JP7225873B2 - 半導体装置及び半導体装置の製造方法 - Google Patents
半導体装置及び半導体装置の製造方法 Download PDFInfo
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- JP7225873B2 JP7225873B2 JP2019020875A JP2019020875A JP7225873B2 JP 7225873 B2 JP7225873 B2 JP 7225873B2 JP 2019020875 A JP2019020875 A JP 2019020875A JP 2019020875 A JP2019020875 A JP 2019020875A JP 7225873 B2 JP7225873 B2 JP 7225873B2
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- 239000004065 semiconductor Substances 0.000 title claims description 116
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 238000000034 method Methods 0.000 title description 19
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 136
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 133
- 239000000758 substrate Substances 0.000 claims description 108
- 239000010936 titanium Substances 0.000 claims description 97
- 229910052719 titanium Inorganic materials 0.000 claims description 95
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 94
- 229910052751 metal Inorganic materials 0.000 claims description 79
- 239000002184 metal Substances 0.000 claims description 78
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 76
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 46
- 229910052799 carbon Inorganic materials 0.000 claims description 45
- 229910021332 silicide Inorganic materials 0.000 claims description 40
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 36
- 229910052710 silicon Inorganic materials 0.000 claims description 36
- 239000010703 silicon Substances 0.000 claims description 36
- 229910052759 nickel Inorganic materials 0.000 claims description 35
- 238000002844 melting Methods 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 17
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- 229910017052 cobalt Inorganic materials 0.000 claims description 7
- 239000010941 cobalt Substances 0.000 claims description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 6
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 278
- 239000010408 film Substances 0.000 description 23
- 239000012535 impurity Substances 0.000 description 22
- 229910021341 titanium silicide Inorganic materials 0.000 description 21
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 17
- 229910021334 nickel silicide Inorganic materials 0.000 description 16
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000000921 elemental analysis Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000003763 carbonization Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910008479 TiSi2 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DFJQEGUNXWZVAH-UHFFFAOYSA-N bis($l^{2}-silanylidene)titanium Chemical compound [Si]=[Ti]=[Si] DFJQEGUNXWZVAH-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910021386 carbon form Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
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Description
Ti+2Si → TiSi2
TiSi2+2Ni → TiSi+Ni2Si
図7(A)に示すように、一枚のn+型炭化珪素基板の(000-1)面(C面)上に、スパッタリング法を用いて、チタン層及びニッケル層(オーミック接合金属元素層に対応する)が順番に形成されて、複数個の基板構造体を得た。チタン層の厚さは、60nmであった。ニッケル層の厚さは、20nmであった。なお、各基板構造体は、図3に示すように、n+型炭化珪素基板と共に、n型炭化珪素エピタキシャル層と、p型炭化珪素エピタキシャル層と、ソース領域と、コンタクト領域と、ゲート絶縁膜と、ゲート電極と、層間絶縁膜と、ソース電極を備えるが、図示を省略する。
ダイシングして得られた個々の実施例の半導体装置には、ドレイン電極の剥離は生じなかった。
図8は、実施例の半導体装置の断面のSEM(Scanning Electron Microscope)画像を示す。
図9は、実施例の半導体装置の断面について、EDX(Energy Dispersive X-ray Spectrometry)による元素分析結果を示す図である。
図7(B)に示すように、一枚のn+型炭化珪素基板の(000-1)面(C面)上に、スパッタリング法を用いて、ニッケル層及びチタン層が順番に形成されて、複数個の基板構造体を得た。ニッケル層及びチタン層の順番が異なる以外は、実施例と同様にして、比較例の半導体装置を複数得た。
ダイシングして得られた個々の比較例の半導体装置には、ドレイン電極の剥離が生じていた。
図10は、比較例の半導体装置の断面のSEM画像を示す。
11 n+型炭化珪素基板
11a 第1面
11b 第2面
12 n型炭化珪素エピタキシャル層
12a n型領域
12b n+型領域
12c 第1p+ベース領域
12d 第2p+ベース領域
13 p型炭化珪素エピタキシャル層
14 ソース領域
15 コンタクト領域
16 ゲート絶縁膜
17 ゲート電極
18 層間絶縁膜
19 ソース電極(第1電極)
20 オーミック接合層
20a 第1層
20b 第2層
21 ドレイン電極(第2電極)
30 半導体装置
31 n+型炭化珪素基板
31a 第1面
31b 第2面
32 n型炭化珪素エピタキシャル層
33 p型領域
34 p-型領域
35 p+型領域
36 ショットキー電極(第1電極)
37 層間絶縁膜
38 裏面電極(第2電極)
40 基板構造体
41 チタン層
42 オーミック接合金属元素層
Claims (7)
- 第1電極と、
前記第1電極と電気的に接続される第1面、及び第2面を有する炭化珪素基板と、
前記第2面上に配置されるオーミック接合層と、
前記オーミック接合層上に配置される第2電極と、
を備え、
前記オーミック接合層は、
前記第2面上に直接配置され、チタンのシリサイドと、チタンとは異なる金属元素のシリサイドとを含む第1層と、
前記第1層上に直接配置され、チタンのシリサイドと、前記金属元素のシリサイドとを含み、前記第1層よりもチタン濃度の低い第2層と、を有する、半導体装置。 - 前記第2層に含まれる前記金属元素の濃度は、前記第1層よりも高い請求項1に記載の半導体装置。
- 前記第1層及び前記第2層は、炭素を含み、
前記第1層に含まれる炭素の濃度は、前記第2層よりも高い請求項1又は2に記載の半導体装置。 - 前記第2層に含まれるシリコンの濃度は、前記第1層よりも高い請求項1~3の何れか一項に記載の半導体装置。
- 前記金属元素の融点は、チタンの融点よりも低い請求項1~4の何れか一項に記載の半導体装置。
- 前記金属元素は、ニッケル、モリブテン、タンタル、タングステン、パラジウム及びコバルトの中の少なくとも1つを含む請求項1~5の何れか一項に記載の半導体装置。
- 第1電極と、当該第1電極と電気的に接続される第1面、及び第2面を有する炭化珪素基板を含む基板構造体における前記第2面上に、チタン層を形成する工程と、
前記チタン層上に、シリコンと結合してシリサイドを形成可能なチタンとは異なる金属元素を含む金属元素層を形成する工程と、
前記金属元素層に対してレーザ光を照射して、前記基板構造体における前記第2面上に直接配置されチタンのシリサイドとチタンとは異なる金属元素のシリサイドとを含む第1層と、前記第1層上に直接配置されチタンのシリサイドと前記金属元素のシリサイドとを含み、前記第1層よりもチタン濃度の低い第2層と、を有するオーミック接合層を形成する工程と、
前記オーミック接合層上に、第2電極を形成する工程と、
を含む半導体装置の製造方法。
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