JP7463644B2 - 多層印刷回路基板、その製造方法およびこれを用いた半導体装置 - Google Patents
多層印刷回路基板、その製造方法およびこれを用いた半導体装置 Download PDFInfo
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- JP7463644B2 JP7463644B2 JP2020539785A JP2020539785A JP7463644B2 JP 7463644 B2 JP7463644 B2 JP 7463644B2 JP 2020539785 A JP2020539785 A JP 2020539785A JP 2020539785 A JP2020539785 A JP 2020539785A JP 7463644 B2 JP7463644 B2 JP 7463644B2
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Images
Classifications
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
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Description
本出願は、2018年9月20日付の韓国特許出願第10-2018-0113248号および2019年9月19日付の韓国特許出願第10-2019-0115354号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
また、本発明は、前記多層印刷回路基板の製造方法を提供するものである。
また、本発明は、前記多層印刷回路基板を含む半導体装置を提供するものである。
発明の一実施形態によれば、絶縁パターンおよび金属パターンを含む複数のビルドアップ層を含む樹脂積層体;および前記樹脂積層体の上面および下面に形成されたレジストパターン層;を含み、前記ビルドアップ層に含まれている絶縁パターンの厚さが15μm以下である、多層印刷回路基板が提供され得る。
前記多層印刷回路基板は、絶縁パターンおよび金属パターンを含む複数のビルドアップ層を含む樹脂積層体を含み得る。前記樹脂積層体は2以上、あるいは2~20個のビルドアップ層が積層された形態をなし、パネル(Panel)と称する。前記ビルドアップ層には絶縁パターンおよび金属パターンが含まれ得る。
[化学式1-1]
[化学式2-1]
[化学式3-1]
前記熱硬化性樹脂は、ジシクロペンタジエン系エポキシ樹脂およびビフェニル系エポキシ樹脂を含み得る。具体的には、前記ジシクロペンタジエン系エポキシ樹脂100重量部に対して前記ビフェニル系エポキシ樹脂の含有量が100重量部未満、または1重量部~90重量部、または5重量部~80重量部、または10重量部~70重量部、または20重量部~50重量部であり得る。
[化学式11]
nは、0または1~50の整数である。
[化学式12]
[化学式13]
R1およびR2は、それぞれ独立して、H、CH3またはC2H5である。
[化学式14]
nは、0または1~50の整数である。
[化学式17]
nは、0または1~50の整数である。
[化学式18]
nは、0または1~50の整数である。
[化学式19]
Rは、
当量比=前記アミン硬化剤に含有された総活性水素当量/前記熱硬化性樹脂に含有された総硬化性官能基当量
前記熱可塑性樹脂は、硬化後、靭性(Toughness)を増加させる効果があり、熱膨張係数および弾性率を低くして金属薄膜の反り(Warpage)を緩和させる役割を果たすことができる。前記熱可塑性樹脂の具体的な例としては、(メタ)アクリレート系高分子が挙げられる。
[化学式5]
Rは、
nは、0または1~50の整数である。
[化学式6]
Rは、HまたはCH3であり、
nは、0または1~50の整数である。
前記多層印刷回路基板は、前記樹脂積層体の上面および下面に形成されたレジストパターン層を含み得る。前記レジストパターン層は、開口パターンを有するレジストパターンを含み得る。前記レジストパターンは、後述する多層印刷回路基板の製造方法上、レジスト層の部分的なエッチングにより得られるレジストブロックを意味する。
