JP7211560B2 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
JP7211560B2
JP7211560B2 JP2022526584A JP2022526584A JP7211560B2 JP 7211560 B2 JP7211560 B2 JP 7211560B2 JP 2022526584 A JP2022526584 A JP 2022526584A JP 2022526584 A JP2022526584 A JP 2022526584A JP 7211560 B2 JP7211560 B2 JP 7211560B2
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Japan
Prior art keywords
component
resin composition
photosensitive resin
film
mass
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JP2022526584A
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Japanese (ja)
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JPWO2021241581A1 (https=
JPWO2021241581A5 (https=
Inventor
太郎 北畑
清治 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Formation Of Insulating Films (AREA)
JP2022526584A 2020-05-29 2021-05-25 感光性樹脂組成物 Active JP7211560B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020094819 2020-05-29
JP2020094819 2020-05-29
PCT/JP2021/019805 WO2021241581A1 (ja) 2020-05-29 2021-05-25 感光性樹脂組成物

Publications (3)

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JPWO2021241581A1 JPWO2021241581A1 (https=) 2021-12-02
JPWO2021241581A5 JPWO2021241581A5 (https=) 2022-11-01
JP7211560B2 true JP7211560B2 (ja) 2023-01-24

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JP2022526584A Active JP7211560B2 (ja) 2020-05-29 2021-05-25 感光性樹脂組成物

Country Status (5)

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JP (1) JP7211560B2 (https=)
KR (1) KR102773392B1 (https=)
CN (1) CN115698855A (https=)
TW (1) TW202208474A (https=)
WO (1) WO2021241581A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263530A1 (ja) * 2024-06-19 2025-12-26 住友ベークライト株式会社 感光性樹脂組成物、硬化膜および半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012123378A (ja) 2010-11-17 2012-06-28 Asahi Kasei E-Materials Corp 半導体素子表面保護膜又は層間絶縁膜用の感光性樹脂組成物
WO2018088469A1 (ja) 2016-11-11 2018-05-17 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜、硬化膜、半導体装置の製造方法、および半導体装置
JP2019053220A (ja) 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器
JP2019101052A (ja) 2017-11-28 2019-06-24 日立化成株式会社 感光性樹脂組成物及び回路基板の製造方法
JP2019109425A (ja) 2017-12-20 2019-07-04 住友ベークライト株式会社 永久膜形成用ネガ型感光性樹脂組成物、当該組成物の硬化膜および当該硬化膜を備える電気・電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007213032A (ja) 2006-01-10 2007-08-23 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン形成方法及び電子部品
KR102015682B1 (ko) * 2012-02-07 2019-08-28 히타치가세이가부시끼가이샤 감광성 수지 조성물, 패턴 경화막의 제조 방법 및 전자 부품
JP6477925B2 (ja) * 2016-09-08 2019-03-06 住友ベークライト株式会社 半導体装置の製造方法
JP6566150B2 (ja) * 2017-06-30 2019-08-28 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜及び電子装置
WO2019003918A1 (ja) * 2017-06-30 2019-01-03 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜及び電子装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012123378A (ja) 2010-11-17 2012-06-28 Asahi Kasei E-Materials Corp 半導体素子表面保護膜又は層間絶縁膜用の感光性樹脂組成物
WO2018088469A1 (ja) 2016-11-11 2018-05-17 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜、硬化膜、半導体装置の製造方法、および半導体装置
JP2019070832A (ja) 2016-11-11 2019-05-09 住友ベークライト株式会社 半導体装置の製造方法
JP2019053220A (ja) 2017-09-15 2019-04-04 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器
JP2019101052A (ja) 2017-11-28 2019-06-24 日立化成株式会社 感光性樹脂組成物及び回路基板の製造方法
JP2019109425A (ja) 2017-12-20 2019-07-04 住友ベークライト株式会社 永久膜形成用ネガ型感光性樹脂組成物、当該組成物の硬化膜および当該硬化膜を備える電気・電子機器

Also Published As

Publication number Publication date
JPWO2021241581A1 (https=) 2021-12-02
CN115698855A (zh) 2023-02-03
WO2021241581A1 (ja) 2021-12-02
TW202208474A (zh) 2022-03-01
KR20230013084A (ko) 2023-01-26
KR102773392B1 (ko) 2025-02-27

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