KR102678965B1 - 높은 처리량으로 판형 작업물을 노출시키기 위한 장치 - Google Patents

높은 처리량으로 판형 작업물을 노출시키기 위한 장치 Download PDF

Info

Publication number
KR102678965B1
KR102678965B1 KR1020217020289A KR20217020289A KR102678965B1 KR 102678965 B1 KR102678965 B1 KR 102678965B1 KR 1020217020289 A KR1020217020289 A KR 1020217020289A KR 20217020289 A KR20217020289 A KR 20217020289A KR 102678965 B1 KR102678965 B1 KR 102678965B1
Authority
KR
South Korea
Prior art keywords
processing
workpiece
unit
movement
processing unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020217020289A
Other languages
English (en)
Korean (ko)
Other versions
KR20210100657A (ko
Inventor
스테판 뤼커
우베 클로우스키
Original Assignee
레이저 이미징 시스템스 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 레이저 이미징 시스템스 게엠베하 filed Critical 레이저 이미징 시스템스 게엠베하
Publication of KR20210100657A publication Critical patent/KR20210100657A/ko
Application granted granted Critical
Publication of KR102678965B1 publication Critical patent/KR102678965B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
KR1020217020289A 2018-12-12 2019-12-11 높은 처리량으로 판형 작업물을 노출시키기 위한 장치 Active KR102678965B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018132001.9A DE102018132001A1 (de) 2018-12-12 2018-12-12 Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
DE102018132001.9 2018-12-12
PCT/DE2019/101076 WO2020119863A1 (de) 2018-12-12 2019-12-11 Vorrichtung zum belichten von plattenförmigen werkstücken mit hohem durchsatz

Publications (2)

Publication Number Publication Date
KR20210100657A KR20210100657A (ko) 2021-08-17
KR102678965B1 true KR102678965B1 (ko) 2024-06-26

Family

ID=69143365

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217020289A Active KR102678965B1 (ko) 2018-12-12 2019-12-11 높은 처리량으로 판형 작업물을 노출시키기 위한 장치

Country Status (7)

Country Link
US (1) US11656556B2 (enExample)
EP (1) EP3894961A1 (enExample)
JP (1) JP7438219B2 (enExample)
KR (1) KR102678965B1 (enExample)
CN (1) CN113287066B (enExample)
DE (1) DE102018132001A1 (enExample)
WO (1) WO2020119863A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020124006B3 (de) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
DE102020127981B3 (de) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
CN113579575A (zh) * 2021-07-26 2021-11-02 湖北欧阳华俊专用汽车有限公司 一种瓦楞板焊接机
DE102021127226B3 (de) 2021-10-20 2022-12-22 Jenaer Antriebstechnik Gmbh Vorrichtung mit einem beweglichen Tischsystem sowie Verfahren zu dessen Kalibrierung und Betrieb
DE102021128222B4 (de) * 2021-10-29 2023-10-19 Carl Zeiss Smt Gmbh Verfahren zur Vermessung eines Substrates für die Halbleiterlithografie
CN114348607B (zh) * 2022-01-21 2024-02-06 江苏拓海微纳精密技术有限公司 定位贴标设备
DE102022109021A1 (de) 2022-04-13 2023-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Ausbilden einer Struktur an einem Werkstück
CN115055320B (zh) * 2022-08-19 2022-11-22 佛山协智领航科技有限公司 一种用于家具制造的表面喷漆设备
CN116177163A (zh) * 2022-12-29 2023-05-30 中联重科股份有限公司 箱型工件变位系统和工程机械生产线
CN117485862A (zh) * 2023-11-21 2024-02-02 深圳市镭煜科技有限公司 一种连续翻转下料装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090208885A1 (en) 2006-09-29 2009-08-20 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20090251679A1 (en) 2003-08-07 2009-10-08 Nikon Corporation Exposure method and exposure apparatus, stage unit, and device manufacturing method having two substrate stages with one stage temporarily positioned below the other stage

