JPWO2022123645A1 - - Google Patents
Info
- Publication number
- JPWO2022123645A1 JPWO2022123645A1 JP2022567917A JP2022567917A JPWO2022123645A1 JP WO2022123645 A1 JPWO2022123645 A1 JP WO2022123645A1 JP 2022567917 A JP2022567917 A JP 2022567917A JP 2022567917 A JP2022567917 A JP 2022567917A JP WO2022123645 A1 JPWO2022123645 A1 JP WO2022123645A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
- H10P72/7442—Separation by peeling
- H10P72/7444—Separation by peeling using a peeling wedge, a knife or a bar
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/045600 WO2022123645A1 (ja) | 2020-12-08 | 2020-12-08 | 半導体ダイのピックアップ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022123645A1 true JPWO2022123645A1 (https=) | 2022-06-16 |
| JPWO2022123645A5 JPWO2022123645A5 (https=) | 2023-08-25 |
| JP7542875B2 JP7542875B2 (ja) | 2024-09-02 |
Family
ID=81973350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022567917A Active JP7542875B2 (ja) | 2020-12-08 | 2020-12-08 | 半導体ダイのピックアップ装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7542875B2 (https=) |
| KR (1) | KR102866416B1 (https=) |
| CN (1) | CN116457926B (https=) |
| WO (1) | WO2022123645A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7497920B1 (ja) | 2023-08-09 | 2024-06-11 | 株式会社新川 | ピックアップユニット、実装装置、およびピックアップ方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005117019A (ja) * | 2003-09-17 | 2005-04-28 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2010056466A (ja) * | 2008-08-29 | 2010-03-11 | Shibaura Mechatronics Corp | 半導体チップのピックアップ装置及びピックアップ方法 |
| JP2018182278A (ja) * | 2017-04-07 | 2018-11-15 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置及び実装装置 |
| JP2019054209A (ja) * | 2017-09-19 | 2019-04-04 | ファスフォードテクノロジ株式会社 | 半導体製造装置、半導体装置の製造方法およびコレット |
| JP2019121775A (ja) * | 2018-01-09 | 2019-07-22 | 力成科技股▲分▼有限公司 | チップ突き上げニードル装置及びチップ突き上げニードル設備 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4945339B2 (ja) | 2007-06-22 | 2012-06-06 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| US8092645B2 (en) | 2010-02-05 | 2012-01-10 | Asm Assembly Automation Ltd | Control and monitoring system for thin die detachment and pick-up |
| KR20190054748A (ko) * | 2017-11-14 | 2019-05-22 | 에스케이하이닉스 주식회사 | 다이 이젝팅 장치 및 그 구동방법 |
| TWI745710B (zh) * | 2018-07-06 | 2021-11-11 | 日商新川股份有限公司 | 半導體晶粒的拾取系統 |
-
2020
- 2020-12-08 KR KR1020237018790A patent/KR102866416B1/ko active Active
- 2020-12-08 CN CN202080107068.3A patent/CN116457926B/zh active Active
- 2020-12-08 WO PCT/JP2020/045600 patent/WO2022123645A1/ja not_active Ceased
- 2020-12-08 JP JP2022567917A patent/JP7542875B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005117019A (ja) * | 2003-09-17 | 2005-04-28 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP2010056466A (ja) * | 2008-08-29 | 2010-03-11 | Shibaura Mechatronics Corp | 半導体チップのピックアップ装置及びピックアップ方法 |
| JP2018182278A (ja) * | 2017-04-07 | 2018-11-15 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置及び実装装置 |
| JP2019054209A (ja) * | 2017-09-19 | 2019-04-04 | ファスフォードテクノロジ株式会社 | 半導体製造装置、半導体装置の製造方法およびコレット |
| JP2019121775A (ja) * | 2018-01-09 | 2019-07-22 | 力成科技股▲分▼有限公司 | チップ突き上げニードル装置及びチップ突き上げニードル設備 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230096115A (ko) | 2023-06-29 |
| WO2022123645A1 (ja) | 2022-06-16 |
| JP7542875B2 (ja) | 2024-09-02 |
| KR102866416B1 (ko) | 2025-09-29 |
| CN116457926A (zh) | 2023-07-18 |
| CN116457926B (zh) | 2025-06-17 |
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