JP2022524811A5 - - Google Patents

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Publication number
JP2022524811A5
JP2022524811A5 JP2021554687A JP2021554687A JP2022524811A5 JP 2022524811 A5 JP2022524811 A5 JP 2022524811A5 JP 2021554687 A JP2021554687 A JP 2021554687A JP 2021554687 A JP2021554687 A JP 2021554687A JP 2022524811 A5 JP2022524811 A5 JP 2022524811A5
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JP
Japan
Prior art keywords
dielectric material
layer
dielectric
depositing
layers
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JP2021554687A
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English (en)
Japanese (ja)
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JP2022524811A (ja
JP7547359B2 (ja
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Priority claimed from PCT/US2020/021996 external-priority patent/WO2020185835A1/en
Publication of JP2022524811A publication Critical patent/JP2022524811A/ja
Publication of JP2022524811A5 publication Critical patent/JP2022524811A5/ja
Application granted granted Critical
Publication of JP7547359B2 publication Critical patent/JP7547359B2/ja
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JP2021554687A 2019-03-11 2020-03-11 静電チャックの製造方法 Active JP7547359B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962816687P 2019-03-11 2019-03-11
US62/816,687 2019-03-11
PCT/US2020/021996 WO2020185835A1 (en) 2019-03-11 2020-03-11 Methods of manufacturing electrostatic chucks

Publications (3)

Publication Number Publication Date
JP2022524811A JP2022524811A (ja) 2022-05-10
JP2022524811A5 true JP2022524811A5 (https=) 2024-05-15
JP7547359B2 JP7547359B2 (ja) 2024-09-09

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ID=72423932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554687A Active JP7547359B2 (ja) 2019-03-11 2020-03-11 静電チャックの製造方法

Country Status (10)

Country Link
US (1) US11673161B2 (https=)
EP (1) EP3939157A4 (https=)
JP (1) JP7547359B2 (https=)
KR (1) KR102796742B1 (https=)
CN (1) CN113647009B (https=)
IL (1) IL286108B2 (https=)
MY (1) MY210488A (https=)
SG (1) SG11202109712UA (https=)
TW (1) TWI843819B (https=)
WO (1) WO2020185835A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119153287B (zh) * 2024-11-19 2025-10-14 海拓创新技术(杭州)有限公司 一种静电卡盘的制造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430643B1 (ko) * 1994-01-31 2004-05-12 어플라이드 머티어리얼스, 인코포레이티드 두께가 균일한 절연체 막을 갖는 정전기 척
US6225240B1 (en) 1998-11-12 2001-05-01 Advanced Micro Devices, Inc. Rapid acceleration methods for global planarization of spin-on films
JP3616732B2 (ja) 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
JP2008016795A (ja) * 2006-07-06 2008-01-24 Momentive Performance Materials Inc 耐腐食性ウェーハプロセス装置およびその作製方法
KR100867631B1 (ko) 2007-02-01 2008-11-10 삼성전자주식회사 반도체 장치 및 그 제조 방법
US8206829B2 (en) * 2008-11-10 2012-06-26 Applied Materials, Inc. Plasma resistant coatings for plasma chamber components
EP2490073B1 (en) 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
US9360771B2 (en) * 2011-03-17 2016-06-07 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus, and device manufacturing method
NL2008630A (en) * 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
WO2012147931A1 (ja) 2011-04-27 2012-11-01 住友大阪セメント株式会社 静電チャック装置
US8941969B2 (en) * 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
WO2015013142A1 (en) * 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
CN107078086B (zh) * 2014-02-07 2021-01-26 恩特格里斯公司 静电夹具以及制造其之方法
TWI656596B (zh) * 2014-08-26 2019-04-11 Asml Holding N. V. 靜電夾具及其製造方法
US10115527B2 (en) 2015-03-09 2018-10-30 Blackberry Limited Thin film dielectric stack
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP2017216443A (ja) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 再配線層における均一性を実現するためのシステム及び方法
JP6796531B2 (ja) * 2017-03-31 2020-12-09 日本特殊陶業株式会社 基板保持装置の補修方法

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