JPH02110962A - 半導体モジュールおよびその製造方法 - Google Patents

半導体モジュールおよびその製造方法

Info

Publication number
JPH02110962A
JPH02110962A JP22565089A JP22565089A JPH02110962A JP H02110962 A JPH02110962 A JP H02110962A JP 22565089 A JP22565089 A JP 22565089A JP 22565089 A JP22565089 A JP 22565089A JP H02110962 A JPH02110962 A JP H02110962A
Authority
JP
Japan
Prior art keywords
terminal
sub
electrode terminal
electrode
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22565089A
Other languages
English (en)
Japanese (ja)
Other versions
JPH05863B2 (cg-RX-API-DMAC7.html
Inventor
Masaru Ando
勝 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22565089A priority Critical patent/JPH02110962A/ja
Publication of JPH02110962A publication Critical patent/JPH02110962A/ja
Publication of JPH05863B2 publication Critical patent/JPH05863B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP22565089A 1989-08-31 1989-08-31 半導体モジュールおよびその製造方法 Granted JPH02110962A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22565089A JPH02110962A (ja) 1989-08-31 1989-08-31 半導体モジュールおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22565089A JPH02110962A (ja) 1989-08-31 1989-08-31 半導体モジュールおよびその製造方法

Publications (2)

Publication Number Publication Date
JPH02110962A true JPH02110962A (ja) 1990-04-24
JPH05863B2 JPH05863B2 (cg-RX-API-DMAC7.html) 1993-01-06

Family

ID=16832623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22565089A Granted JPH02110962A (ja) 1989-08-31 1989-08-31 半導体モジュールおよびその製造方法

Country Status (1)

Country Link
JP (1) JPH02110962A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959642A (en) * 1995-04-07 1999-09-28 Seiko Epson Corporation Printer having a shock absorber for a printer motor
DE10129006A1 (de) * 2001-06-15 2003-01-02 Conti Temic Microelectronic Elektronische Baugruppe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959642A (en) * 1995-04-07 1999-09-28 Seiko Epson Corporation Printer having a shock absorber for a printer motor
DE10129006A1 (de) * 2001-06-15 2003-01-02 Conti Temic Microelectronic Elektronische Baugruppe
DE10129006B4 (de) * 2001-06-15 2009-07-30 Conti Temic Microelectronic Gmbh Elektronische Baugruppe

Also Published As

Publication number Publication date
JPH05863B2 (cg-RX-API-DMAC7.html) 1993-01-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term