicon oil base thermal grease
JPS6079588U (en) * 1983-11-08 1985-06-03 海上電機株式会社 Vibration feedback type ultrasonic cleaning device
JPS6242796Y2 (en) * 1983-11-08 1987-11-02
US4643774A (en) * 1984-04-19 1987-02-17 Sharp Corporation Method of washing and drying substrates
US4714086A (en) * 1984-04-19 1987-12-22 Sharp Corporation Apparatus for washing and drying substrates
JPS6143430A (en) * 1984-08-07 1986-03-03 Mitsubishi Electric Corp Cassette cleaner

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