DK1756882T3 - Fremgangsmåde til fremstilling af piezoelektriske materialer - Google Patents

Fremgangsmåde til fremstilling af piezoelektriske materialer

Info

Publication number
DK1756882T3
DK1756882T3 DK05778186T DK05778186T DK1756882T3 DK 1756882 T3 DK1756882 T3 DK 1756882T3 DK 05778186 T DK05778186 T DK 05778186T DK 05778186 T DK05778186 T DK 05778186T DK 1756882 T3 DK1756882 T3 DK 1756882T3
Authority
DK
Denmark
Prior art keywords
stack
sol
piezoelectric
piezoelectric ceramic
ceramic oxide
Prior art date
Application number
DK05778186T
Other languages
English (en)
Inventor
Philippe Boy
Gilles Ehrhart
Philippe Belleville
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of DK1756882T3 publication Critical patent/DK1756882T3/da

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/704Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H10N30/708Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • H10N30/078Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/09Forming piezoelectric or electrostrictive materials
    • H10N30/093Forming inorganic materials
    • H10N30/097Forming inorganic materials by sintering
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8548Lead-based oxides
    • H10N30/8554Lead-zirconium titanate [PZT] based

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
DK05778186T 2004-06-17 2005-06-16 Fremgangsmåde til fremstilling af piezoelektriske materialer DK1756882T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0451289A FR2871942B1 (fr) 2004-06-17 2004-06-17 Procede de preparation de materiaux piezoelectriques
PCT/FR2005/050453 WO2006003342A1 (fr) 2004-06-17 2005-06-16 Procede de preparation de materiaux piezoelectriques

Publications (1)

Publication Number Publication Date
DK1756882T3 true DK1756882T3 (da) 2008-12-15

Family

ID=34945193

Family Applications (1)

Application Number Title Priority Date Filing Date
DK05778186T DK1756882T3 (da) 2004-06-17 2005-06-16 Fremgangsmåde til fremstilling af piezoelektriske materialer

Country Status (11)

Country Link
US (1) US20080182128A1 (da)
EP (1) EP1756882B1 (da)
JP (1) JP5896586B2 (da)
AT (1) ATE408242T1 (da)
CA (1) CA2569927C (da)
DE (1) DE602005009697D1 (da)
DK (1) DK1756882T3 (da)
ES (1) ES2314699T3 (da)
FR (1) FR2871942B1 (da)
SI (1) SI1756882T1 (da)
WO (1) WO2006003342A1 (da)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8461462B2 (en) * 2009-09-28 2013-06-11 Kyocera Corporation Circuit substrate, laminated board and laminated sheet
KR101669953B1 (ko) * 2010-03-26 2016-11-09 삼성전자 주식회사 산화물 박막, 산화물 박막의 형성 방법 및 산화물 박막을 포함하는 전자 소자
FR2967992B1 (fr) 2010-11-26 2015-05-29 Commissariat Energie Atomique Preparation de sols d'oxydes metalliques stables, utiles notamment pour la fabrication de films minces a proprietes optiques et resistants a l'abrasion
EP2677558B1 (en) 2011-02-18 2017-03-29 Panasonic Intellectual Property Management Co., Ltd. Piezoelectric element
WO2013026125A1 (en) 2011-08-24 2013-02-28 National Research Council Of Canada Porosity control in piezoelectric films
FR2981064B1 (fr) 2011-10-07 2014-11-28 Commissariat Energie Atomique Procede de preparation d'un materiau sur un substrat par voie sol-gel
US9099384B2 (en) 2012-02-15 2015-08-04 Drexel University Charge ordered vertical transistors
FR3045036B1 (fr) * 2015-12-15 2017-12-22 Commissariat Energie Atomique Procede de preparation d'une solution sol-gel utilisable pour la preparation d'une ceramique de titanate de baryum dope par du hafnium et/ou par au moins un element lanthanide

