JP3994095B2 - 面実装型電子部品 - Google Patents
面実装型電子部品 Download PDFInfo
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- JP3994095B2 JP3994095B2 JP2004185467A JP2004185467A JP3994095B2 JP 3994095 B2 JP3994095 B2 JP 3994095B2 JP 2004185467 A JP2004185467 A JP 2004185467A JP 2004185467 A JP2004185467 A JP 2004185467A JP 3994095 B2 JP3994095 B2 JP 3994095B2
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- Prior art keywords
- lead terminal
- lead
- package body
- bonding
- lead terminals
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- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000005476 soldering Methods 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- 239000000057 synthetic resin Substances 0.000 claims description 10
- 230000000630 rising effect Effects 0.000 claims description 5
- 239000004033 plastic Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Description
,前記両実装面9′,10′における面積が減少することになる。
「一組を構成する第1リード端子及び第2リード端子と,前記第1リード端子の先端に一体に設けたアイランド部の上面にダイボンディングした半導体素子と,この半導体素子と前記第2リード端子の先端に一体に設けたボンディング部の上面とを電気的に接続する金属線と,前記アイランド部及び前記ボンディング部の部分を密封する合成樹脂製のパッケージ体から成る電子部品において,
前記第1リード端子におけるアイランド部,及び前記第2リード端子におけるボンディング部を,その各々におけるリード端子のうち前記パッケージ体内の部分を当該アイランド部及びボンディング部の上面をリード端子の上面と同一平面にした状態でその下面側からの厚さを薄くて幅を広くする塑性変形にて形成する一方,前記第1リード端子及び第2リード端子の下面のうち前記塑性変形していない部分を,前記パッケージ体の下面に半田付け用実装面として露出し,更に,前記各半田付け用実装面のうち前記パッケージ体の側面より内側端の部分を,実装面とこれから前記アイランド部及びボンディング部に立ち上がる側面とが交わる隅角部を角張った形状にしたままで,前記パッケージ体の底面視において半円形に形成する。」
ことを特徴としている。
,前記半田付け用実装面におけるパッケージ体の側面からの内側への入り込み寸法を,前記各リード端子のアイランド部及びボンディング部の上面において半導体素子のダイボンディングと金属線のワイヤボンディングとを行う領域の広さとは無関係に,換言すると,前記アイランド部及びボンディング部の上面における領域の広さを狭めることなく,大きくすることができる。
前記した塑性変形に際しては,前記各リード端子2a,2b,3a,3b,3c,3dの下面における各実装面9a,9b,10a,10b,10c,10dのうち前記パッケージ体8における左右両側面8a,8bより内側端の部分を,当該各実装面とこれから前記アイランド部4a,4b及びボンディング部5a,5b,5c,5dの下面に向かって立ち上がる側面11とが交わる隅角部12を丸みの少ない角張った形状にするとともに,前記パッケージ体8の底面視(図4)において半円形に形成するように構成する。
a,10b,10c,10dの形成に,上面をアイランド部4a,4b及びボンディング部5a,5b,5c,5dの形成に各々分けることができるから,前記各半田付け用実装面におけるパッケージ体8の側面8a,8bからの内側への入り込み寸法Aを,前記各リード端子のアイランド部4a,4b及びボンディング部5a,5b,5c,5dの上面において半導体素子6a,6bのダイボンディングと金属線7a,7b,7c,7dのワイヤボンディングとを行う領域の広さを狭めることなく,大きくすることができるから,前記各リード端子におけるアイランド部4a,4b及びボンディング部5a,5b,5c,5dに,半導体素子6a,6bのダイボンディング及び金属線7a,7b,7c,7dのワイヤボンディングを行うことに十分な広さの領域を確保することと,前記各リード端子の下面における実装面9a,9b,10a,10b,10c,10dに,半田付けに際して十分な半田付け面積を確保することとを,前記パッケージ体8における幅寸法W及び前記各リード端子におけるパッケージ体側面8a,8bからの突出寸法Lのうちいずれか一方又は両方を大きくすることなく,同時に確実に達成できる。
2a,2b 第1リード端子
3a,3b,3c,3d 第2リード端子
4a,4b アイランド部
5a,5b,5c,5d ボンディング部
6a,6b 半導体素子
7a,7b,7c,7d 金属線
8 パッケージ体
8a,8b パッケージ体の側面
8c パッケージ体の下面
9a,9b 実装面
10a,10b,10c,10d 実装面
13 リードフレーム
14,15 抜き孔
16 補助抜き孔
Claims (1)
- 一組を構成する第1リード端子及び第2リード端子と,前記第1リード端子の先端に一体に設けたアイランド部の上面にダイボンディングした半導体素子と,この半導体素子と前記第2リード端子の先端に一体に設けたボンディング部の上面とを電気的に接続する金属線と,前記アイランド部及び前記ボンディング部の部分を密封する合成樹脂製のパッケージ体から成る電子部品において,
前記第1リード端子におけるアイランド部,及び前記第2リード端子におけるボンディング部を,その各々におけるリード端子のうち前記パッケージ体内の部分を当該アイランド部及びボンディング部の上面をリード端子の上面と同一平面にした状態でその下面側からの厚さを薄くて幅を広くする塑性変形にて形成する一方,前記第1リード端子及び第2リード端子の下面のうち前記塑性変形していない部分を,前記パッケージ体の下面に半田付け用実装面として露出し,更に,前記各半田付け用実装面のうち前記パッケージ体の側面より内側端の部分を,実装面とこれから前記アイランド部及びボンディング部に立ち上がる側面とが交わる隅角部を角張った形状にしたままで,前記パッケージ体の底面視において半円形に形成することを特徴とする面実装型電子部品。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004185467A JP3994095B2 (ja) | 2004-06-23 | 2004-06-23 | 面実装型電子部品 |
CNB2005800008638A CN100514614C (zh) | 2004-06-23 | 2005-05-12 | 面装配型电子部件及其制造方法 |
PCT/JP2005/008714 WO2006001130A1 (ja) | 2004-06-23 | 2005-05-12 | 面実装型電子部品及びその製造方法 |
