JP7202785B2 - 配線基板及び配線基板の製造方法 - Google Patents

配線基板及び配線基板の製造方法 Download PDF

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JP7202785B2
JP7202785B2 JP2018087609A JP2018087609A JP7202785B2 JP 7202785 B2 JP7202785 B2 JP 7202785B2 JP 2018087609 A JP2018087609 A JP 2018087609A JP 2018087609 A JP2018087609 A JP 2018087609A JP 7202785 B2 JP7202785 B2 JP 7202785B2
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wiring
insulating layer
layer
insulating
laminate
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Japanese (ja)
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JP2019192886A5 (enExample
JP2019192886A (ja
Inventor
章司 渡邉
健 宮入
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2018087609A priority Critical patent/JP7202785B2/ja
Priority to US16/392,687 priority patent/US10636733B2/en
Publication of JP2019192886A publication Critical patent/JP2019192886A/ja
Publication of JP2019192886A5 publication Critical patent/JP2019192886A5/ja
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    • H01L2924/3511—Warping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2018087609A 2018-04-27 2018-04-27 配線基板及び配線基板の製造方法 Active JP7202785B2 (ja)

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JP2018087609A JP7202785B2 (ja) 2018-04-27 2018-04-27 配線基板及び配線基板の製造方法
US16/392,687 US10636733B2 (en) 2018-04-27 2019-04-24 Wiring substrate

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JP2019192886A5 JP2019192886A5 (enExample) 2021-03-18
JP7202785B2 true JP7202785B2 (ja) 2023-01-12

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