AU4395999A - Exposure system, method of manufacture thereof, method of wafer transfer, deviceand method of manufacture device - Google Patents

Exposure system, method of manufacture thereof, method of wafer transfer, deviceand method of manufacture device

Info

Publication number
AU4395999A
AU4395999A AU43959/99A AU4395999A AU4395999A AU 4395999 A AU4395999 A AU 4395999A AU 43959/99 A AU43959/99 A AU 43959/99A AU 4395999 A AU4395999 A AU 4395999A AU 4395999 A AU4395999 A AU 4395999A
Authority
AU
Australia
Prior art keywords
manufacture
deviceand
wafer transfer
exposure system
manufacture device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU43959/99A
Inventor
Ken Hattori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU4395999A publication Critical patent/AU4395999A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU43959/99A 1998-07-03 1999-07-02 Exposure system, method of manufacture thereof, method of wafer transfer, deviceand method of manufacture device Abandoned AU4395999A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP10/204444 1998-07-03
JP20444498 1998-07-03
JP28317298 1998-10-06
JP10/283172 1998-10-06
PCT/JP1999/003565 WO2000002239A1 (en) 1998-07-03 1999-07-02 Exposure system, method of manufacture thereof, method of wafer transfer, device and method of manufacture device

Publications (1)

Publication Number Publication Date
AU4395999A true AU4395999A (en) 2000-01-24

Family

ID=26514472

Family Applications (1)

Application Number Title Priority Date Filing Date
AU43959/99A Abandoned AU4395999A (en) 1998-07-03 1999-07-02 Exposure system, method of manufacture thereof, method of wafer transfer, deviceand method of manufacture device

Country Status (3)

Country Link
KR (1) KR20010043979A (en)
AU (1) AU4395999A (en)
WO (1) WO2000002239A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6323616B1 (en) * 1999-03-15 2001-11-27 Berkeley Process Control, Inc. Self teaching robotic wafer handling system
JP2002224982A (en) 2000-12-01 2002-08-13 Yaskawa Electric Corp Thin substrate transfer robot and detection method of the same
US7153079B2 (en) * 2001-09-18 2006-12-26 Murata Kikai Kabushiki Kaisha Automated guided vehicle
US6835039B2 (en) * 2002-03-15 2004-12-28 Asm International N.V. Method and apparatus for batch processing of wafers in a furnace
JP4093156B2 (en) * 2003-09-11 2008-06-04 セイコーエプソン株式会社 Semiconductor device manufacturing jig, semiconductor device manufacturing method, and semiconductor device
JP5283842B2 (en) * 2006-12-18 2013-09-04 キヤノン株式会社 Processing equipment
JP5894825B2 (en) * 2012-03-21 2016-03-30 東京エレクトロン株式会社 Probe apparatus and wafer transfer unit
US9196515B2 (en) 2012-03-26 2015-11-24 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
US8903532B2 (en) 2012-03-26 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Litho cluster and modulization to enhance productivity
JP6327824B2 (en) * 2013-10-02 2018-05-23 キヤノン株式会社 Lithographic apparatus, lithography system and article manufacturing method
TWI571710B (en) * 2014-12-30 2017-02-21 力晶科技股份有限公司 Method and system for monitoring module actuation of alignment light source device in exposure apparatus
KR102441111B1 (en) * 2017-03-31 2022-09-06 가부시키가이샤 니콘 A moving body apparatus, an exposure apparatus, a manufacturing method of a flat panel display, a device manufacturing method, and a driving method of a moving body

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2789198B2 (en) * 1988-09-06 1998-08-20 キヤノン株式会社 Mask loading mechanism
JPH0338021A (en) * 1989-07-05 1991-02-19 Canon Inc Aligner
JPH09266146A (en) * 1996-03-28 1997-10-07 Nikon Corp Apparatus and method for fabricating semiconductor
JPH1098086A (en) * 1996-09-20 1998-04-14 Canon Inc Semiconductor manufacturing device and exposure control method

Also Published As

Publication number Publication date
WO2000002239A1 (en) 2000-01-13
KR20010043979A (en) 2001-05-25

Similar Documents

Publication Publication Date Title
AU5653699A (en) Parallel link mechanism, exposure system and method of manufacturing the same, and method of manufacturing devices
AU2301699A (en) System for the treatment of wafers
AU4293399A (en) Method and device for transferring wafers
AU1176199A (en) Aligner, exposure method and device manufacturing method
AU7358994A (en) Semiconductor wafer processing system
AU2549899A (en) Method and apparatus for exposure, method of manufacture of exposure tool, device, and method of manufacture of device
AU3676500A (en) Aligner, microdevice, photomask, exposure method, and method of manufacturing device
AU8756798A (en) Fabrication system, method and apparatus for microelectromechanical devices
AU6005499A (en) Substrate, stage device, method of driving stage, exposure system and exposure method
AU5706900A (en) Semiconductor device, method of manufacturing the same, and structure for mounting semiconductor device
AU5447499A (en) Exposure apparatus and exposure method, and device and method for producing the same
AU8036898A (en) Soi substrate and process for preparing the same, and semiconductor device and process for preparing the same
AU6853698A (en) Method and device for exposure control, method and device for exposure, and method of manufacture of device
AU6365499A (en) Stage device, exposure system, method of device manufacture, and device
EP0667639A3 (en) Method of manufacturing semiconductor device.
AU3538599A (en) Exposure system and method of manufacturing micro device
AU5529499A (en) Exposure apparatus and its manufacturing method, and device producing method
AU1890999A (en) Exposure system, exposure apparatus, and coating developing exposure apparatus
AU4395999A (en) Exposure system, method of manufacture thereof, method of wafer transfer, deviceand method of manufacture device
AU4779700A (en) Exposure system, method of manufacturing device, and method of environmental control of exposure system
AU2691800A (en) Exposure system, lithography system and conveying method, and device production method and device
AU1890699A (en) Exposure method and lithography system, exposure apparatus and method of producing the apparatus, and method of producing device
AU1504799A (en) Aligner, exposure method and method of manufacturing device
AU2001239776A1 (en) Silicon wafer manufacturing system and method
AU2001241521A1 (en) Wafer processing system

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase