CN116457926B - 半导体裸片的拾取装置 - Google Patents

半导体裸片的拾取装置 Download PDF

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Publication number
CN116457926B
CN116457926B CN202080107068.3A CN202080107068A CN116457926B CN 116457926 B CN116457926 B CN 116457926B CN 202080107068 A CN202080107068 A CN 202080107068A CN 116457926 B CN116457926 B CN 116457926B
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CN
China
Prior art keywords
annular
moving element
semiconductor die
columnar
end surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080107068.3A
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English (en)
Chinese (zh)
Other versions
CN116457926A (zh
Inventor
前田彻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Publication of CN116457926A publication Critical patent/CN116457926A/zh
Application granted granted Critical
Publication of CN116457926B publication Critical patent/CN116457926B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
CN202080107068.3A 2020-12-08 2020-12-08 半导体裸片的拾取装置 Active CN116457926B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/045600 WO2022123645A1 (ja) 2020-12-08 2020-12-08 半導体ダイのピックアップ装置

Publications (2)

Publication Number Publication Date
CN116457926A CN116457926A (zh) 2023-07-18
CN116457926B true CN116457926B (zh) 2025-06-17

Family

ID=81973350

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080107068.3A Active CN116457926B (zh) 2020-12-08 2020-12-08 半导体裸片的拾取装置

Country Status (4)

Country Link
JP (1) JP7542875B2 (https=)
KR (1) KR102866416B1 (https=)
CN (1) CN116457926B (https=)
WO (1) WO2022123645A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497920B1 (ja) 2023-08-09 2024-06-11 株式会社新川 ピックアップユニット、実装装置、およびピックアップ方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182278A (ja) * 2017-04-07 2018-11-15 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及び実装装置
JP2019054209A (ja) * 2017-09-19 2019-04-04 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4945339B2 (ja) 2007-06-22 2012-06-06 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP5227117B2 (ja) * 2008-08-29 2013-07-03 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及びピックアップ方法
US8092645B2 (en) 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
KR20190054748A (ko) * 2017-11-14 2019-05-22 에스케이하이닉스 주식회사 다이 이젝팅 장치 및 그 구동방법
TWI641070B (zh) * 2018-01-09 2018-11-11 Powertech Technology Inc. 晶片頂針裝置
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182278A (ja) * 2017-04-07 2018-11-15 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及び実装装置
JP2019054209A (ja) * 2017-09-19 2019-04-04 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット

Also Published As

Publication number Publication date
KR20230096115A (ko) 2023-06-29
JPWO2022123645A1 (https=) 2022-06-16
WO2022123645A1 (ja) 2022-06-16
JP7542875B2 (ja) 2024-09-02
KR102866416B1 (ko) 2025-09-29
CN116457926A (zh) 2023-07-18

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