JP7350114B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP7350114B2
JP7350114B2 JP2022032441A JP2022032441A JP7350114B2 JP 7350114 B2 JP7350114 B2 JP 7350114B2 JP 2022032441 A JP2022032441 A JP 2022032441A JP 2022032441 A JP2022032441 A JP 2022032441A JP 7350114 B2 JP7350114 B2 JP 7350114B2
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Japan
Prior art keywords
section
substrate
horizontal direction
cooling
transport
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JP2022032441A
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English (en)
Japanese (ja)
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JP2023128234A (ja
Inventor
宗明 大宅
武 三ツ林
敬亮 森井
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2022032441A priority Critical patent/JP7350114B2/ja
Priority to TW111144511A priority patent/TWI833460B/zh
Priority to KR1020230004623A priority patent/KR102627210B1/ko
Priority to CN202310219017.5A priority patent/CN116705678B/zh
Publication of JP2023128234A publication Critical patent/JP2023128234A/ja
Application granted granted Critical
Publication of JP7350114B2 publication Critical patent/JP7350114B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2022032441A 2022-03-03 2022-03-03 基板処理装置および基板処理方法 Active JP7350114B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2022032441A JP7350114B2 (ja) 2022-03-03 2022-03-03 基板処理装置および基板処理方法
TW111144511A TWI833460B (zh) 2022-03-03 2022-11-22 基板處理裝置及基板處理方法
KR1020230004623A KR102627210B1 (ko) 2022-03-03 2023-01-12 기판 처리 장치 및 기판 처리 방법
CN202310219017.5A CN116705678B (zh) 2022-03-03 2023-03-01 基板处理装置以及基板处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022032441A JP7350114B2 (ja) 2022-03-03 2022-03-03 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JP2023128234A JP2023128234A (ja) 2023-09-14
JP7350114B2 true JP7350114B2 (ja) 2023-09-25

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JP2022032441A Active JP7350114B2 (ja) 2022-03-03 2022-03-03 基板処理装置および基板処理方法

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JP (1) JP7350114B2 (zh)
KR (1) KR102627210B1 (zh)
CN (1) CN116705678B (zh)
TW (1) TWI833460B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340846A (ja) 2005-06-17 2005-12-08 Yoshitake Ito 基板処理装置及び基板処理方法並びに基板の製造方法
JP2007324562A (ja) 2006-06-05 2007-12-13 Lg Phillips Lcd Co Ltd フォト装置及び方法
JP2020107747A (ja) 2018-12-27 2020-07-09 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3338343B2 (ja) * 1992-12-21 2002-10-28 大日本スクリーン製造株式会社 基板処理装置
JP3595760B2 (ja) * 2000-07-19 2004-12-02 東京エレクトロン株式会社 薄膜形成装置および基板洗浄装置
TW533460B (en) 2001-03-09 2003-05-21 Tokyo Electron Ltd Processing apparatus
JP4286596B2 (ja) * 2003-07-01 2009-07-01 大日本スクリーン製造株式会社 基板処理システム
JP4542984B2 (ja) * 2005-11-24 2010-09-15 東京エレクトロン株式会社 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
JP2008300578A (ja) 2007-05-30 2008-12-11 Canon Inc 露光装置およびデバイス製造方法
JP4954162B2 (ja) * 2008-08-29 2012-06-13 東京エレクトロン株式会社 処理システム
JP6407629B2 (ja) * 2014-08-29 2018-10-17 株式会社Ｓｃｒｅｅｎホールディングス 搬送装置および基板処理装置
JP7097759B2 (ja) 2018-06-22 2022-07-08 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7232596B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7232593B2 (ja) * 2018-08-30 2023-03-03 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7186605B2 (ja) * 2018-12-27 2022-12-09 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP7247743B2 (ja) * 2019-05-20 2023-03-29 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6994489B2 (ja) * 2019-10-02 2022-01-14 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
JP7414664B2 (ja) * 2020-08-12 2024-01-16 東京エレクトロン株式会社 温度測定ユニット、熱処理装置及び温度測定方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340846A (ja) 2005-06-17 2005-12-08 Yoshitake Ito 基板処理装置及び基板処理方法並びに基板の製造方法
JP2007324562A (ja) 2006-06-05 2007-12-13 Lg Phillips Lcd Co Ltd フォト装置及び方法
JP2020107747A (ja) 2018-12-27 2020-07-09 東京エレクトロン株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
CN116705678B (zh) 2024-01-30
TWI833460B (zh) 2024-02-21
KR20230130525A (ko) 2023-09-12
CN116705678A (zh) 2023-09-05
KR102627210B1 (ko) 2024-01-19
JP2023128234A (ja) 2023-09-14
TW202336822A (zh) 2023-09-16

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