US11/630,823 US7456494B2 (en) | 2004-06-23 | 2005-05-12 | Surface mount electronic component and process for manufacturing same |
KR1020057015540A KR101156520B1 (ko) | 2004-06-23 | 2005-05-12 | 면실장형 전자부품 및 그 제조방법 |
TW094116594A TWI349986B (en) | 2004-06-23 | 2005-05-20 | Surface mounted electronic component and manufacturing method therefor |
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US (1) | US7456494B2 (ja) |
JP (1) | JP3994095B2 (ja) |
KR (1) | KR101156520B1 (ja) |
CN (1) | CN100514614C (ja) |
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KR100844630B1 (ko) | 2006-03-29 | 2008-07-07 | 산요덴키가부시키가이샤 | 반도체 장치 |
DE102007050608A1 (de) * | 2007-10-23 | 2009-04-30 | Infineon Technologies Ag | Gehäuse für einen Halbleiter-Chip |
JP5416975B2 (ja) * | 2008-03-11 | 2014-02-12 | ローム株式会社 | 半導体発光装置 |
US8319114B2 (en) * | 2008-04-02 | 2012-11-27 | Densel Lambda K.K. | Surface mount power module dual footprint |
JP2010056372A (ja) | 2008-08-29 | 2010-03-11 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置とその製造方法 |
KR101113518B1 (ko) * | 2009-11-18 | 2012-02-29 | 삼성전기주식회사 | 리드 프레임 |
US20110163432A1 (en) * | 2009-11-26 | 2011-07-07 | Panasonic Corporation | Semiconductor device and method of manufacturing the same |
JP5959255B2 (ja) * | 2012-03-22 | 2016-08-02 | エスアイアイ・セミコンダクタ株式会社 | 半導体装置 |
US8809119B1 (en) * | 2013-05-17 | 2014-08-19 | Stats Chippac Ltd. | Integrated circuit packaging system with plated leads and method of manufacture thereof |
CN105206534B (zh) * | 2014-06-19 | 2019-06-07 | 先进科技新加坡有限公司 | 引线框架及其形成方法、芯片封装方法 |
US9666509B2 (en) * | 2015-01-16 | 2017-05-30 | New Japan Radio Co., Ltd. | Semiconductor device |
JP6840466B2 (ja) * | 2016-03-08 | 2021-03-10 | 株式会社アムコー・テクノロジー・ジャパン | 半導体パッケージ及び半導体パッケージの製造方法 |
CN107799498A (zh) * | 2016-09-06 | 2018-03-13 | 精工半导体有限公司 | 半导体装置的制造方法 |
JP2018041956A (ja) * | 2016-09-06 | 2018-03-15 | エイブリック株式会社 | 半導体装置の製造方法 |
JP7381168B2 (ja) * | 2019-12-09 | 2023-11-15 | 日清紡マイクロデバイス株式会社 | 半導体装置の設計方法 |
CN111983856A (zh) | 2020-08-10 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | 液晶显示面板和液晶显示装置 |
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JPH01106456A (ja) | 1987-10-19 | 1989-04-24 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
JPH0821670B2 (ja) | 1990-02-27 | 1996-03-04 | ローム株式会社 | 合成樹脂封止型電子部品 |
US5977613A (en) | 1996-03-07 | 1999-11-02 | Matsushita Electronics Corporation | Electronic component, method for making the same, and lead frame and mold assembly for use therein |
JP3209696B2 (ja) * | 1996-03-07 | 2001-09-17 | 松下電器産業株式会社 | 電子部品の製造方法 |
EP1207554A4 (en) * | 1999-07-02 | 2008-07-02 | Rohm Co Ltd | ELECTRONIC COMPONENT |
US6550666B2 (en) * | 2001-08-21 | 2003-04-22 | Advanpack Solutions Pte Ltd | Method for forming a flip chip on leadframe semiconductor package |
JP2003258183A (ja) * | 2002-03-04 | 2003-09-12 | Shinko Electric Ind Co Ltd | リードフレームの製造方法 |
JP2004296886A (ja) * | 2003-03-27 | 2004-10-21 | Shinko Electric Ind Co Ltd | リードフレームのダウンセット加工装置およびダウンセット加工方法、ならびにリードフレーム |
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US20080191328A1 (en) | 2008-08-14 |
KR20070027425A (ko) | 2007-03-09 |
JP2006013001A (ja) | 2006-01-12 |
TW200601529A (en) | 2006-01-01 |
WO2006001130A1 (ja) | 2006-01-05 |
US7456494B2 (en) | 2008-11-25 |
KR101156520B1 (ko) | 2012-06-20 |
TWI349986B (en) | 2011-10-01 |
CN100514614C (zh) | 2009-07-15 |
CN1842915A (zh) | 2006-10-04 |
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