JP7344681B2 - ウエーハユニットの飛び出し防止治具 - Google Patents
ウエーハユニットの飛び出し防止治具 Download PDFInfo
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- JP7344681B2 JP7344681B2 JP2019112882A JP2019112882A JP7344681B2 JP 7344681 B2 JP7344681 B2 JP 7344681B2 JP 2019112882 A JP2019112882 A JP 2019112882A JP 2019112882 A JP2019112882 A JP 2019112882A JP 7344681 B2 JP7344681 B2 JP 7344681B2
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- Prior art keywords
- insertion groove
- cassette
- wafer unit
- bar
- wafer
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Description
本発明の実施形態1に係るウエーハユニットの飛び出し防止治具を図面に基づいて説明する。図1は、実施形態1に係るウエーハユニットの飛び出し防止治具の構成例を示す斜視図である。図2は、図1に示されたウエーハユニットの飛び出し防止治具がカセットに取り付けられた状態を示す斜視図である。図3は、図2に示されたカセットの斜視図である。図4は、図1中のIV-IV線に沿う断面図である。
本発明の実施形態1の変形例1に係るウエーハユニットの飛び出し防止治具を図面に基づいて説明する。図9は、実施形態1の変形例1に係るウエーハユニットの飛び出し防止治具のバー取り付け部の断面図である。なお、図9は、実施形態1と同一部分に同一符号を付して説明を省略する。
本発明の実施形態1の変形例2に係るウエーハユニットの飛び出し防止治具を図面に基づいて説明する。図10は、実施形態1の変形例2に係るウエーハユニットの飛び出し防止治具のガイドピンの断面図である。なお、図10は、実施形態1と同一部分に同一符号を付して説明を省略する。
2 ロックバー
3,3-2 ガイドピン
24 ロック部
25 アンロック部
30 下端部
32 頭部(下端部)
50 カセット
51 側板
54 背部板(背止部)
56 開口部
100 ウエーハユニット
101 ウエーハ
102 粘着テープ
103 フレーム
511 内面
512 挿入溝
Claims (1)
- 粘着テープを介してフレームとウエーハを一体化させたウエーハユニットを挿入する挿入溝を内面に備え、挿入溝を対面させた側板と、
ウエーハユニットを背部で支持する背止部と、
を有するカセットに取り付けられて使用する、該カセットからウエーハユニットが飛び出すのを防止する飛び出し防止治具であって、
該側板の開口部側に取り外し可能に配設され、
該挿入溝の高さに対応し該挿入溝を遮断可能にする複数のロック部と、該挿入溝を連通可能にするアンロック部と、を交互に備えるロックバーと、
該ロックバーと連接し、該側板の底部より下側に突出して形成され、下端部が押圧されると該ロックバーを上方向に付勢するガイドピンと、
を備え、
該ガイドピンの下端部が押圧されると、該ロックバーが上方向に付勢され、
該アンロック部と該挿入溝とが一致することで該アンロック部と該挿入溝とを連通し、該開口部から該挿入溝にウエーハユニットが挿入可能な開状態となり、
該ガイドピンの下端部に対する押圧が解除されると、該ロックバーが自重で下方向に移動し、
該アンロック部と該挿入溝とが上下方向に段違いになることで該ロック部で該挿入溝を遮断し、該挿入溝に挿入されたウエーハユニットが取り出し不可な閉状態となるとともに、
該ロックバーは、
直線状に延び、かつ複数の該ロック部と複数の該アンロック部とを長手方向に交互に備えたバー本体と、
該バー本体の長手方向の両端から互いに同方向に延在した一対の取り付け片と、
各取り付け片に設けられ、先端部が該側板の上面及び下面それぞれに形成された凹部内に挿入されて、該ロックバーを該カセットに取り付ける一対のバー取り付け部と、
を備えることを特徴とする、
ウエーハユニットの飛び出し防止治具。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019112882A JP7344681B2 (ja) | 2019-06-18 | 2019-06-18 | ウエーハユニットの飛び出し防止治具 |
SG10202005161WA SG10202005161WA (en) | 2019-06-18 | 2020-06-01 | Anti-ejection apparatus for wafer units |
KR1020200066941A KR20200144475A (ko) | 2019-06-18 | 2020-06-03 | 웨이퍼 유닛의 튀어나옴 방지 장치 |
CN202010528723.4A CN112103226A (zh) | 2019-06-18 | 2020-06-11 | 晶片单元的飞出防止装置 |
US16/898,563 US11211276B2 (en) | 2019-06-18 | 2020-06-11 | Anti-ejection apparatus for wafer units |
TW109120162A TW202100429A (zh) | 2019-06-18 | 2020-06-16 | 晶圓單元的跳出防止裝置 |
DE102020207489.5A DE102020207489B4 (de) | 2019-06-18 | 2020-06-17 | Anti-auswurf-vorrichtung für wafereinheiten |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019112882A JP7344681B2 (ja) | 2019-06-18 | 2019-06-18 | ウエーハユニットの飛び出し防止治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020205375A JP2020205375A (ja) | 2020-12-24 |
JP7344681B2 true JP7344681B2 (ja) | 2023-09-14 |
Family
ID=73654482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019112882A Active JP7344681B2 (ja) | 2019-06-18 | 2019-06-18 | ウエーハユニットの飛び出し防止治具 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11211276B2 (ja) |
JP (1) | JP7344681B2 (ja) |
KR (1) | KR20200144475A (ja) |
CN (1) | CN112103226A (ja) |
DE (1) | DE102020207489B4 (ja) |
SG (1) | SG10202005161WA (ja) |
