JP7472958B2 - 移動体装置、露光装置、及びデバイス製造方法 - Google Patents
移動体装置、露光装置、及びデバイス製造方法 Download PDFInfo
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- JP7472958B2 JP7472958B2 JP2022195713A JP2022195713A JP7472958B2 JP 7472958 B2 JP7472958 B2 JP 7472958B2 JP 2022195713 A JP2022195713 A JP 2022195713A JP 2022195713 A JP2022195713 A JP 2022195713A JP 7472958 B2 JP7472958 B2 JP 7472958B2
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- 238000005286 illumination Methods 0.000 description 23
- 239000004973 liquid crystal related substance Substances 0.000 description 15
- 238000005259 measurement Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 230000001133 acceleration Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
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- 238000012546 transfer Methods 0.000 description 3
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- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
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- 230000008602 contraction Effects 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
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- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D3/00—Control of position or direction
- G05D3/12—Control of position or direction using feedback
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Chemical & Material Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Control Of Position Or Direction (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
Claims (6)
- ベースと、
前記ベース上を駆動可能な第1移動体と、
前記第1移動体上を駆動可能な第2移動体と、
前記第2移動体を前記第1移動体上で駆動させる第1推力を付与する第1アクチュエータと、
一端が前記第1移動体に連結され、他端が前記第2移動体に連結され、前記第2移動体を前記第1移動体上で駆動させる推力として前記第1推力よりも大きい第2推力を付与する第2アクチュエータと、
前記第1移動体を前記ベース上で駆動させる第3推力または第4推力を付与する第3アクチュエータと、
前記第1乃至第3アクチュエータを制御する制御系と、
を備え、
前記第2アクチュエータは、一端が前記第1移動体に連結されるとともに他端が前記第2移動体に連結された振動減衰部であるベローズを含み、
前記制御系は、
前記ベローズ内の圧力を制御することで、前記第2アクチュエータから前記第2移動体に付与する推力を制御し、
前記第3アクチュエータから前記第1移動体に前記第3推力を付与させ、且つ前記第2アクチュエータから前記第2移動体に前記第2推力を付与させることで、
前記第1移動体及び前記第2移動体の相対移動を制限しつつ、前記第1及び第2移動体を前記ベースに対して相対移動させ、
前記第3アクチュエータから前記第1移動体に前記第4推力を付与させ、且つ前記第1アクチュエータから前記第2移動体に前記第1推力を付与させることで、
前記第2アクチュエータの前記ベローズの前記一端が前記第1移動体に連結されるとともに前記他端が前記第2移動体に連結された状態で前記第1移動体及び前記第2移動体の相対移動を可能にしつつ、前記第1移動体及び前記第2移動体を前記ベースに対して相対移動させる、
移動体装置。 - 前記第1アクチュエータは、リニアモータである請求項1に記載の移動体装置。
- 前記第2アクチュエータは、空圧アクチュエータである請求項1に記載の移動体装置。
- 請求項1に記載の移動体装置と、
前記第1移動体に保持された物体にエネルギビームを用いてパターンを形成するパターン形成装置と、を備える露光装置。 - 前記物体は、フラットパネルディスプレイ用の基板である請求項4に記載の露光装置。
- 請求項4に記載の露光装置を用いて前記物体を露光することと、
露光された前記物体を現像することと、を含むデバイス製造方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017071013 | 2017-03-31 | ||
JP2017071013 | 2017-03-31 | ||
PCT/JP2018/013656 WO2018181912A1 (ja) | 2017-03-31 | 2018-03-30 | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法 |
JP2019510257A JPWO2018181912A1 (ja) | 2017-03-31 | 2018-03-30 | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法 |
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JP2019510257A Division JPWO2018181912A1 (ja) | 2017-03-31 | 2018-03-30 | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体の駆動方法 |
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JP2023029356A JP2023029356A (ja) | 2023-03-03 |
JP7472958B2 true JP7472958B2 (ja) | 2024-04-23 |
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JP2022195713A Active JP7472958B2 (ja) | 2017-03-31 | 2022-12-07 | 移動体装置、露光装置、及びデバイス製造方法 |
