MY210488A - Methods of manufacturing electrostatic chucks - Google Patents
Methods of manufacturing electrostatic chucksInfo
- Publication number
- MY210488A MY210488A MYPI2021005117A MYPI2021005117A MY210488A MY 210488 A MY210488 A MY 210488A MY PI2021005117 A MYPI2021005117 A MY PI2021005117A MY PI2021005117 A MYPI2021005117 A MY PI2021005117A MY 210488 A MY210488 A MY 210488A
- Authority
- MY
- Malaysia
- Prior art keywords
- layer
- methods
- dielectric material
- electrostatic chucks
- manufacturing electrostatic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Formation Of Insulating Films (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962816687P | 2019-03-11 | 2019-03-11 | |
| PCT/US2020/021996 WO2020185835A1 (en) | 2019-03-11 | 2020-03-11 | Methods of manufacturing electrostatic chucks |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY210488A true MY210488A (en) | 2025-09-25 |
Family
ID=72423932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2021005117A MY210488A (en) | 2019-03-11 | 2020-03-11 | Methods of manufacturing electrostatic chucks |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US11673161B2 (https=) |
| EP (1) | EP3939157A4 (https=) |
| JP (1) | JP7547359B2 (https=) |
| KR (1) | KR102796742B1 (https=) |
| CN (1) | CN113647009B (https=) |
| IL (1) | IL286108B2 (https=) |
| MY (1) | MY210488A (https=) |
| SG (1) | SG11202109712UA (https=) |
| TW (1) | TWI843819B (https=) |
| WO (1) | WO2020185835A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119153287B (zh) * | 2024-11-19 | 2025-10-14 | 海拓创新技术(杭州)有限公司 | 一种静电卡盘的制造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100430643B1 (ko) * | 1994-01-31 | 2004-05-12 | 어플라이드 머티어리얼스, 인코포레이티드 | 두께가 균일한 절연체 막을 갖는 정전기 척 |
| US6225240B1 (en) | 1998-11-12 | 2001-05-01 | Advanced Micro Devices, Inc. | Rapid acceleration methods for global planarization of spin-on films |
| JP3616732B2 (ja) | 1999-07-07 | 2005-02-02 | 東京エレクトロン株式会社 | 基板の処理方法及び処理装置 |
| JP2008016795A (ja) * | 2006-07-06 | 2008-01-24 | Momentive Performance Materials Inc | 耐腐食性ウェーハプロセス装置およびその作製方法 |
| KR100867631B1 (ko) | 2007-02-01 | 2008-11-10 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| US8206829B2 (en) * | 2008-11-10 | 2012-06-26 | Applied Materials, Inc. | Plasma resistant coatings for plasma chamber components |
| EP2490073B1 (en) | 2011-02-18 | 2015-09-23 | ASML Netherlands BV | Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder |
| US9360771B2 (en) * | 2011-03-17 | 2016-06-07 | Asml Netherlands B.V. | Electrostatic clamp, lithographic apparatus, and device manufacturing method |
| NL2008630A (en) * | 2011-04-27 | 2012-10-30 | Asml Netherlands Bv | Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder. |
| WO2012147931A1 (ja) | 2011-04-27 | 2012-11-01 | 住友大阪セメント株式会社 | 静電チャック装置 |
| US8941969B2 (en) * | 2012-12-21 | 2015-01-27 | Applied Materials, Inc. | Single-body electrostatic chuck |
| WO2015013142A1 (en) * | 2013-07-22 | 2015-01-29 | Applied Materials, Inc. | An electrostatic chuck for high temperature process applications |
| CN107078086B (zh) * | 2014-02-07 | 2021-01-26 | 恩特格里斯公司 | 静电夹具以及制造其之方法 |
| TWI656596B (zh) * | 2014-08-26 | 2019-04-11 | Asml Holding N. V. | 靜電夾具及其製造方法 |
| US10115527B2 (en) | 2015-03-09 | 2018-10-30 | Blackberry Limited | Thin film dielectric stack |
| DE102015210736B3 (de) * | 2015-06-11 | 2016-10-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger |
| JP2017216443A (ja) * | 2016-05-20 | 2017-12-07 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | 再配線層における均一性を実現するためのシステム及び方法 |
| JP6796531B2 (ja) * | 2017-03-31 | 2020-12-09 | 日本特殊陶業株式会社 | 基板保持装置の補修方法 |
-
2020
- 2020-03-10 US US16/814,775 patent/US11673161B2/en active Active
- 2020-03-11 WO PCT/US2020/021996 patent/WO2020185835A1/en not_active Ceased
- 2020-03-11 SG SG11202109712U patent/SG11202109712UA/en unknown
- 2020-03-11 KR KR1020217032437A patent/KR102796742B1/ko active Active
- 2020-03-11 CN CN202080020969.9A patent/CN113647009B/zh active Active
- 2020-03-11 EP EP20769276.5A patent/EP3939157A4/en active Pending
- 2020-03-11 MY MYPI2021005117A patent/MY210488A/en unknown
- 2020-03-11 JP JP2021554687A patent/JP7547359B2/ja active Active
- 2020-03-11 IL IL286108A patent/IL286108B2/en unknown
- 2020-03-11 TW TW109107957A patent/TWI843819B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3939157A1 (en) | 2022-01-19 |
| TWI843819B (zh) | 2024-06-01 |
| CN113647009B (zh) | 2024-06-28 |
| CN113647009A (zh) | 2021-11-12 |
| KR20220006507A (ko) | 2022-01-17 |
| JP2022524811A (ja) | 2022-05-10 |
| KR102796742B1 (ko) | 2025-04-15 |
| SG11202109712UA (en) | 2021-10-28 |
| US11673161B2 (en) | 2023-06-13 |
| WO2020185835A1 (en) | 2020-09-17 |
| EP3939157A4 (en) | 2023-01-18 |
| TW202101657A (zh) | 2021-01-01 |
| JP7547359B2 (ja) | 2024-09-09 |
| IL286108A (en) | 2021-10-31 |
| IL286108B1 (en) | 2024-11-01 |
| IL286108B2 (en) | 2025-03-01 |
| US20200290081A1 (en) | 2020-09-17 |
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