JPH0153614B2 - - Google Patents

Info

Publication number
JPH0153614B2
JPH0153614B2 JP58205207A JP20520783A JPH0153614B2 JP H0153614 B2 JPH0153614 B2 JP H0153614B2 JP 58205207 A JP58205207 A JP 58205207A JP 20520783 A JP20520783 A JP 20520783A JP H0153614 B2 JPH0153614 B2 JP H0153614B2
Authority
JP
Japan
Prior art keywords
mold
resin
ejector pin
tip
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58205207A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6096424A (ja
Inventor
Koji Yamaguchi
Shingo Yanagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP20520783A priority Critical patent/JPS6096424A/ja
Publication of JPS6096424A publication Critical patent/JPS6096424A/ja
Publication of JPH0153614B2 publication Critical patent/JPH0153614B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP20520783A 1983-11-01 1983-11-01 モ−ルド金型 Granted JPS6096424A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20520783A JPS6096424A (ja) 1983-11-01 1983-11-01 モ−ルド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20520783A JPS6096424A (ja) 1983-11-01 1983-11-01 モ−ルド金型

Publications (2)

Publication Number Publication Date
JPS6096424A JPS6096424A (ja) 1985-05-30
JPH0153614B2 true JPH0153614B2 (enExample) 1989-11-15

Family

ID=16503169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20520783A Granted JPS6096424A (ja) 1983-11-01 1983-11-01 モ−ルド金型

Country Status (1)

Country Link
JP (1) JPS6096424A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63195726U (enExample) * 1987-06-03 1988-12-16
US6525386B1 (en) * 1998-03-10 2003-02-25 Masimo Corporation Non-protruding optoelectronic lens

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4125109Y1 (enExample) * 1964-12-24 1966-12-22
JPS4911066U (enExample) * 1972-05-08 1974-01-30
JPS5611236A (en) * 1979-07-10 1981-02-04 Towa Seimitsu Kogyo Kk Method and metallic mold for plastic molding
JPS6012781B2 (ja) * 1981-06-19 1985-04-03 道男 長田 発光ダイオ−ド素子の樹脂封止成形方法及びその金型装置
JPS58162635U (ja) * 1982-04-23 1983-10-29 坂東　一雄 半導体樹脂封入成形用金型装置
JPS6453614A (en) * 1987-08-25 1989-03-01 Mitsubishi Electric Corp Amplifier

Also Published As

Publication number Publication date
JPS6096424A (ja) 1985-05-30

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