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JP (2) | JPWO2018181912A1 (ja) |
KR (2) | KR102595405B1 (ja) |
CN (1) | CN110709793B (ja) |
TW (1) | TWI797114B (ja) |
WO (1) | WO2018181912A1 (ja) |
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CN113323512B (zh) * | 2020-02-28 | 2022-06-17 | 上海微电子装备(集团)股份有限公司 | 版盒解锁装置及掩模传输版库设备 |
Citations (5)
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JP2004104023A (ja) | 2002-09-12 | 2004-04-02 | Ckd Corp | 微動装置 |
JP2005251788A (ja) | 2004-03-01 | 2005-09-15 | Canon Inc | 位置決め装置およびそれを用いた露光装置 |
US20060061218A1 (en) | 2004-09-21 | 2006-03-23 | Nikon Corporation | Dual force wafer table |
JP2007027331A5 (ja) | 2005-07-14 | 2008-08-28 | ||
JP2014098731A (ja) | 2012-11-13 | 2014-05-29 | Nikon Corp | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
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JP3745167B2 (ja) * | 1998-07-29 | 2006-02-15 | キヤノン株式会社 | ステージ装置、露光装置およびデバイス製造方法ならびにステージ駆動方法 |
JP2003045785A (ja) * | 2001-08-01 | 2003-02-14 | Nikon Corp | ステージ装置及び露光装置、並びにデバイス製造方法 |
JP4211272B2 (ja) * | 2002-04-12 | 2009-01-21 | 株式会社ニコン | 露光装置及び露光方法 |
JP4458322B2 (ja) * | 2003-01-14 | 2010-04-28 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
JP2007027331A (ja) * | 2005-07-14 | 2007-02-01 | Canon Inc | 駆動装置及びこれを用いた露光装置並びにデバイス製造方法 |
JP2008147280A (ja) * | 2006-12-07 | 2008-06-26 | Nikon Corp | 露光装置 |
JP2008182210A (ja) * | 2006-12-27 | 2008-08-07 | Canon Inc | ステージ装置、露光装置及びデバイス製造方法 |
KR101590645B1 (ko) * | 2007-03-05 | 2016-02-18 | 가부시키가이샤 니콘 | 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법 |
JP4553405B2 (ja) * | 2008-12-24 | 2010-09-29 | キヤノン株式会社 | 位置決め装置、露光装置およびデバイス製造方法 |
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-
2018
- 2018-03-30 WO PCT/JP2018/013656 patent/WO2018181912A1/ja active Application Filing
- 2018-03-30 KR KR1020227028955A patent/KR102595405B1/ko active IP Right Grant
- 2018-03-30 JP JP2019510257A patent/JPWO2018181912A1/ja active Pending
- 2018-03-30 CN CN201880035547.1A patent/CN110709793B/zh active Active
- 2018-03-30 KR KR1020197028599A patent/KR102441111B1/ko active IP Right Grant
- 2018-03-30 TW TW107111169A patent/TWI797114B/zh active
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2022
- 2022-12-07 JP JP2022195713A patent/JP7472958B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004104023A (ja) | 2002-09-12 | 2004-04-02 | Ckd Corp | 微動装置 |
JP2005251788A (ja) | 2004-03-01 | 2005-09-15 | Canon Inc | 位置決め装置およびそれを用いた露光装置 |
US20060061218A1 (en) | 2004-09-21 | 2006-03-23 | Nikon Corporation | Dual force wafer table |
JP2007027331A5 (ja) | 2005-07-14 | 2008-08-28 | ||
JP2014098731A (ja) | 2012-11-13 | 2014-05-29 | Nikon Corp | 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法 |
Also Published As
Publication number | Publication date |
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TW201843706A (zh) | 2018-12-16 |
KR102595405B1 (ko) | 2023-10-27 |
WO2018181912A1 (ja) | 2018-10-04 |
KR20220122785A (ko) | 2022-09-02 |
KR20190122777A (ko) | 2019-10-30 |
JP2023029356A (ja) | 2023-03-03 |
CN110709793B (zh) | 2024-03-08 |
CN110709793A (zh) | 2020-01-17 |
KR102441111B1 (ko) | 2022-09-06 |
JPWO2018181912A1 (ja) | 2020-02-13 |
TWI797114B (zh) | 2023-04-01 |
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