TWI843819B - 製造靜電吸盤的方法 - Google Patents

製造靜電吸盤的方法 Download PDF

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Publication number
TWI843819B
TWI843819B TW109107957A TW109107957A TWI843819B TW I843819 B TWI843819 B TW I843819B TW 109107957 A TW109107957 A TW 109107957A TW 109107957 A TW109107957 A TW 109107957A TW I843819 B TWI843819 B TW I843819B
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TW
Taiwan
Prior art keywords
dielectric material
layer
dielectric
depositing
material layers
Prior art date
Application number
TW109107957A
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English (en)
Chinese (zh)
Other versions
TW202101657A (zh
Inventor
安格斯 麥克法登
傑森 瑞特
Original Assignee
美商泰科耐斯集團有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商泰科耐斯集團有限公司 filed Critical 美商泰科耐斯集團有限公司
Publication of TW202101657A publication Critical patent/TW202101657A/zh
Application granted granted Critical
Publication of TWI843819B publication Critical patent/TWI843819B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW109107957A 2019-03-11 2020-03-11 製造靜電吸盤的方法 TWI843819B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962816687P 2019-03-11 2019-03-11
US62/816,687 2019-03-11

Publications (2)

Publication Number Publication Date
TW202101657A TW202101657A (zh) 2021-01-01
TWI843819B true TWI843819B (zh) 2024-06-01

Family

ID=72423932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109107957A TWI843819B (zh) 2019-03-11 2020-03-11 製造靜電吸盤的方法

Country Status (10)

Country Link
US (1) US11673161B2 (https=)
EP (1) EP3939157A4 (https=)
JP (1) JP7547359B2 (https=)
KR (1) KR102796742B1 (https=)
CN (1) CN113647009B (https=)
IL (1) IL286108B2 (https=)
MY (1) MY210488A (https=)
SG (1) SG11202109712UA (https=)
TW (1) TWI843819B (https=)
WO (1) WO2020185835A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119153287B (zh) * 2024-11-19 2025-10-14 海拓创新技术(杭州)有限公司 一种静电卡盘的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753132A (en) * 1994-01-31 1998-05-19 Applied Materials, Inc. Method of making electrostatic chuck with conformal insulator film
US20140218711A1 (en) * 2011-03-17 2014-08-07 Asml Netherlands B.V. Electrostatic Clamp, Lithographic Apparatus, and Device Manufacturing Method
US20150022936A1 (en) * 2013-07-22 2015-01-22 Applied Materials, Inc. Electrostatic chuck for high temperature process applications
US20170242345A1 (en) * 2014-08-26 2017-08-24 Asml Holding N.V. An Electrostatic Clamp and a Method for Manufacturing the Same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225240B1 (en) 1998-11-12 2001-05-01 Advanced Micro Devices, Inc. Rapid acceleration methods for global planarization of spin-on films
JP3616732B2 (ja) 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
JP2008016795A (ja) * 2006-07-06 2008-01-24 Momentive Performance Materials Inc 耐腐食性ウェーハプロセス装置およびその作製方法
KR100867631B1 (ko) 2007-02-01 2008-11-10 삼성전자주식회사 반도체 장치 및 그 제조 방법
US8206829B2 (en) * 2008-11-10 2012-06-26 Applied Materials, Inc. Plasma resistant coatings for plasma chamber components
EP2490073B1 (en) 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
NL2008630A (en) * 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
WO2012147931A1 (ja) 2011-04-27 2012-11-01 住友大阪セメント株式会社 静電チャック装置
US8941969B2 (en) * 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
CN107078086B (zh) * 2014-02-07 2021-01-26 恩特格里斯公司 静电夹具以及制造其之方法
US10115527B2 (en) 2015-03-09 2018-10-30 Blackberry Limited Thin film dielectric stack
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP2017216443A (ja) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 再配線層における均一性を実現するためのシステム及び方法
JP6796531B2 (ja) * 2017-03-31 2020-12-09 日本特殊陶業株式会社 基板保持装置の補修方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753132A (en) * 1994-01-31 1998-05-19 Applied Materials, Inc. Method of making electrostatic chuck with conformal insulator film
US20140218711A1 (en) * 2011-03-17 2014-08-07 Asml Netherlands B.V. Electrostatic Clamp, Lithographic Apparatus, and Device Manufacturing Method
US20150022936A1 (en) * 2013-07-22 2015-01-22 Applied Materials, Inc. Electrostatic chuck for high temperature process applications
US20170242345A1 (en) * 2014-08-26 2017-08-24 Asml Holding N.V. An Electrostatic Clamp and a Method for Manufacturing the Same

Also Published As

Publication number Publication date
EP3939157A1 (en) 2022-01-19
CN113647009B (zh) 2024-06-28
CN113647009A (zh) 2021-11-12
KR20220006507A (ko) 2022-01-17
MY210488A (en) 2025-09-25
JP2022524811A (ja) 2022-05-10
KR102796742B1 (ko) 2025-04-15
SG11202109712UA (en) 2021-10-28
US11673161B2 (en) 2023-06-13
WO2020185835A1 (en) 2020-09-17
EP3939157A4 (en) 2023-01-18
TW202101657A (zh) 2021-01-01
JP7547359B2 (ja) 2024-09-09
IL286108A (en) 2021-10-31
IL286108B1 (en) 2024-11-01
IL286108B2 (en) 2025-03-01
US20200290081A1 (en) 2020-09-17

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