JP7438219B2 - 高い処理量で板状ワークピースを露光する装置 - Google Patents

高い処理量で板状ワークピースを露光する装置 Download PDF

Info

Publication number
JP7438219B2
JP7438219B2 JP2021533580A JP2021533580A JP7438219B2 JP 7438219 B2 JP7438219 B2 JP 7438219B2 JP 2021533580 A JP2021533580 A JP 2021533580A JP 2021533580 A JP2021533580 A JP 2021533580A JP 7438219 B2 JP7438219 B2 JP 7438219B2
Authority
JP
Japan
Prior art keywords
workpiece
processing
unit
movement
registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021533580A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020119863A5 (enExample
JP2022512416A (ja
Inventor
シュテフェン リュッカー
ウーヴェ クロフスキー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laser Imaging Systems GmbH and Co KG
Original Assignee
Laser Imaging Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laser Imaging Systems GmbH and Co KG filed Critical Laser Imaging Systems GmbH and Co KG
Publication of JP2022512416A publication Critical patent/JP2022512416A/ja
Publication of JPWO2020119863A5 publication Critical patent/JPWO2020119863A5/ja
Application granted granted Critical
Publication of JP7438219B2 publication Critical patent/JP7438219B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
JP2021533580A 2018-12-12 2019-12-11 高い処理量で板状ワークピースを露光する装置 Active JP7438219B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018132001.9 2018-12-12
DE102018132001.9A DE102018132001A1 (de) 2018-12-12 2018-12-12 Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
PCT/DE2019/101076 WO2020119863A1 (de) 2018-12-12 2019-12-11 Vorrichtung zum belichten von plattenförmigen werkstücken mit hohem durchsatz

Publications (3)

Publication Number Publication Date
JP2022512416A JP2022512416A (ja) 2022-02-03
JPWO2020119863A5 JPWO2020119863A5 (enExample) 2023-11-08
JP7438219B2 true JP7438219B2 (ja) 2024-02-26

Family

ID=69143365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021533580A Active JP7438219B2 (ja) 2018-12-12 2019-12-11 高い処理量で板状ワークピースを露光する装置

Country Status (7)

Country Link
US (1) US11656556B2 (enExample)
EP (1) EP3894961A1 (enExample)
JP (1) JP7438219B2 (enExample)
KR (1) KR102678965B1 (enExample)
CN (1) CN113287066B (enExample)
DE (1) DE102018132001A1 (enExample)
WO (1) WO2020119863A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020124006B3 (de) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
DE102020127981B3 (de) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
CN113579575A (zh) * 2021-07-26 2021-11-02 湖北欧阳华俊专用汽车有限公司 一种瓦楞板焊接机
DE102021127226B3 (de) 2021-10-20 2022-12-22 Jenaer Antriebstechnik Gmbh Vorrichtung mit einem beweglichen Tischsystem sowie Verfahren zu dessen Kalibrierung und Betrieb
DE102021128222B4 (de) * 2021-10-29 2023-10-19 Carl Zeiss Smt Gmbh Verfahren zur Vermessung eines Substrates für die Halbleiterlithografie
CN114348607B (zh) * 2022-01-21 2024-02-06 江苏拓海微纳精密技术有限公司 定位贴标设备
DE102022109021A1 (de) 2022-04-13 2023-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Ausbilden einer Struktur an einem Werkstück
CN115055320B (zh) * 2022-08-19 2022-11-22 佛山协智领航科技有限公司 一种用于家具制造的表面喷漆设备
CN116177163A (zh) * 2022-12-29 2023-05-30 中联重科股份有限公司 箱型工件变位系统和工程机械生产线
CN117485862A (zh) * 2023-11-21 2024-02-02 深圳市镭煜科技有限公司 一种连续翻转下料装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004233608A (ja) 2003-01-30 2004-08-19 Fuji Photo Film Co Ltd 露光装置
JP2005024957A (ja) 2003-07-03 2005-01-27 Fuji Photo Film Co Ltd 画像形成装置
WO2005015615A1 (ja) 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2007102116A (ja) 2005-10-07 2007-04-19 Fujifilm Corp デジタル露光装置
JP2008191303A (ja) 2007-02-02 2008-08-21 Fujifilm Corp 描画装置及び方法
JP2009157249A (ja) 2007-12-27 2009-07-16 Orc Mfg Co Ltd 露光装置
JP2011048239A (ja) 2009-08-28 2011-03-10 Ushio Inc 両面露光装置
JP2012203265A (ja) 2011-03-25 2012-10-22 Hitachi Via Mechanics Ltd 反転装置及びそれを用いた露光装置並びに露光方法
JP2016048273A (ja) 2014-08-27 2016-04-07 株式会社オーク製作所 描画装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2832673B2 (ja) * 1993-10-29 1998-12-09 株式会社オーク製作所 露光装置およびワークの露光方法
EP0722123B1 (en) 1995-01-12 1999-04-14 Orc Manufacturing Co., Ltd. Apparatus and method for exposing of workpiece
CN1244018C (zh) 1996-11-28 2006-03-01 株式会社尼康 曝光方法和曝光装置
US6037967A (en) * 1996-12-18 2000-03-14 Etec Systems, Inc. Short wavelength pulsed laser scanner
WO1998028665A1 (en) * 1996-12-24 1998-07-02 Koninklijke Philips Electronics N.V. Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device
JPH10209039A (ja) * 1997-01-27 1998-08-07 Nikon Corp 投影露光方法及び投影露光装置
US7157038B2 (en) * 2000-09-20 2007-01-02 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
JP2002099095A (ja) 2000-09-25 2002-04-05 Orc Mfg Co Ltd 自動両面露光装置およびその方法
JP2002341550A (ja) * 2001-05-17 2002-11-27 Dainippon Screen Mfg Co Ltd レーザー露光装置
US7508515B2 (en) 2002-05-02 2009-03-24 Orbotech Ltd System and method for manufacturing printed circuit boards employing non-uniformly modified images
JP2004046051A (ja) * 2002-05-23 2004-02-12 Sanee Giken Kk 走査露光方法および走査露光装置
JP4158514B2 (ja) * 2002-12-24 2008-10-01 ウシオ電機株式会社 両面投影露光装置
US20050254032A1 (en) * 2003-11-13 2005-11-17 Fuji Photo Film Co., Ltd. Exposure device
KR101419196B1 (ko) * 2006-09-29 2014-07-15 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method
JP2008250072A (ja) * 2007-03-30 2008-10-16 Fujifilm Corp 描画装置及び方法
JP2009092723A (ja) 2007-10-04 2009-04-30 Adtec Engineeng Co Ltd 両面露光装置
JP2010181519A (ja) 2009-02-04 2010-08-19 Adtec Engineeng Co Ltd 露光装置
JP5747463B2 (ja) * 2010-08-20 2015-07-15 セイコーエプソン株式会社 記録装置およびそのワーク除給材方法
FR2988183B1 (fr) * 2012-03-13 2015-04-03 Altix Machine d'insolation de panneaux munie d'un retourneur de panneau
JP5813555B2 (ja) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法
WO2016124712A2 (en) * 2015-02-05 2016-08-11 Mycronic AB Recurring process for laser induced forward transfer and high throughput and recycling of donor material by the reuse of a plurality of target substrate plates or forward transfer of a pattern of discrete donor dots
JP5773095B1 (ja) * 2015-02-10 2015-09-02 ウシオ電機株式会社 光照射装置および光照射方法
JP2017067887A (ja) * 2015-09-29 2017-04-06 株式会社オーク製作所 露光装置
CN105182699B (zh) * 2015-09-30 2017-06-30 合肥芯碁微电子装备有限公司 一种双台面激光直写曝光机及其控制方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004233608A (ja) 2003-01-30 2004-08-19 Fuji Photo Film Co Ltd 露光装置
JP2005024957A (ja) 2003-07-03 2005-01-27 Fuji Photo Film Co Ltd 画像形成装置
WO2005015615A1 (ja) 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2007102116A (ja) 2005-10-07 2007-04-19 Fujifilm Corp デジタル露光装置
JP2008191303A (ja) 2007-02-02 2008-08-21 Fujifilm Corp 描画装置及び方法
JP2009157249A (ja) 2007-12-27 2009-07-16 Orc Mfg Co Ltd 露光装置
JP2011048239A (ja) 2009-08-28 2011-03-10 Ushio Inc 両面露光装置
JP2012203265A (ja) 2011-03-25 2012-10-22 Hitachi Via Mechanics Ltd 反転装置及びそれを用いた露光装置並びに露光方法
JP2016048273A (ja) 2014-08-27 2016-04-07 株式会社オーク製作所 描画装置