本発明の他の一実施形態によれば、キャリアフィルムの両面に金属層を積層しパターンを形成する第1段階と;前記金属層上に絶縁層を積層しパターンを形成する第2段階と;前記絶縁層上に金属層を積層しパターンを形成する第3段階と;前記金属層上にレジスト層を形成する第4段階と;前記第1段階のキャリアフィルムと金属層を剥離し、剥離された金属層の表面にレジスト層を積層しパターンを形成する第5段階と;を含み、前記絶縁層は、厚さが15μm以下である樹脂コーティング金属薄膜を含み、前記第3段階以降、第2段階および第3段階を1回以上繰り返して進行する多層印刷回路基板の製造方法を提供する。
本発明のさらに他の一実施形態によれば、前記一実施形態の多層印刷回路基板を含む半導体装置を提供する。前記半導体装置に含まれている多層印刷回路基板に対する内容は、前記一実施形態で上述した内容を全て含む。
前記多層印刷回路基板は公知の方法によって半導体装置に導入することができ、前記多層印刷回路基板が超薄型化および強い耐久性を有しているので、薄型化および高集積化された半導体装置にも適用可能である。
製造例1:樹脂コーティング銅箔
(1)金属薄膜コーティング用熱硬化性樹脂組成物の製造
下記表1の組成により、各成分をメチルエチルケトンに固形分40%に合わせて投入して混合した後、400rpmの速度で1日常温で攪拌し、ロータリーエバポレーター(rotary evaporator)を用いて粘度調整および脱泡を行い、金属薄膜コーティング用樹脂組成物(樹脂ワニス)を製造した。
コンマコーターで前記金属薄膜コーティング用樹脂組成物を銅箔(厚さ2μm、Mitsui社製)にコーティング(コーティング厚さ:6μm)した後、220℃および35kg/cm2の条件で100分間硬化した。次いで、17cmx15cm大きさで裁断して、製造例1の樹脂コーティング銅箔を製作した。
(1)金属薄膜コーティング用熱硬化性樹脂組成物の製造
下記表1の組成により、各成分をメチルエチルケトンに固形分40%に合わせて投入して混合した後、400rpmの速度で1日常温で攪拌し、ロータリーエバポレーター(rotary evaporator)を用いて粘度調整および脱泡を行い、金属薄膜コーティング用樹脂組成物(樹脂ワニス)を製造した。
コンマコーターで前記金属薄膜コーティング用樹脂組成物を銅箔(厚さ2μm、Mitsui社製)にコーティング(コーティング厚さ:8μm)した後、220℃および35kg/cm2の条件で100分間硬化した。次いで、17cmx15cm大きさで裁断して、製造例2の樹脂コーティング銅箔を製作した。
(1)熱硬化性樹脂組成物の製造
下記表1の組成により、各成分をメチルエチルケトンに固形分40%に合わせて投入して混合した後、400rpmの速度で1日常温で攪拌し、ロータリーエバポレーター(rotary evaporator)を用いて粘度調整および脱泡を行い、金属薄膜コーティング用樹脂組成物(樹脂ワニス)を製造した。
前記攪拌したワニスを製織したガラス繊維(Glass Fabric)(厚さ12μm、旭硝子社製)に含浸させた後、180℃の温度で2~5分間熱風乾燥して、16μm厚さのプリプレグを製造した。
(1)熱硬化性樹脂組成物の製造
下記表1の組成により、各成分をメチルエチルケトンに固形分40%に合わせて投入して混合した後、400rpmの速度で1日常温で攪拌し、ロータリーエバポレーター(rotary evaporator)を用いて粘度調整および脱泡を行い、金属薄膜コーティング用樹脂組成物(樹脂ワニス)を製造した。
前記攪拌したワニスを製織したガラス繊維(Glass Fabric)(厚さ12μm、旭硝子社製)に含浸させた後、180℃の温度で2~5分間熱風乾燥して、18μm厚さのプリプレグを製造した。
(1)金属薄膜コーティング用熱硬化性樹脂組成物の製造
下記表2の組成により、各成分をメチルエチルケトンに固形分40%に合わせて投入して混合した後、400rpmの速度で1日常温で攪拌し、ロータリーエバポレーター(rotary evaporator)を用いて粘度調整および脱泡を行い、金属薄膜コーティング用樹脂組成物(樹脂ワニス)を製造した。
コンマコーターで前記金属薄膜コーティング用樹脂組成物を銅箔(厚さ2μm、Mitsui社製)にコーティング(コーティング厚さ:6μm)した後、220℃および35kg/cm2の条件で100分間硬化した。次いで、17cmx15cm大きさで裁断して、製造例5および製造例6の樹脂コーティング銅箔を製作した。
実施例1
下記図1に示すように、次の工程順序により多層印刷回路基板を製造した。
次の工程順序により多層印刷回路基板を製造した。
比較例1