TW (1) | TW202100429A (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11594438B2 (en) * | 2021-06-04 | 2023-02-28 | STATS ChipPAC Pte. Ltd. | Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processes |
CN114104497A (zh) * | 2021-12-13 | 2022-03-01 | 湖南越摩先进半导体有限公司 | 一种防掉料的料盒 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3014870U (ja) | 1995-02-17 | 1995-08-22 | 株式会社三ツ矢 | ウエハリング用ラック |
JP2001102394A (ja) | 1999-10-01 | 2001-04-13 | Seiko Epson Corp | 搬送用キャリア |
JP2013161972A (ja) | 2012-02-06 | 2013-08-19 | Disco Abrasive Syst Ltd | 収容カセット |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US2953253A (en) * | 1958-02-17 | 1960-09-20 | William P Henderson | Windshield container |
JPS5249979Y2 (ja) * | 1975-03-03 | 1977-11-12 | ||
US4228902A (en) * | 1979-02-21 | 1980-10-21 | Kasper Instruments, Inc. | Carrier for semiconductive wafers |
JPH03173455A (ja) * | 1989-12-01 | 1991-07-26 | Mitsubishi Electric Corp | ウエハのマガジン |
US5128833A (en) * | 1991-03-26 | 1992-07-07 | Alcatel Network Systems, Inc. | Self-locking system for circuit board holding frames |
JPH0853187A (ja) * | 1994-08-09 | 1996-02-27 | Sony Corp | 板状物品収納用キャリア |
US5638958A (en) * | 1995-09-08 | 1997-06-17 | Micron Technology, Inc. | Semiconductor film wafer cassette |
US5853214A (en) * | 1995-11-27 | 1998-12-29 | Progressive System Technologies, Inc. | Aligner for a substrate carrier |
JP3212890B2 (ja) * | 1996-10-15 | 2001-09-25 | 九州日本電気株式会社 | ウェハキャリア |
TW549569U (en) * | 2002-11-13 | 2003-08-21 | Foxsemicon Integrated Tech Inc | Substrate cassette |
KR100573896B1 (ko) * | 2004-08-16 | 2006-04-26 | 동부일렉트로닉스 주식회사 | 웨이퍼 이탈방지 장치 및 방법 |
JP2009010119A (ja) * | 2007-06-27 | 2009-01-15 | Elpida Memory Inc | 基板収容容器 |
JP2013157381A (ja) | 2012-01-27 | 2013-08-15 | Disco Abrasive Syst Ltd | ウェーハ処理装置 |
KR101898134B1 (ko) * | 2012-03-30 | 2018-10-05 | 삼성전자주식회사 | 리드 프레임 이송용 매거진 |
JP6189047B2 (ja) * | 2013-02-18 | 2017-08-30 | 株式会社ディスコ | カセット |
KR102153998B1 (ko) * | 2013-02-19 | 2020-09-10 | 삼성디스플레이 주식회사 | 기판 수납 장치 |
JP2016119354A (ja) | 2014-12-19 | 2016-06-30 | 株式会社ディスコ | カセット |
-
2019
- 2019-06-18 JP JP2019112882A patent/JP7344681B2/ja active Active
-
2020
- 2020-06-01 SG SG10202005161WA patent/SG10202005161WA/en unknown
- 2020-06-03 KR KR1020200066941A patent/KR20200144475A/ko not_active Application Discontinuation
- 2020-06-11 US US16/898,563 patent/US11211276B2/en active Active
- 2020-06-11 CN CN202010528723.4A patent/CN112103226A/zh active Pending
- 2020-06-16 TW TW109120162A patent/TW202100429A/zh unknown
- 2020-06-17 DE DE102020207489.5A patent/DE102020207489B4/de active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3014870U (ja) | 1995-02-17 | 1995-08-22 | 株式会社三ツ矢 | ウエハリング用ラック |
JP2001102394A (ja) | 1999-10-01 | 2001-04-13 | Seiko Epson Corp | 搬送用キャリア |
JP2013161972A (ja) | 2012-02-06 | 2013-08-19 | Disco Abrasive Syst Ltd | 収容カセット |
Also Published As
Publication number | Publication date |
---|---|
DE102020207489A1 (de) | 2020-12-24 |
CN112103226A (zh) | 2020-12-18 |
TW202100429A (zh) | 2021-01-01 |
KR20200144475A (ko) | 2020-12-29 |
US20200402825A1 (en) | 2020-12-24 |
SG10202005161WA (en) | 2021-01-28 |
DE102020207489B4 (de) | 2023-10-05 |
JP2020205375A (ja) | 2020-12-24 |
US11211276B2 (en) | 2021-12-28 |
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