Also Published As

Publication number Publication date
DE102018132001A1 (de) 2020-06-18
CN113287066A (zh) 2021-08-20
KR20210100657A (ko) 2021-08-17
WO2020119863A1 (de) 2020-06-18
EP3894961A1 (de) 2021-10-20
US20220057721A1 (en) 2022-02-24
US11656556B2 (en) 2023-05-23
JP2022512416A (ja) 2022-02-03
CN113287066B (zh) 2025-02-25
KR102678965B1 (ko) 2024-06-26

Similar Documents

Publication Publication Date Title
JP7438219B2 (ja) 高い処理量で板状ワークピースを露光する装置
CN110099513B (zh) 基板制造装置及基板制造方法
US20220258462A1 (en) Apparatus and method for the production of three-dimensional screen-printed workpieces
US20220203670A1 (en) Apparatus and method for the production of three-dimensional screen-printed workpieces
US20220176628A1 (en) Apparatus and method for the production of three-dimensional screen-printed workpieces
CN106104818B (zh) 用于处理基板的太阳能电池生产装置，及用于处理用于产生太阳能电池的基板的方法
JP6727768B2 (ja) 基板作業装置
US5772768A (en) Printing apparatus and method
JP2007316589A (ja) 投影露光装置
JPWO2020119863A5 (enExample)
US6369877B2 (en) System, method and article of manufacture for direct image processing of printed circuit boards
JP4451385B2 (ja) 塗布処理装置及び塗布処理方法
CN103974608B (zh) 基板输送装置、基板的输送方法
JP2003243479A (ja) 搬送手段の停止位置調整機構
JP6590949B2 (ja) 実装ヘッドの移動誤差検出装置および部品実装装置
JP2013143462A (ja) 薄膜形成装置及び薄膜形成方法
JP4959271B2 (ja) 露光システムおよびワーク搬送方法
JP4902305B2 (ja) 露光装置およびアライメント方法
CN108432361A (zh) 安装头的移动误差检测装置及元件安装装置
JP2011175224A (ja) パターン形成装置
JP4177682B2 (ja) 露光機構および露光方法
JP2023121332A (ja) 実装システム、半田ペースト配置装置、フラックス塗布装置、および実装方法
JP2024120968A (ja) 基板搬送装置
JP2004045200A (ja) 被検査品の外観検査装置及び外観検査方法
JPH088591A (ja) 部品実装装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221020

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20230201

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20230203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231027

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20231027

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231114

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231225

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240116

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240213

R150 Certificate of patent or registration of utility model

Ref document number: 7438219

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150