JP7547359B2 - 静電チャックの製造方法 - Google Patents

静電チャックの製造方法 Download PDF

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Publication number
JP7547359B2
JP7547359B2 JP2021554687A JP2021554687A JP7547359B2 JP 7547359 B2 JP7547359 B2 JP 7547359B2 JP 2021554687 A JP2021554687 A JP 2021554687A JP 2021554687 A JP2021554687 A JP 2021554687A JP 7547359 B2 JP7547359 B2 JP 7547359B2
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Japan
Prior art keywords
dielectric material
layer
depositing
dielectric
multiple layers
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JP2021554687A
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English (en)
Japanese (ja)
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JP2022524811A5 (https=
JP2022524811A (ja
Inventor
マクファデン，アンガス
ライト，ジェイソン
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Technetics Group LLC
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Technetics Group LLC
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Publication of JP2022524811A5 publication Critical patent/JP2022524811A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2021554687A 2019-03-11 2020-03-11 静電チャックの製造方法 Active JP7547359B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962816687P 2019-03-11 2019-03-11
US62/816,687 2019-03-11
PCT/US2020/021996 WO2020185835A1 (en) 2019-03-11 2020-03-11 Methods of manufacturing electrostatic chucks

Publications (3)

Publication Number Publication Date
JP2022524811A JP2022524811A (ja) 2022-05-10
JP2022524811A5 JP2022524811A5 (https=) 2024-05-15
JP7547359B2 true JP7547359B2 (ja) 2024-09-09

Family

ID=72423932

Family Applications (1)

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JP2021554687A Active JP7547359B2 (ja) 2019-03-11 2020-03-11 静電チャックの製造方法

Country Status (10)

Country Link
US (1) US11673161B2 (https=)
EP (1) EP3939157A4 (https=)
JP (1) JP7547359B2 (https=)
KR (1) KR102796742B1 (https=)
CN (1) CN113647009B (https=)
IL (1) IL286108B2 (https=)
MY (1) MY210488A (https=)
SG (1) SG11202109712UA (https=)
TW (1) TWI843819B (https=)
WO (1) WO2020185835A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119153287B (zh) * 2024-11-19 2025-10-14 海拓创新技术(杭州)有限公司 一种静电卡盘的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016795A (ja) 2006-07-06 2008-01-24 Momentive Performance Materials Inc 耐腐食性ウェーハプロセス装置およびその作製方法
JP2012235095A (ja) 2011-04-27 2012-11-29 Asml Netherlands Bv 基板ホルダ、リソグラフィ装置、デバイス製造方法、及び基板ホルダの製造方法
JP2016076711A (ja) 2008-11-10 2016-05-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマチャンバ部品用耐プラズマコーティング
JP2018174256A (ja) 2017-03-31 2018-11-08 日本特殊陶業株式会社 基板保持装置の補修方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430643B1 (ko) * 1994-01-31 2004-05-12 어플라이드 머티어리얼스, 인코포레이티드 두께가 균일한 절연체 막을 갖는 정전기 척
US6225240B1 (en) 1998-11-12 2001-05-01 Advanced Micro Devices, Inc. Rapid acceleration methods for global planarization of spin-on films
JP3616732B2 (ja) 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
KR100867631B1 (ko) 2007-02-01 2008-11-10 삼성전자주식회사 반도체 장치 및 그 제조 방법
EP2490073B1 (en) 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
US9360771B2 (en) * 2011-03-17 2016-06-07 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus, and device manufacturing method
WO2012147931A1 (ja) 2011-04-27 2012-11-01 住友大阪セメント株式会社 静電チャック装置
US8941969B2 (en) * 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
WO2015013142A1 (en) * 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
CN107078086B (zh) * 2014-02-07 2021-01-26 恩特格里斯公司 静电夹具以及制造其之方法
TWI656596B (zh) * 2014-08-26 2019-04-11 Asml Holding N. V. 靜電夾具及其製造方法
US10115527B2 (en) 2015-03-09 2018-10-30 Blackberry Limited Thin film dielectric stack
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP2017216443A (ja) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 再配線層における均一性を実現するためのシステム及び方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008016795A (ja) 2006-07-06 2008-01-24 Momentive Performance Materials Inc 耐腐食性ウェーハプロセス装置およびその作製方法
JP2016076711A (ja) 2008-11-10 2016-05-12 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマチャンバ部品用耐プラズマコーティング
JP2012235095A (ja) 2011-04-27 2012-11-29 Asml Netherlands Bv 基板ホルダ、リソグラフィ装置、デバイス製造方法、及び基板ホルダの製造方法
JP2018174256A (ja) 2017-03-31 2018-11-08 日本特殊陶業株式会社 基板保持装置の補修方法

Also Published As

Publication number Publication date
EP3939157A1 (en) 2022-01-19
TWI843819B (zh) 2024-06-01
CN113647009B (zh) 2024-06-28
CN113647009A (zh) 2021-11-12
KR20220006507A (ko) 2022-01-17
MY210488A (en) 2025-09-25
JP2022524811A (ja) 2022-05-10
KR102796742B1 (ko) 2025-04-15
SG11202109712UA (en) 2021-10-28
US11673161B2 (en) 2023-06-13
WO2020185835A1 (en) 2020-09-17
EP3939157A4 (en) 2023-01-18
TW202101657A (zh) 2021-01-01
IL286108A (en) 2021-10-31
IL286108B1 (en) 2024-11-01
IL286108B2 (en) 2025-03-01
US20200290081A1 (en) 2020-09-17

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