前記実施例1の工程<2>で、絶縁層D12として製造例1で得られた8μm厚さの樹脂コーティング銅箔の代わりに前記製造例3で得られた16μm厚さのプリプレグ(PPG)を使用し、絶縁層D23として製造例2で得られた10μm厚さの樹脂コーティング銅箔の代わりに前記製造例4で得られた18μm厚さのプリプレグ(PPG)を使用し、多層積層体の各層の厚さを下記表3の通り変更したことを除いて前記実施例1と同様の方法で、多層印刷回路基板を製造した。
前記実施例2の工程<2>で、絶縁層D12および絶縁層D23として製造例1で得られた8μm厚さの樹脂コーティング銅箔の代わりに前記製造例4で得られた18μm厚さのプリプレグ(PPG)を使用し、絶縁層D34として製造例2で得られた10μm厚さの樹脂コーティング銅箔の代わりに前記製造例4で得られた18μm厚さのプリプレグ(PPG)を使用し、多層積層体の各層の厚さを下記表3の通り変更したことを除いて前記実施例2と同様の方法で、多層印刷回路基板を製造した。
M0、MO':極薄銅箔
SR TOP、SR TOP':レジスト
M1、M1':銅箔層
D12、D12':絶縁層
M2、M2':銅箔層
D23、D23':絶縁層
M3、M3':銅箔層
D34、D34':絶縁層
M4、M4':銅箔層
SR BTM、SR BTM':レジスト
PN-1:第1パネル
PN-2:第2パネル
<1>~<6>:工程の進行順序
Claims (16)
- 絶縁パターンおよび金属パターンを含む複数のビルドアップ層を含む樹脂積層体と;
前記樹脂積層体の上面および下面に形成されたレジストパターン層と;を含み、
前記ビルドアップ層に含まれている絶縁パターンの厚さが6μm~8μmであり、
前記絶縁パターンは、
i)スルホン基、カルボニル基、ハロゲン基、ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキル基、ii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数6~20のアリール基、iii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数2~30のヘテロアリール基、およびiv)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキレン基からなる群から選択される1種以上の官能基を1以上含むアミン化合物;熱硬化性樹脂;熱可塑性樹脂;および無機充填材;を含み、前記アミン化合物および熱硬化性樹脂の総和100重量部に対して、前記熱可塑性樹脂を40重量部~90重量部で含み、120℃~180℃の範囲で2000Pa・s以下の複素粘度を有する金属薄膜コーティング用熱硬化性樹脂組成物の硬化物を含み、
下記数式1から計算される当量比が1.4以上である、多層印刷回路基板:
[数式1]
当量比=前記アミン化合物に含有された総活性水素当量/前記熱硬化性樹脂に含有された総硬化性官能基当量。 - 前記絶縁パターンは、
i)スルホン基、カルボニル基、ハロゲン基、ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキル基、ii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数6~20のアリール基、iii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数2~30のヘテロアリール基、およびiv)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキレン基からなる群から選択される1種以上の官能基を1以上含むアミン化合物;熱硬化性樹脂;および熱可塑性樹脂;を含む硬化物と、前記硬化物間に分散した無機充填材を含む、請求項1に記載の多層印刷回路基板。 - 前記熱硬化性樹脂は、ジシクロペンタジエン系エポキシ樹脂およびビフェニル系エポキシ樹脂を含む、請求項1または2に記載の多層印刷回路基板。
- 前記ジシクロペンタジエン系エポキシ樹脂100重量部に対して前記ビフェニル系エポキシ樹脂の含有量が100重量部未満である、請求項3に記載の多層印刷回路基板。
- 前記熱硬化性樹脂は、ビスマレイミド樹脂、シアネートエステル樹脂およびビスマレイミド-トリアジン樹脂からなる群から選択される1種以上の樹脂をさらに含む、請求項2から4のいずれか一項に記載の多層印刷回路基板。
- 前記アミン化合物100重量部に対して前記熱硬化性樹脂を400重量部以下で含む、請求項2から5のいずれか一項に記載の多層印刷回路基板。
- 前記アミン化合物は、2~5個のアミノ基を含む芳香族アミン化合物を含む、請求項2から6のいずれか一項に記載の多層印刷回路基板。
