KR102866416B1 - 반도체 다이의 픽업 장치 - Google Patents

반도체 다이의 픽업 장치

Info

Publication number
KR102866416B1
KR102866416B1 KR1020237018790A KR20237018790A KR102866416B1 KR 102866416 B1 KR102866416 B1 KR 102866416B1 KR 1020237018790 A KR1020237018790 A KR 1020237018790A KR 20237018790 A KR20237018790 A KR 20237018790A KR 102866416 B1 KR102866416 B1 KR 102866416B1
Authority
KR
South Korea
Prior art keywords
moving element
annular
semiconductor die
shaped
leading edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020237018790A
Other languages
English (en)
Korean (ko)
Other versions
KR20230096115A (ko
Inventor
토오루 마에다
Original Assignee
가부시키가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 신가와 filed Critical 가부시키가이샤 신가와
Publication of KR20230096115A publication Critical patent/KR20230096115A/ko
Application granted granted Critical
Publication of KR102866416B1 publication Critical patent/KR102866416B1/ko
Assigned to 야마하 로보틱스 가부시키가이샤 reassignment 야마하 로보틱스 가부시키가이샤 권리의 전부이전등록 Assignors: 가부시키가이샤 신가와
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H01L21/67132—
    • H01L21/67721—
    • H01L21/6836—
    • H01L21/6838—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H01L2221/6839—

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
KR1020237018790A 2020-12-08 2020-12-08 반도체 다이의 픽업 장치 Active KR102866416B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/045600 WO2022123645A1 (ja) 2020-12-08 2020-12-08 半導体ダイのピックアップ装置

Publications (2)

Publication Number Publication Date
KR20230096115A KR20230096115A (ko) 2023-06-29
KR102866416B1 true KR102866416B1 (ko) 2025-09-29

Family

ID=81973350

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237018790A Active KR102866416B1 (ko) 2020-12-08 2020-12-08 반도체 다이의 픽업 장치

Country Status (4)

Country Link
JP (1) JP7542875B2 (https=)
KR (1) KR102866416B1 (https=)
CN (1) CN116457926B (https=)
WO (1) WO2022123645A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497920B1 (ja) 2023-08-09 2024-06-11 株式会社新川 ピックアップユニット、実装装置、およびピックアップ方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010056466A (ja) * 2008-08-29 2010-03-11 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2018182278A (ja) * 2017-04-07 2018-11-15 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及び実装装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4574251B2 (ja) * 2003-09-17 2010-11-04 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4945339B2 (ja) 2007-06-22 2012-06-06 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US8092645B2 (en) 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP6967411B2 (ja) * 2017-09-19 2021-11-17 ファスフォードテクノロジ株式会社 半導体製造装置、半導体装置の製造方法およびコレット
KR20190054748A (ko) * 2017-11-14 2019-05-22 에스케이하이닉스 주식회사 다이 이젝팅 장치 및 그 구동방법
TWI641070B (zh) * 2018-01-09 2018-11-11 Powertech Technology Inc. 晶片頂針裝置
TWI745710B (zh) * 2018-07-06 2021-11-11 日商新川股份有限公司 半導體晶粒的拾取系統

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010056466A (ja) * 2008-08-29 2010-03-11 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
JP2018182278A (ja) * 2017-04-07 2018-11-15 芝浦メカトロニクス株式会社 半導体チップのピックアップ装置及び実装装置

Also Published As

Publication number Publication date
KR20230096115A (ko) 2023-06-29
JPWO2022123645A1 (https=) 2022-06-16
WO2022123645A1 (ja) 2022-06-16
JP7542875B2 (ja) 2024-09-02
CN116457926A (zh) 2023-07-18
CN116457926B (zh) 2025-06-17

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