CN113287066B - 用于以高生产率曝光板状工件的设备 - Google Patents

用于以高生产率曝光板状工件的设备 Download PDF

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Publication number
CN113287066B
CN113287066B CN201980088518.6A CN201980088518A CN113287066B CN 113287066 B CN113287066 B CN 113287066B CN 201980088518 A CN201980088518 A CN 201980088518A CN 113287066 B CN113287066 B CN 113287066B
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China
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workpiece
unit
processing
movement
machining
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CN201980088518.6A
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Chinese (zh)
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CN113287066A (zh
Inventor
斯特芬·吕克
乌韦·克洛斯基
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Laser Imaging Systems GmbH
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Laser Imaging Systems GmbH
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0823Devices involving rotation of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02Carriages for supporting the welding or cutting element
    • B23K37/0211Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70025Production of exposure light, i.e. light sources by lasers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/086Supply management, e.g. supply of components or of substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
CN201980088518.6A 2018-12-12 2019-12-11 用于以高生产率曝光板状工件的设备 Active CN113287066B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018132001.9 2018-12-12
DE102018132001.9A DE102018132001A1 (de) 2018-12-12 2018-12-12 Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
PCT/DE2019/101076 WO2020119863A1 (de) 2018-12-12 2019-12-11 Vorrichtung zum belichten von plattenförmigen werkstücken mit hohem durchsatz

Publications (2)

Publication Number Publication Date
CN113287066A CN113287066A (zh) 2021-08-20
CN113287066B true CN113287066B (zh) 2025-02-25

Family

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CN201980088518.6A Active CN113287066B (zh) 2018-12-12 2019-12-11 用于以高生产率曝光板状工件的设备

Country Status (7)

Country Link
US (1) US11656556B2 (enExample)
EP (1) EP3894961A1 (enExample)
JP (1) JP7438219B2 (enExample)
KR (1) KR102678965B1 (enExample)
CN (1) CN113287066B (enExample)
DE (1) DE102018132001A1 (enExample)
WO (1) WO2020119863A1 (enExample)

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DE102020124006B3 (de) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
DE102020127981B3 (de) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
CN113579575A (zh) * 2021-07-26 2021-11-02 湖北欧阳华俊专用汽车有限公司 一种瓦楞板焊接机
DE102021127226B3 (de) 2021-10-20 2022-12-22 Jenaer Antriebstechnik Gmbh Vorrichtung mit einem beweglichen Tischsystem sowie Verfahren zu dessen Kalibrierung und Betrieb
DE102021128222B4 (de) * 2021-10-29 2023-10-19 Carl Zeiss Smt Gmbh Verfahren zur Vermessung eines Substrates für die Halbleiterlithografie
CN114348607B (zh) * 2022-01-21 2024-02-06 江苏拓海微纳精密技术有限公司 定位贴标设备
DE102022109021A1 (de) 2022-04-13 2023-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Ausbilden einer Struktur an einem Werkstück
CN115055320B (zh) * 2022-08-19 2022-11-22 佛山协智领航科技有限公司 一种用于家具制造的表面喷漆设备
CN116177163A (zh) * 2022-12-29 2023-05-30 中联重科股份有限公司 箱型工件变位系统和工程机械生产线
CN117485862A (zh) * 2023-11-21 2024-02-02 深圳市镭煜科技有限公司 一种连续翻转下料装置

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JP2017067887A (ja) * 2015-09-29 2017-04-06 株式会社オーク製作所 露光装置

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Also Published As

Publication number Publication date
DE102018132001A1 (de) 2020-06-18
CN113287066A (zh) 2021-08-20
KR20210100657A (ko) 2021-08-17
WO2020119863A1 (de) 2020-06-18
EP3894961A1 (de) 2021-10-20
US20220057721A1 (en) 2022-02-24
US11656556B2 (en) 2023-05-23
JP7438219B2 (ja) 2024-02-26
JP2022512416A (ja) 2022-02-03
KR102678965B1 (ko) 2024-06-26

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