JP7542875B2 - 半導体ダイのピックアップ装置 - Google Patents

半導体ダイのピックアップ装置 Download PDF

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Publication number
JP7542875B2
JP7542875B2 JP2022567917A JP2022567917A JP7542875B2 JP 7542875 B2 JP7542875 B2 JP 7542875B2 JP 2022567917 A JP2022567917 A JP 2022567917A JP 2022567917 A JP2022567917 A JP 2022567917A JP 7542875 B2 JP7542875 B2 JP 7542875B2
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Japan
Prior art keywords
annular
semiconductor die
moving element
columnar
tip
Prior art date
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Active
Application number
JP2022567917A
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English (en)
Japanese (ja)
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JPWO2022123645A5 (https=
JPWO2022123645A1 (https=
Inventor
徹 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
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Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of JPWO2022123645A1 publication Critical patent/JPWO2022123645A1/ja
Publication of JPWO2022123645A5 publication Critical patent/JPWO2022123645A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP2022567917A 2020-12-08 2020-12-08 半導体ダイのピックアップ装置 Active JP7542875B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/045600 WO2022123645A1 (ja) 2020-12-08 2020-12-08 半導体ダイのピックアップ装置

Publications (3)

Publication Number Publication Date
JPWO2022123645A1 JPWO2022123645A1 (https=) 2022-06-16
JPWO2022123645A5 JPWO2022123645A5 (https=) 2023-08-25
JP7542875B2 true JP7542875B2 (ja) 2024-09-02

Family

ID=81973350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022567917A Active JP7542875B2 (ja) 2020-12-08 2020-12-08 半導体ダイのピックアップ装置

Country Status (4)

Country Link
JP (1) JP7542875B2 (https=)
KR (1) KR102866416B1 (https=)
CN (1) CN116457926B (https=)
WO (1) WO2022123645A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497920B1 (ja) 2023-08-09 2024-06-11 株式会社新川 ピックアップユニット、実装装置、およびピックアップ方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005117019A (ja) 2003-09-17 2005-04-28 Renesas Technology Corp 半導体装置の製造方法
JP2010056466A (ja) 2008-08-29 2010-03-11 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2018182278A (ja) 2017-04-07 2018-11-15 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及び実装装置
JP2019054209A (ja) 2017-09-19 2019-04-04 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
JP2019121775A (ja) 2018-01-09 2019-07-22 力成科技股▲分▼有限公司 チップ突き上げニードル装置及びチップ突き上げニードル設備

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4945339B2 (ja) 2007-06-22 2012-06-06 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US8092645B2 (en) 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
KR20190054748A (ko) * 2017-11-14 2019-05-22 에스케이하이닉스 주식회사 다이 이젝팅 장치 및 그 구동방법
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005117019A (ja) 2003-09-17 2005-04-28 Renesas Technology Corp 半導体装置の製造方法
JP2010056466A (ja) 2008-08-29 2010-03-11 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2018182278A (ja) 2017-04-07 2018-11-15 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及び実装装置
JP2019054209A (ja) 2017-09-19 2019-04-04 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
JP2019121775A (ja) 2018-01-09 2019-07-22 力成科技股▲分▼有限公司 チップ突き上げニードル装置及びチップ突き上げニードル設備

Also Published As

Publication number Publication date
KR20230096115A (ko) 2023-06-29
JPWO2022123645A1 (https=) 2022-06-16
WO2022123645A1 (ja) 2022-06-16
KR102866416B1 (ko) 2025-09-29
CN116457926A (zh) 2023-07-18
CN116457926B (zh) 2025-06-17

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