TW202208474A - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
TW202208474A
TW202208474A TW110119409A TW110119409A TW202208474A TW 202208474 A TW202208474 A TW 202208474A TW 110119409 A TW110119409 A TW 110119409A TW 110119409 A TW110119409 A TW 110119409A TW 202208474 A TW202208474 A TW 202208474A
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TW
Taiwan
Prior art keywords
component
resin composition
photosensitive resin
film
less
Prior art date
Application number
TW110119409A
Other languages
English (en)
Chinese (zh)
Inventor
北畑太郎
森清治
Original Assignee
日商住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202208474A publication Critical patent/TW202208474A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Formation Of Insulating Films (AREA)
TW110119409A 2020-05-29 2021-05-28 感光性樹脂組成物 TW202208474A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020094819 2020-05-29
JPJP2020-094819 2020-05-29

Publications (1)

Publication Number Publication Date
TW202208474A true TW202208474A (zh) 2022-03-01

Family

ID=78744092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110119409A TW202208474A (zh) 2020-05-29 2021-05-28 感光性樹脂組成物

Country Status (5)

Country Link
JP (1) JP7211560B2 (https=)
KR (1) KR102773392B1 (https=)
CN (1) CN115698855A (https=)
TW (1) TW202208474A (https=)
WO (1) WO2021241581A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263530A1 (ja) * 2024-06-19 2025-12-26 住友ベークライト株式会社 感光性樹脂組成物、硬化膜および半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007213032A (ja) 2006-01-10 2007-08-23 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン形成方法及び電子部品
JP6026097B2 (ja) * 2010-11-17 2016-11-16 旭化成株式会社 半導体素子表面保護膜又は層間絶縁膜用の感光性樹脂組成物
KR102015682B1 (ko) * 2012-02-07 2019-08-28 히타치가세이가부시끼가이샤 감광성 수지 조성물, 패턴 경화막의 제조 방법 및 전자 부품
JP6477925B2 (ja) * 2016-09-08 2019-03-06 住友ベークライト株式会社 半導体装置の製造方法
KR102004129B1 (ko) * 2016-11-11 2019-07-25 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물, 수지막, 경화막, 반도체 장치의 제조 방법, 및 반도체 장치
JP6566150B2 (ja) * 2017-06-30 2019-08-28 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜及び電子装置
WO2019003918A1 (ja) * 2017-06-30 2019-01-03 住友ベークライト株式会社 感光性樹脂組成物、樹脂膜及び電子装置
JP7062899B2 (ja) 2017-09-15 2022-05-09 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器
JP2019101052A (ja) 2017-11-28 2019-06-24 日立化成株式会社 感光性樹脂組成物及び回路基板の製造方法
JP7081138B2 (ja) 2017-12-20 2022-06-07 住友ベークライト株式会社 永久膜形成用ネガ型感光性樹脂組成物、当該組成物の硬化膜および当該硬化膜を備える電気・電子機器

Also Published As

Publication number Publication date
JPWO2021241581A1 (https=) 2021-12-02
CN115698855A (zh) 2023-02-03
JP7211560B2 (ja) 2023-01-24
WO2021241581A1 (ja) 2021-12-02
KR20230013084A (ko) 2023-01-26
KR102773392B1 (ko) 2025-02-27

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