DE102018132001A1 - Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz - Google Patents

Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz Download PDF

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Publication number
DE102018132001A1
DE102018132001A1 DE102018132001.9A DE102018132001A DE102018132001A1 DE 102018132001 A1 DE102018132001 A1 DE 102018132001A1 DE 102018132001 A DE102018132001 A DE 102018132001A DE 102018132001 A1 DE102018132001 A1 DE 102018132001A1
Authority
DE
Germany
Prior art keywords
processing
workpiece
unit
movement
tables
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102018132001.9A
Other languages
German (de)
English (en)
Inventor
Steffen Rücker
Uwe KLOWSKY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laser Imaging Systems GmbH
Original Assignee
Laser Imaging Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laser Imaging Systems GmbH filed Critical Laser Imaging Systems GmbH
Priority to DE102018132001.9A priority Critical patent/DE102018132001A1/de
Priority to US17/413,501 priority patent/US11656556B2/en
Priority to KR1020217020289A priority patent/KR102678965B1/ko
Priority to PCT/DE2019/101076 priority patent/WO2020119863A1/de
Priority to CN201980088518.6A priority patent/CN113287066B/zh
Priority to EP19832544.1A priority patent/EP3894961A1/de
Priority to JP2021533580A priority patent/JP7438219B2/ja
Publication of DE102018132001A1 publication Critical patent/DE102018132001A1/de
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • B23K37/0235—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track the guide member forming part of a portal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70025—Production of exposure light, i.e. light sources by lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Laser Beam Processing (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
DE102018132001.9A 2018-12-12 2018-12-12 Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz Pending DE102018132001A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102018132001.9A DE102018132001A1 (de) 2018-12-12 2018-12-12 Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz
US17/413,501 US11656556B2 (en) 2018-12-12 2019-12-11 Apparatus for the exposure of plate-shaped workpieces with high throughput
KR1020217020289A KR102678965B1 (ko) 2018-12-12 2019-12-11 높은 처리량으로 판형 작업물을 노출시키기 위한 장치
PCT/DE2019/101076 WO2020119863A1 (de) 2018-12-12 2019-12-11 Vorrichtung zum belichten von plattenförmigen werkstücken mit hohem durchsatz
CN201980088518.6A CN113287066B (zh) 2018-12-12 2019-12-11 用于以高生产率曝光板状工件的设备
EP19832544.1A EP3894961A1 (de) 2018-12-12 2019-12-11 Vorrichtung zum belichten von plattenförmigen werkstücken mit hohem durchsatz
JP2021533580A JP7438219B2 (ja) 2018-12-12 2019-12-11 高い処理量で板状ワークピースを露光する装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018132001.9A DE102018132001A1 (de) 2018-12-12 2018-12-12 Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz

Publications (1)

Publication Number Publication Date
DE102018132001A1 true DE102018132001A1 (de) 2020-06-18

Family

ID=69143365

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018132001.9A Pending DE102018132001A1 (de) 2018-12-12 2018-12-12 Vorrichtung zum Belichten von plattenförmigen Werkstücken mit hohem Durchsatz

Country Status (7)

Country Link
US (1) US11656556B2 (enExample)
EP (1) EP3894961A1 (enExample)
JP (1) JP7438219B2 (enExample)
KR (1) KR102678965B1 (enExample)
CN (1) CN113287066B (enExample)
DE (1) DE102018132001A1 (enExample)
WO (1) WO2020119863A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020127981B3 (de) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
DE102020124006B3 (de) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
DE102021127226B3 (de) 2021-10-20 2022-12-22 Jenaer Antriebstechnik Gmbh Vorrichtung mit einem beweglichen Tischsystem sowie Verfahren zu dessen Kalibrierung und Betrieb
DE102022109021A1 (de) 2022-04-13 2023-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Ausbilden einer Struktur an einem Werkstück

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113579575A (zh) * 2021-07-26 2021-11-02 湖北欧阳华俊专用汽车有限公司 一种瓦楞板焊接机
DE102021128222B4 (de) * 2021-10-29 2023-10-19 Carl Zeiss Smt Gmbh Verfahren zur Vermessung eines Substrates für die Halbleiterlithografie
CN114348607B (zh) * 2022-01-21 2024-02-06 江苏拓海微纳精密技术有限公司 定位贴标设备
CN115055320B (zh) * 2022-08-19 2022-11-22 佛山协智领航科技有限公司 一种用于家具制造的表面喷漆设备
CN116177163A (zh) * 2022-12-29 2023-05-30 中联重科股份有限公司 箱型工件变位系统和工程机械生产线
CN117485862A (zh) * 2023-11-21 2024-02-02 深圳市镭煜科技有限公司 一种连续翻转下料装置

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WO2003094582A2 (en) 2002-05-02 2003-11-13 Orbotech Ltd. A system and method for manufacturing printed circuit boards employing non-uniformly modified images
US6806945B2 (en) 2000-09-25 2004-10-19 Orc Manufacturing Co., Ltd. Automatic exposing apparatus and method for exposing both sides of works
JP2009092723A (ja) 2007-10-04 2009-04-30 Adtec Engineeng Co Ltd 両面露光装置
US20090208885A1 (en) * 2006-09-29 2009-08-20 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
US20090251679A1 (en) * 2003-08-07 2009-10-08 Nikon Corporation Exposure method and exposure apparatus, stage unit, and device manufacturing method having two substrate stages with one stage temporarily positioned below the other stage
JP2010181519A (ja) 2009-02-04 2010-08-19 Adtec Engineeng Co Ltd 露光装置

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EP0951054A1 (en) 1996-11-28 1999-10-20 Nikon Corporation Aligner and method for exposure
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020124006B3 (de) 2020-09-15 2022-01-05 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
WO2022057981A1 (de) 2020-09-15 2022-03-24 Laser Imaging Systems Gmbh Belichtungssteuerung bei photolithographischen direktbelichtungsverfahren zur leiterplatten- oder schaltkreisherstellung
US12169370B2 (en) 2020-09-15 2024-12-17 Laser Imaging Systems Gmbh Exposure control in photolithographic direct exposure methods for manufacturing circuit boards or circuits
DE102020127981B3 (de) 2020-10-23 2021-12-16 Laser Imaging Systems Gmbh Wendevorrichtung zum Handhaben empfindlicher Substrate bei der Belichtung von zweidimensionalen Strukturen auf beiden Substratoberflächen
DE102021127226B3 (de) 2021-10-20 2022-12-22 Jenaer Antriebstechnik Gmbh Vorrichtung mit einem beweglichen Tischsystem sowie Verfahren zu dessen Kalibrierung und Betrieb
DE102022109021A1 (de) 2022-04-13 2023-10-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Ausbilden einer Struktur an einem Werkstück

Also Published As

Publication number Publication date
CN113287066A (zh) 2021-08-20
KR20210100657A (ko) 2021-08-17
WO2020119863A1 (de) 2020-06-18
EP3894961A1 (de) 2021-10-20
US20220057721A1 (en) 2022-02-24
US11656556B2 (en) 2023-05-23
JP7438219B2 (ja) 2024-02-26
JP2022512416A (ja) 2022-02-03
CN113287066B (zh) 2025-02-25
KR102678965B1 (ko) 2024-06-26

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