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2832673B2 (ja) * 1993-10-29 1998-12-09 株式会社オーク製作所 露光装置およびワークの露光方法
EP0722123B1 (en) 1995-01-12 1999-04-14 Orc Manufacturing Co., Ltd. Apparatus and method for exposing of workpiece
WO1998024115A1 (en) 1996-11-28 1998-06-04 Nikon Corporation Aligner and method for exposure
US6037967A (en) * 1996-12-18 2000-03-14 Etec Systems, Inc. Short wavelength pulsed laser scanner
EP1197801B1 (en) * 1996-12-24 2005-12-28 ASML Netherlands B.V. Lithographic device with two object holders
JPH10209039A (ja) * 1997-01-27 1998-08-07 Nikon Corp 投影露光方法及び投影露光装置
US7157038B2 (en) * 2000-09-20 2007-01-02 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
JP2002099095A (ja) 2000-09-25 2002-04-05 Orc Mfg Co Ltd 自動両面露光装置およびその方法
JP2002341550A (ja) * 2001-05-17 2002-11-27 Dainippon Screen Mfg Co Ltd レーザー露光装置
AU2003224400A1 (en) 2002-05-02 2003-11-17 Orbotech Ltd. A system and method for manufacturing printed circuit boards employing non-uniformly modified images
JP2004046051A (ja) * 2002-05-23 2004-02-12 Sanee Giken Kk 走査露光方法および走査露光装置
JP4158514B2 (ja) * 2002-12-24 2008-10-01 ウシオ電機株式会社 両面投影露光装置
JP2004233608A (ja) 2003-01-30 2004-08-19 Fuji Photo Film Co Ltd 露光装置
JP2005024957A (ja) 2003-07-03 2005-01-27 Fuji Photo Film Co Ltd 画像形成装置
US20050254032A1 (en) * 2003-11-13 2005-11-17 Fuji Photo Film Co., Ltd. Exposure device
JP4606990B2 (ja) 2005-10-07 2011-01-05 富士フイルム株式会社 デジタル露光装置
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method
JP4845757B2 (ja) * 2007-02-02 2011-12-28 富士フイルム株式会社 描画装置及び方法
JP2008250072A (ja) * 2007-03-30 2008-10-16 Fujifilm Corp 描画装置及び方法
JP2009092723A (ja) 2007-10-04 2009-04-30 Adtec Engineeng Co Ltd 両面露光装置
JP2009157249A (ja) 2007-12-27 2009-07-16 Orc Mfg Co Ltd 露光装置
JP2010181519A (ja) 2009-02-04 2010-08-19 Adtec Engineeng Co Ltd 露光装置
JP5333063B2 (ja) * 2009-08-28 2013-11-06 ウシオ電機株式会社 両面露光装置
JP5747463B2 (ja) * 2010-08-20 2015-07-15 セイコーエプソン株式会社 記録装置およびそのワーク除給材方法
JP5550053B2 (ja) 2011-03-25 2014-07-16 ビアメカニクス株式会社 反転装置及びそれを用いた露光装置並びに露光方法
FR2988183B1 (fr) * 2012-03-13 2015-04-03 Altix Machine d'insolation de panneaux munie d'un retourneur de panneau
JP5813555B2 (ja) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング 露光描画装置及び露光描画方法
JP6465591B2 (ja) 2014-08-27 2019-02-06 株式会社オーク製作所 描画装置
EP3253901A2 (en) * 2015-02-05 2017-12-13 Mycronic AB Recurring process for laser induced forward transfer and high throughput and recycling of donor material by the reuse of a plurality of target substrate plates or forward transfer of a pattern of discrete donor dots
JP5773095B1 (ja) * 2015-02-10 2015-09-02 ウシオ電機株式会社 光照射装置および光照射方法
JP2017067887A (ja) * 2015-09-29 2017-04-06 株式会社オーク製作所 露光装置
CN105182699B (zh) * 2015-09-30 2017-06-30 合肥芯碁微电子装备有限公司 一种双台面激光直写曝光机及其控制方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090251679A1 (en) 2003-08-07 2009-10-08 Nikon Corporation Exposure method and exposure apparatus, stage unit, and device manufacturing method having two substrate stages with one stage temporarily positioned below the other stage
US20090208885A1 (en) 2006-09-29 2009-08-20 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method

Also Published As

Publication number Publication date
KR20210100657A (ko) 2021-08-17
WO2020119863A1 (de) 2020-06-18
US20220057721A1 (en) 2022-02-24
CN113287066B (zh) 2025-02-25
JP2022512416A (ja) 2022-02-03
US11656556B2 (en) 2023-05-23
EP3894961A1 (de) 2021-10-20
JP7438219B2 (ja) 2024-02-26
CN113287066A (zh) 2021-08-20
DE102018132001A1 (de) 2020-06-18

Similar Documents

Publication Publication Date Title
KR102678965B1 (ko) 높은 처리량으로 판형 작업물을 노출시키기 위한 장치
CN108568382B (zh) 液滴排出装置、液滴排出方法、程序和计算机存储介质
TWI765961B (zh) 基板搬運裝置、基板搬運方法及記憶媒體
EP2449576B1 (en) Substrate processing system
JP5714110B2 (ja) 基板製造装置及び基板製造方法
US10391763B2 (en) Inkjet printing system and method for processing substrates
TWI627006B (zh) Marking device and pattern generating device
US20160263920A1 (en) Device and method for printing on a surface of an object
CN108296073B (zh) 基板处理装置
US7002663B2 (en) Both side projection exposure apparatus
EP3172949A1 (en) Inkjet printing system and method for processing wafers
CN106104818B (zh) 用于处理基板的太阳能电池生产装置，及用于处理用于产生太阳能电池的基板的方法
JP5114061B2 (ja) 投影露光装置
CN108305847B (zh) 基板搬运装置、基板搬运方法以及基板处理装置
JP3744179B2 (ja) 電子部品実装方法
JP4451385B2 (ja) 塗布処理装置及び塗布処理方法
JPWO2018127965A1 (ja) 部品実装ラインのフィーダ自動交換システム
JPWO2020119863A5 (enExample)
WO2019138464A1 (ja) スクリーン印刷装置
CN112566730A (zh) 绘制装置和绘制方法
JP2008224754A (ja) 分割逐次近接露光方法及び分割逐次近接露光装置
WO2011064777A1 (en) Alignment of material deposition system with substrate
CN108432361A (zh) 安装头的移动误差检测装置及元件安装装置
JPS62107887A (ja) レ−ザ加工機

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20210629

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20221018

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20240213

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20240610

PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20240624

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20240624

End annual number: 3

Start annual number: 1

PG1601 Publication of registration