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04293280A (ja) * 1991-03-22 1992-10-16 Seiko Instr Inc セラミック薄膜素子の製造方法
JPH0632613A (ja) * 1992-07-16 1994-02-08 Rohm Co Ltd 複合酸化物薄膜の製造方法
JPH06112550A (ja) * 1992-09-28 1994-04-22 Seiko Epson Corp 圧電体、強誘電体薄膜素子の製造方法
JP3336720B2 (ja) * 1994-02-21 2002-10-21 株式会社デンソー 圧電素子
DE4416245C1 (de) * 1994-05-07 1995-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung von PZT-Schichten aus niedrig sinterndem PZT-Pulver
JP3865442B2 (ja) * 1995-11-22 2007-01-10 のぞみフォトニクス株式会社 多層酸化物薄膜素子及びその製造方法
JP3307400B2 (ja) * 1996-09-12 2002-07-24 シチズン時計株式会社 強誘電体素子及びその製法ならびにインクジェットヘッド
DE19744630C1 (de) * 1997-10-09 1999-06-24 Fraunhofer Ges Forschung Verfahren zur Herstellung und Verwendung eines piezoelektrischen Bauelementes
US6333066B1 (en) * 1997-11-21 2001-12-25 Samsung Electronics Co., Ltd. Method for forming PZT thin film using seed layer
JP4122564B2 (ja) * 1998-04-24 2008-07-23 セイコーエプソン株式会社 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP3750413B2 (ja) * 1999-04-15 2006-03-01 セイコーエプソン株式会社 圧電体素子の製造方法及びインクジェット式記録ヘッドの製造方法
JP4110503B2 (ja) * 2000-04-14 2008-07-02 セイコーエプソン株式会社 圧電体素子およびインクジェット式記録ヘッドの製造方法
KR100369118B1 (ko) * 2000-05-13 2003-01-24 한국과학기술연구원 스크린 프린팅에 의한 고밀도 세라믹 후막 제조방법
US6677059B2 (en) * 2000-12-12 2004-01-13 Tdk Corporation EL device and making method
JP2003257269A (ja) * 2002-02-28 2003-09-12 Star Micronics Co Ltd 誘電体膜の製造方法
SG107103A1 (en) * 2002-05-24 2004-11-29 Ntu Ventures Private Ltd Process for producing nanocrystalline composites

Also Published As

Publication number Publication date
ES2314699T3 (es) 2009-03-16
EP1756882B1 (fr) 2008-09-10
DE602005009697D1 (de) 2008-10-23
FR2871942A1 (fr) 2005-12-23
WO2006003342A1 (fr) 2006-01-12
SI1756882T1 (sl) 2009-02-28
US20080182128A1 (en) 2008-07-31
JP5896586B2 (ja) 2016-03-30
JP2008504672A (ja) 2008-02-14
CA2569927A1 (en) 2006-01-12
EP1756882A1 (fr) 2007-02-28
CA2569927C (en) 2016-04-05
ATE408242T1 (de) 2008-09-15
FR2871942B1 (fr) 2006-08-04

Similar Documents

Publication Publication Date Title
DK1756882T3 (da) Fremgangsmåde til fremstilling af piezoelektriske materialer
RU2435673C2 (ru) Покрытие для компонента для защиты от воздействий окружающей среды и способ его получения
WO2009038767A3 (en) Continuous ceramic nanofibers, method of producing and devices using the same
WO2008017472A3 (de) Verfahren zum herstellen einer porösen, keramischen oberflächenschicht
JP2008137830A (ja) セラミックス複合部材とその製造方法
ATE458387T1 (de) Verfahren zum herstellen eines metall-keramik- substrates bzw. kupfer-keramik-substrates sowie träger zur verwendung bei diesem verfahren
RU2014152353A (ru) Керамичесткий элемент, инкрустированный по меньшей мере одним декорированием из композиционной керамики
WO2014150394A3 (en) Non-stoichiometric ceramic matrix composites and methods for producing non-stoichiometric ceramic matrix composites
WO2009124857A3 (de) Verfahren zur herstellung von siliziumhaltigen keramischen strukturen
EP2174780B8 (de) Aufwickelbarer Fliesenaufbau, Verfahren zur Herstellung sowie die Verwendung
US20210245490A1 (en) Nanofiber interlaminar layer for ceramic matrix composites
WO2008046785A3 (de) Verfahren zur stabilisierung und funktionalisierung von porösen metallischen schichten
KR102407421B1 (ko) 소성 지그
US10301225B2 (en) Process for manufacturing a multiperforated composite part
JP2015526170A5 (da)
CN107975551A (zh) 分段式碳纤维预成形件
Wu et al. Dielectric and piezoelectric properties of PZT composite thick films with variable solution to powder ratios
WO2006102103A3 (en) Method of making a ceramic composite
EP4242193A3 (en) Method for fabricating ceramic matrix composite components
TWI356049B (en) Method for manufacturing ceramic compact
EP3835466A4 (en) CRYSTALLINE SILICON CARBIDE FIBER AND METHOD FOR MAKING IT, AND CERAMIC COMPOSITE SUBSTRATE
WO2003024711A3 (de) Verfahren zur herstellung eines keramischen substrats und keramisches substrat
JP5910728B2 (ja) 無機繊維結合型セラミックスの製造方法
EP3046893B1 (en) Method of producing a ceramic article
CN102208528A (zh) 一种多层压电元件电极表面保护层的制造工艺