CN115698855A - 感光性树脂组合物 - Google Patents

感光性树脂组合物 Download PDF

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Publication number
CN115698855A
CN115698855A CN202180038895.6A CN202180038895A CN115698855A CN 115698855 A CN115698855 A CN 115698855A CN 202180038895 A CN202180038895 A CN 202180038895A CN 115698855 A CN115698855 A CN 115698855A
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CN
China
Prior art keywords
resin composition
photosensitive resin
component
film
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180038895.6A
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English (en)
Chinese (zh)
Inventor
北畑太郎
森清治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of CN115698855A publication Critical patent/CN115698855A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Formation Of Insulating Films (AREA)
CN202180038895.6A 2020-05-29 2021-05-25 感光性树脂组合物 Pending CN115698855A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020094819 2020-05-29
JP2020-094819 2020-05-29
PCT/JP2021/019805 WO2021241581A1 (ja) 2020-05-29 2021-05-25 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
CN115698855A true CN115698855A (zh) 2023-02-03

Family

ID=78744092

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180038895.6A Pending CN115698855A (zh) 2020-05-29 2021-05-25 感光性树脂组合物

Country Status (5)

Country Link
JP (1) JP7211560B2 (https=)
KR (1) KR102773392B1 (https=)
CN (1) CN115698855A (https=)
TW (1) TW202208474A (https=)
WO (1) WO2021241581A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025263530A1 (ja) * 2024-06-19 2025-12-26 住友ベークライト株式会社 感光性樹脂組成物、硬化膜および半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012123378A (ja) * 2010-11-17 2012-06-28 Asahi Kasei E-Materials Corp 半導体素子表面保護膜又は層間絶縁膜用の感光性樹脂組成物
JP2019101052A (ja) * 2017-11-28 2019-06-24 日立化成株式会社 感光性樹脂組成物及び回路基板の製造方法
JP2019109425A (ja) * 2017-12-20 2019-07-04 住友ベークライト株式会社 永久膜形成用ネガ型感光性樹脂組成物、当該組成物の硬化膜および当該硬化膜を備える電気・電子機器
CN110809737A (zh) * 2017-06-30 2020-02-18 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置
CN110914756A (zh) * 2017-06-30 2020-03-24 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007213032A (ja) 2006-01-10 2007-08-23 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターン形成方法及び電子部品
KR102015682B1 (ko) * 2012-02-07 2019-08-28 히타치가세이가부시끼가이샤 감광성 수지 조성물, 패턴 경화막의 제조 방법 및 전자 부품
JP6477925B2 (ja) * 2016-09-08 2019-03-06 住友ベークライト株式会社 半導体装置の製造方法
KR102004129B1 (ko) * 2016-11-11 2019-07-25 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물, 수지막, 경화막, 반도체 장치의 제조 방법, 및 반도체 장치
JP7062899B2 (ja) 2017-09-15 2022-05-09 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012123378A (ja) * 2010-11-17 2012-06-28 Asahi Kasei E-Materials Corp 半導体素子表面保護膜又は層間絶縁膜用の感光性樹脂組成物
CN110809737A (zh) * 2017-06-30 2020-02-18 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置
CN110914756A (zh) * 2017-06-30 2020-03-24 住友电木株式会社 感光性树脂组合物、树脂膜和电子装置
JP2019101052A (ja) * 2017-11-28 2019-06-24 日立化成株式会社 感光性樹脂組成物及び回路基板の製造方法
JP2019109425A (ja) * 2017-12-20 2019-07-04 住友ベークライト株式会社 永久膜形成用ネガ型感光性樹脂組成物、当該組成物の硬化膜および当該硬化膜を備える電気・電子機器

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Publication number Publication date
JPWO2021241581A1 (https=) 2021-12-02
JP7211560B2 (ja) 2023-01-24
WO2021241581A1 (ja) 2021-12-02
TW202208474A (zh) 2022-03-01
KR20230013084A (ko) 2023-01-26
KR102773392B1 (ko) 2025-02-27

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