SG11202109712UA - Methods of manufacturing electrostatic chucks - Google Patents

Methods of manufacturing electrostatic chucks

Info

Publication number
SG11202109712UA
SG11202109712UA SG11202109712UA SG11202109712UA SG 11202109712U A SG11202109712U A SG 11202109712UA SG 11202109712U A SG11202109712U A SG 11202109712UA SG 11202109712U A SG11202109712U A SG 11202109712UA
Authority
SG
Singapore
Prior art keywords
dielectric material
depositing
layer
layers
dielectric
Prior art date
Application number
Other languages
English (en)
Inventor
Angus Mcfadden
Jason Wright
Original Assignee
Technetics Group Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technetics Group Llc filed Critical Technetics Group Llc
Publication of SG11202109712UA publication Critical patent/SG11202109712UA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
SG11202109712U 2019-03-11 2020-03-11 Methods of manufacturing electrostatic chucks SG11202109712UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962816687P 2019-03-11 2019-03-11
PCT/US2020/021996 WO2020185835A1 (en) 2019-03-11 2020-03-11 Methods of manufacturing electrostatic chucks

Publications (1)

Publication Number Publication Date
SG11202109712UA true SG11202109712UA (en) 2021-10-28

Family

ID=72423932

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202109712U SG11202109712UA (en) 2019-03-11 2020-03-11 Methods of manufacturing electrostatic chucks

Country Status (10)

Country Link
US (1) US11673161B2 (https=)
EP (1) EP3939157A4 (https=)
JP (1) JP7547359B2 (https=)
KR (1) KR102796742B1 (https=)
CN (1) CN113647009B (https=)
IL (1) IL286108B2 (https=)
MY (1) MY210488A (https=)
SG (1) SG11202109712UA (https=)
TW (1) TWI843819B (https=)
WO (1) WO2020185835A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119153287B (zh) * 2024-11-19 2025-10-14 海拓创新技术(杭州)有限公司 一种静电卡盘的制造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100430643B1 (ko) * 1994-01-31 2004-05-12 어플라이드 머티어리얼스, 인코포레이티드 두께가 균일한 절연체 막을 갖는 정전기 척
US6225240B1 (en) 1998-11-12 2001-05-01 Advanced Micro Devices, Inc. Rapid acceleration methods for global planarization of spin-on films
JP3616732B2 (ja) 1999-07-07 2005-02-02 東京エレクトロン株式会社 基板の処理方法及び処理装置
JP2008016795A (ja) * 2006-07-06 2008-01-24 Momentive Performance Materials Inc 耐腐食性ウェーハプロセス装置およびその作製方法
KR100867631B1 (ko) 2007-02-01 2008-11-10 삼성전자주식회사 반도체 장치 및 그 제조 방법
US8206829B2 (en) * 2008-11-10 2012-06-26 Applied Materials, Inc. Plasma resistant coatings for plasma chamber components
EP2490073B1 (en) 2011-02-18 2015-09-23 ASML Netherlands BV Substrate holder, lithographic apparatus, and method of manufacturing a substrate holder
US9360771B2 (en) * 2011-03-17 2016-06-07 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus, and device manufacturing method
NL2008630A (en) * 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
WO2012147931A1 (ja) 2011-04-27 2012-11-01 住友大阪セメント株式会社 静電チャック装置
US8941969B2 (en) * 2012-12-21 2015-01-27 Applied Materials, Inc. Single-body electrostatic chuck
WO2015013142A1 (en) * 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
CN107078086B (zh) * 2014-02-07 2021-01-26 恩特格里斯公司 静电夹具以及制造其之方法
TWI656596B (zh) * 2014-08-26 2019-04-11 Asml Holding N. V. 靜電夾具及其製造方法
US10115527B2 (en) 2015-03-09 2018-10-30 Blackberry Limited Thin film dielectric stack
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP2017216443A (ja) * 2016-05-20 2017-12-07 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 再配線層における均一性を実現するためのシステム及び方法
JP6796531B2 (ja) * 2017-03-31 2020-12-09 日本特殊陶業株式会社 基板保持装置の補修方法

Also Published As

Publication number Publication date
EP3939157A1 (en) 2022-01-19
TWI843819B (zh) 2024-06-01
CN113647009B (zh) 2024-06-28
CN113647009A (zh) 2021-11-12
KR20220006507A (ko) 2022-01-17
MY210488A (en) 2025-09-25
JP2022524811A (ja) 2022-05-10
KR102796742B1 (ko) 2025-04-15
US11673161B2 (en) 2023-06-13
WO2020185835A1 (en) 2020-09-17
EP3939157A4 (en) 2023-01-18
TW202101657A (zh) 2021-01-01
JP7547359B2 (ja) 2024-09-09
IL286108A (en) 2021-10-31
IL286108B1 (en) 2024-11-01
IL286108B2 (en) 2025-03-01
US20200290081A1 (en) 2020-09-17

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