SG10202005161WA - Anti-ejection apparatus for wafer units - Google Patents

Anti-ejection apparatus for wafer units

Info

Publication number
SG10202005161WA
SG10202005161WA SG10202005161WA SG10202005161WA SG10202005161WA SG 10202005161W A SG10202005161W A SG 10202005161WA SG 10202005161W A SG10202005161W A SG 10202005161WA SG 10202005161W A SG10202005161W A SG 10202005161WA SG 10202005161W A SG10202005161W A SG 10202005161WA
Authority
SG
Singapore
Prior art keywords
ejection apparatus
wafer units
wafer
units
ejection
Prior art date
Application number
SG10202005161WA
Inventor
Soejima Yoshikatsu
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202005161WA publication Critical patent/SG10202005161WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
SG10202005161WA 2019-06-18 2020-06-01 Anti-ejection apparatus for wafer units SG10202005161WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019112882A JP7344681B2 (en) 2019-06-18 2019-06-18 Wafer unit pop-out prevention jig

Publications (1)

Publication Number Publication Date
SG10202005161WA true SG10202005161WA (en) 2021-01-28

Family

ID=73654482

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202005161WA SG10202005161WA (en) 2019-06-18 2020-06-01 Anti-ejection apparatus for wafer units

Country Status (7)

Country Link
US (1) US11211276B2 (en)
JP (1) JP7344681B2 (en)
KR (1) KR20200144475A (en)
CN (1) CN112103226A (en)
DE (1) DE102020207489B4 (en)
SG (1) SG10202005161WA (en)
TW (1) TW202100429A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11594438B2 (en) * 2021-06-04 2023-02-28 STATS ChipPAC Pte. Ltd. Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processes
CN114104497A (en) * 2021-12-13 2022-03-01 湖南越摩先进半导体有限公司 Material dropping prevention material box

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2953253A (en) * 1958-02-17 1960-09-20 William P Henderson Windshield container
JPS5249979Y2 (en) * 1975-03-03 1977-11-12
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
JPH03173455A (en) * 1989-12-01 1991-07-26 Mitsubishi Electric Corp Magazine for wafers
US5128833A (en) * 1991-03-26 1992-07-07 Alcatel Network Systems, Inc. Self-locking system for circuit board holding frames
JPH0853187A (en) * 1994-08-09 1996-02-27 Sony Corp Carrier for storing plate-like article
JP3014870U (en) * 1995-02-17 1995-08-22 株式会社三ツ矢 Wafer ring rack
US5638958A (en) * 1995-09-08 1997-06-17 Micron Technology, Inc. Semiconductor film wafer cassette
US5853214A (en) * 1995-11-27 1998-12-29 Progressive System Technologies, Inc. Aligner for a substrate carrier
JP3212890B2 (en) * 1996-10-15 2001-09-25 九州日本電気株式会社 Wafer carrier
JP2001102394A (en) * 1999-10-01 2001-04-13 Seiko Epson Corp Carrier
TW549569U (en) * 2002-11-13 2003-08-21 Foxsemicon Integrated Tech Inc Substrate cassette
KR100573896B1 (en) * 2004-08-16 2006-04-26 동부일렉트로닉스 주식회사 Apparatus and method for preventing wafer separation in a carrier box
JP2009010119A (en) * 2007-06-27 2009-01-15 Elpida Memory Inc Substrate storing container
JP2013157381A (en) 2012-01-27 2013-08-15 Disco Abrasive Syst Ltd Wafer processing apparatus
JP5982128B2 (en) * 2012-02-06 2016-08-31 株式会社ディスコ Containment cassette
KR101898134B1 (en) * 2012-03-30 2018-10-05 삼성전자주식회사 Magazine for loading of a lead frame
JP6189047B2 (en) * 2013-02-18 2017-08-30 株式会社ディスコ cassette
KR102153998B1 (en) * 2013-02-19 2020-09-10 삼성디스플레이 주식회사 Substrate Loading Device
JP2016119354A (en) 2014-12-19 2016-06-30 株式会社ディスコ cassette

Also Published As

Publication number Publication date
CN112103226A (en) 2020-12-18
JP7344681B2 (en) 2023-09-14
DE102020207489A1 (en) 2020-12-24
TW202100429A (en) 2021-01-01
JP2020205375A (en) 2020-12-24
DE102020207489B4 (en) 2023-10-05
US11211276B2 (en) 2021-12-28
KR20200144475A (en) 2020-12-29
US20200402825A1 (en) 2020-12-24

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