- 前記熱可塑性樹脂は、(メタ)アクリレート系高分子を含む、請求項2から7のいずれか一項に記載の多層印刷回路基板。
- 前記(メタ)アクリレート系高分子は、
(メタ)アクリレート系単量体由来の繰り返し単位と(メタ)アクリロニトリル由来の繰り返し単位が含まれているアクリル酸エステル共重合体;またはブタジエン由来の繰り返し単位が含まれているアクリル酸エステル共重合体である、請求項8に記載の多層印刷回路基板。 - 前記(メタ)アクリレート系高分子は、500,000~1,000,000の重量平均分子量を有する、請求項8または9に記載の多層印刷回路基板。
- 前記アミン化合物および熱硬化性樹脂の総和100重量部に対して前記無機充填材の含有量が200重量部~500重量部である、請求項2から10のいずれか一項に記載の多層印刷回路基板。
- 前記無機充填材は、平均粒径が異なる2種以上の無機充填材を含むことができ、
前記2種以上の無機充填材のうち少なくとも1種が平均粒径が0.1μm~100μmである無機充填材であり、他の1種が平均粒径が1nm~90nmである無機充填材である、請求項2から11のいずれか一項に記載の多層印刷回路基板。 - キャリアフィルムの両面に金属層を積層しパターンを形成する第1段階と;
前記金属層上に絶縁層を積層しパターンを形成する第2段階と;
前記絶縁層上に金属層を積層しパターンを形成する第3段階と;
前記金属層上にレジスト層を積層しパターンを形成する第4段階と;
前記第1段階のキャリアフィルムと金属層を剥離し、剥離された金属層の表面にレジスト層を形成する第5段階と;を含み、
前記絶縁層は、厚さが8μm~10μmである樹脂コーティング金属薄膜を含み、
前記第3段階以降、第2段階および第3段階を1回以上繰り返して進行し、
前記樹脂コーティング金属薄膜は、
金属箔、および
前記金属箔の少なくとも一面に形成された樹脂硬化物を含み、
前記樹脂硬化物は、i)スルホン基、カルボニル基、ハロゲン基、ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキル基、ii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数6~20のアリール基、iii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数2~30のヘテロアリール基、およびiv)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキレン基からなる群から選択される1種以上の官能基を1以上含むアミン化合物;熱硬化性樹脂;熱可塑性樹脂;および無機充填材;を含み、前記アミン化合物および熱硬化性樹脂の総和100重量部に対して、前記熱可塑性樹脂を40重量部~90重量部で含み、120℃~180℃の範囲で2000Pa・s以下の複素粘度を有する金属薄膜コーティング用熱硬化性樹脂組成物の硬化物であり、
下記数式1から計算される当量比が1.4以上である、多層印刷回路基板の製造方法:
[数式1]
当量比=前記アミン化合物に含有された総活性水素当量/前記熱硬化性樹脂に含有された総硬化性官能基当量。 - 前記第1段階のキャリアフィルムと金属層との結合力は、前記第2段階の金属層と絶縁層との結合力よりも小さい、請求項13に記載の多層印刷回路基板の製造方法。
- 前記樹脂コーティング金属薄膜は、
金属箔、および
前記金属箔の少なくとも一面に形成された樹脂硬化物と、前記樹脂硬化物間に分散した無機充填材を含み、
前記樹脂硬化物は、i)スルホン基、カルボニル基、ハロゲン基、ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキル基、ii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数6~20のアリール基、iii)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数2~30のヘテロアリール基、およびiv)ニトロ基、シアノ基またはハロゲン基で置換または非置換された炭素数1~20のアルキレン基からなる群から選択される1種以上の官能基を1以上含むアミン化合物;熱硬化性樹脂;および熱可塑性樹脂;を含む硬化物である、請求項13または14に記載の多層印刷回路基板の製造方法。 - 請求項1から12のいずれか一項に記載の多層印刷回路基板を含む、半導体装置。
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