SG10202009275VA - Processing apparatus - Google Patents

Processing apparatus

Info

Publication number
SG10202009275VA
SG10202009275VA SG10202009275VA SG10202009275VA SG10202009275VA SG 10202009275V A SG10202009275V A SG 10202009275VA SG 10202009275V A SG10202009275V A SG 10202009275VA SG 10202009275V A SG10202009275V A SG 10202009275VA SG 10202009275V A SG10202009275V A SG 10202009275VA
Authority
SG
Singapore
Prior art keywords
processing apparatus
processing
Prior art date
Application number
SG10202009275VA
Inventor
Terada Kazuki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10202009275VA publication Critical patent/SG10202009275VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/12—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/155—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling
    • B23Q3/157—Arrangements for automatic insertion or removal of tools, e.g. combined with manual handling of rotary tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
    • B27B5/00—Sawing machines working with circular or cylindrical saw blades; Components or equipment therefor
    • B27B5/29—Details; Component parts; Accessories
    • B27B5/30—Details; Component parts; Accessories for mounting or securing saw blades or saw spindles
    • B27B5/32—Devices for securing circular saw blades to the saw spindle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Forests & Forestry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Automatic Tool Replacement In Machine Tools (AREA)
SG10202009275VA 2019-10-10 2020-09-21 Processing apparatus SG10202009275VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019187105A JP7285754B2 (en) 2019-10-10 2019-10-10 processing equipment

Publications (1)

Publication Number Publication Date
SG10202009275VA true SG10202009275VA (en) 2021-05-28

Family

ID=75155688

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202009275VA SG10202009275VA (en) 2019-10-10 2020-09-21 Processing apparatus

Country Status (6)

Country Link
US (1) US11820042B2 (en)
JP (1) JP7285754B2 (en)
KR (1) KR20210042806A (en)
CN (1) CN112643512B (en)
DE (1) DE102020212785A1 (en)
SG (1) SG10202009275VA (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022210391A1 (en) 2021-03-31 2022-10-06
TWI765709B (en) * 2021-05-19 2022-05-21 佳陞科技有限公司 Cutting tool changing device and operating method for cutting tool changing device
CN114267610B (en) * 2021-12-01 2023-03-24 智程半导体设备科技(昆山)有限公司 Wafer basket clamping anti-drop manipulator with alarm function
CN117840891B (en) * 2024-03-08 2024-06-07 山东大业股份有限公司 Tire bead steel wire roll feeding equipment

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5220749A (en) * 1991-11-07 1993-06-22 The University Of Rochester Grinding apparatus
JPH10249726A (en) * 1997-03-17 1998-09-22 Amada Washino Co Ltd Automatic measurement method and device at grinding stone end
JPH10340867A (en) * 1997-06-05 1998-12-22 Tokyo Seimitsu Co Ltd Automatic blade exchange system
JP2009202323A (en) * 2008-02-29 2009-09-10 Disco Abrasive Syst Ltd Method for machining holding surface of planar object
JP5457131B2 (en) * 2009-10-07 2014-04-02 株式会社ディスコ Blade changer
JP5611012B2 (en) * 2010-12-03 2014-10-22 株式会社ディスコ Cutting blade detection mechanism
JP5956111B2 (en) * 2011-02-01 2016-07-20 株式会社ディスコ Cutting equipment
JP2015020237A (en) * 2013-07-18 2015-02-02 株式会社ディスコ Cutting device
CN103817807B (en) * 2014-03-17 2015-08-19 南京航空航天大学 The rapid shaping cutting machine of half ball cover processed by crystal bar
JP6403595B2 (en) * 2015-02-06 2018-10-10 株式会社ディスコ Position adjustment jig and position adjustment method
JP6695102B2 (en) * 2015-05-26 2020-05-20 株式会社ディスコ Processing system
JP2019115962A (en) * 2017-12-27 2019-07-18 株式会社ディスコ Chuck table correction method, and cutting device
JP7126749B2 (en) * 2018-03-19 2022-08-29 株式会社ディスコ cutting equipment
JP7184620B2 (en) * 2018-12-11 2022-12-06 株式会社ディスコ cutting equipment
JP7157674B2 (en) * 2019-01-30 2022-10-20 株式会社ディスコ Blade exchange unit
CN110062530A (en) * 2019-04-30 2019-07-26 珠海德景电子有限公司 A kind of numerical control drilling machine of processing PCB plate and the cutter replacing method of numerical control drilling machine
JP7313202B2 (en) * 2019-06-18 2023-07-24 株式会社ディスコ Cutting device and replacement method
JP2021040097A (en) * 2019-09-05 2021-03-11 株式会社ディスコ Cutting method of workpiece

Also Published As

Publication number Publication date
CN112643512B (en) 2024-03-12
JP2021062423A (en) 2021-04-22
US11820042B2 (en) 2023-11-21
CN112643512A (en) 2021-04-13
DE102020212785A1 (en) 2021-04-15
TW202114820A (en) 2021-04-16
KR20210042806A (en) 2021-04-20
JP7285754B2 (en) 2023-06-02
US20210107180A1 (en) 2021-04-15

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