IL286108B2 - Methods for manufacturing electrostatic chucks - Google Patents

Methods for manufacturing electrostatic chucks

Info

Publication number
IL286108B2
IL286108B2 IL286108A IL28610821A IL286108B2 IL 286108 B2 IL286108 B2 IL 286108B2 IL 286108 A IL286108 A IL 286108A IL 28610821 A IL28610821 A IL 28610821A IL 286108 B2 IL286108 B2 IL 286108B2
Authority
IL
Israel
Prior art keywords
dielectric material
layer
depositing
dielectric
layers
Prior art date
Application number
IL286108A
Other languages
English (en)
Hebrew (he)
Other versions
IL286108A (en
IL286108B1 (en
Original Assignee
Technetics Group Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technetics Group Llc filed Critical Technetics Group Llc
Publication of IL286108A publication Critical patent/IL286108A/en
Publication of IL286108B1 publication Critical patent/IL286108B1/en
Publication of IL286108B2 publication Critical patent/IL286108B2/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
IL286108A 2019-03-11 2020-03-11 Methods for manufacturing electrostatic chucks IL286108B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962816687P 2019-03-11 2019-03-11
PCT/US2020/021996 WO2020185835A1 (en) 2019-03-11 2020-03-11 Methods of manufacturing electrostatic chucks

Publications (3)

Publication Number Publication Date
IL286108A IL286108A (en) 2021-10-31
IL286108B1 IL286108B1 (en) 2024-11-01
IL286108B2 true IL286108B2 (en) 2025-03-01

Family

ID=72423932

Family Applications (1)

Application Number Title Priority Date Filing Date
IL286108A IL286108B2 (en) 2019-03-11 2020-03-11 Methods for manufacturing electrostatic chucks

Country Status (10)

Country Link
US (1) US11673161B2 (https=)
EP (1) EP3939157A4 (https=)
JP (1) JP7547359B2 (https=)
KR (1) KR102796742B1 (https=)
CN (1) CN113647009B (https=)
IL (1) IL286108B2 (https=)
MY (1) MY210488A (https=)
SG (1) SG11202109712UA (https=)
TW (1) TWI843819B (https=)
WO (1) WO2020185835A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119153287B (zh) * 2024-11-19 2025-10-14 海拓创新技术(杭州)有限公司 一种静电卡盘的制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753132A (en) * 1994-01-31 1998-05-19 Applied Materials, Inc. Method of making electrostatic chuck with conformal insulator film
US20020045011A1 (en) * 1999-07-07 2002-04-18 Shinji Nagashima Substrate processing method
US20080185738A1 (en) * 2007-02-01 2008-08-07 Samsung Electronics Co., Ltd. Semiconductor device and method of manufacturing the same
US20140218711A1 (en) * 2011-03-17 2014-08-07 Asml Netherlands B.V. Electrostatic Clamp, Lithographic Apparatus, and Device Manufacturing Method
US20160170314A1 (en) * 2011-02-18 2016-06-16 Asml Netherlands B.V. Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
US20160268048A1 (en) * 2015-03-09 2016-09-15 Blackberry Limited Thin film dielectric stack
US20170242345A1 (en) * 2014-08-26 2017-08-24 Asml Holding N.V. An Electrostatic Clamp and a Method for Manufacturing the Same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6225240B1 (en) 1998-11-12 2001-05-01 Advanced Micro Devices, Inc. Rapid acceleration methods for global planarization of spin-on films
JP2008016795A (ja) * 2006-07-06 2008-01-24 Momentive Performance Materials Inc 耐腐食性ウェーハプロセス装置およびその作製方法
US8206829B2 (en) * 2008-11-10 2012-06-26 Applied Materials, Inc. Plasma resistant coatings for plasma chamber components
NL2008630A (en) * 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
WO2012147931A1 (ja) 2011-04-27 2012-11-01 住友大阪セメント株式会社 静電チャック装置
US8941969B2 (en) * 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
WO2015013142A1 (en) * 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
CN107078086B (zh) * 2014-02-07 2021-01-26 恩特格里斯公司 静电夹具以及制造其之方法
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP2017216443A (ja) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 再配線層における均一性を実現するためのシステム及び方法
JP6796531B2 (ja) * 2017-03-31 2020-12-09 日本特殊陶業株式会社 基板保持装置の補修方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753132A (en) * 1994-01-31 1998-05-19 Applied Materials, Inc. Method of making electrostatic chuck with conformal insulator film
US20020045011A1 (en) * 1999-07-07 2002-04-18 Shinji Nagashima Substrate processing method
US20080185738A1 (en) * 2007-02-01 2008-08-07 Samsung Electronics Co., Ltd. Semiconductor device and method of manufacturing the same
US20160170314A1 (en) * 2011-02-18 2016-06-16 Asml Netherlands B.V. Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder
US20140218711A1 (en) * 2011-03-17 2014-08-07 Asml Netherlands B.V. Electrostatic Clamp, Lithographic Apparatus, and Device Manufacturing Method
US20170242345A1 (en) * 2014-08-26 2017-08-24 Asml Holding N.V. An Electrostatic Clamp and a Method for Manufacturing the Same
US20160268048A1 (en) * 2015-03-09 2016-09-15 Blackberry Limited Thin film dielectric stack

Also Published As

Publication number Publication date
EP3939157A1 (en) 2022-01-19
TWI843819B (zh) 2024-06-01
CN113647009B (zh) 2024-06-28
CN113647009A (zh) 2021-11-12
KR20220006507A (ko) 2022-01-17
MY210488A (en) 2025-09-25
JP2022524811A (ja) 2022-05-10
KR102796742B1 (ko) 2025-04-15
SG11202109712UA (en) 2021-10-28
US11673161B2 (en) 2023-06-13
WO2020185835A1 (en) 2020-09-17
EP3939157A4 (en) 2023-01-18
TW202101657A (zh) 2021-01-01
JP7547359B2 (ja) 2024-09-09
IL286108A (en) 2021-10-31
IL286108B1 (en) 2024-11-01
US20200290081A1 (en) 2020-09-17

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