JP7173728B2 - 撮像素子実装基板 - Google Patents

撮像素子実装基板 Download PDF

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Publication number
JP7173728B2
JP7173728B2 JP2017207237A JP2017207237A JP7173728B2 JP 7173728 B2 JP7173728 B2 JP 7173728B2 JP 2017207237 A JP2017207237 A JP 2017207237A JP 2017207237 A JP2017207237 A JP 2017207237A JP 7173728 B2 JP7173728 B2 JP 7173728B2
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JP
Japan
Prior art keywords
reinforcing
area
imaging device
board
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017207237A
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English (en)
Japanese (ja)
Other versions
JP2019079990A (ja
Inventor
周作 柴田
隼人 高倉
良広 河邨
正樹 伊藤
秀一 若木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2017207237A priority Critical patent/JP7173728B2/ja
Priority to CN201880065622.9A priority patent/CN111201604B/zh
Priority to US16/756,253 priority patent/US11647269B2/en
Priority to PCT/JP2018/036759 priority patent/WO2019082608A1/ja
Priority to TW107135371A priority patent/TWI794301B/zh
Publication of JP2019079990A publication Critical patent/JP2019079990A/ja
Priority to JP2022158201A priority patent/JP2022186738A/ja
Application granted granted Critical
Publication of JP7173728B2 publication Critical patent/JP7173728B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
JP2017207237A 2017-10-26 2017-10-26 撮像素子実装基板 Active JP7173728B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017207237A JP7173728B2 (ja) 2017-10-26 2017-10-26 撮像素子実装基板
CN201880065622.9A CN111201604B (zh) 2017-10-26 2018-10-02 摄像元件安装基板
US16/756,253 US11647269B2 (en) 2017-10-26 2018-10-02 Imaging element-mounting board
PCT/JP2018/036759 WO2019082608A1 (ja) 2017-10-26 2018-10-02 撮像素子実装基板
TW107135371A TWI794301B (zh) 2017-10-26 2018-10-08 攝像元件安裝基板
JP2022158201A JP2022186738A (ja) 2017-10-26 2022-09-30 撮像素子実装基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017207237A JP7173728B2 (ja) 2017-10-26 2017-10-26 撮像素子実装基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022158201A Division JP2022186738A (ja) 2017-10-26 2022-09-30 撮像素子実装基板

Publications (2)

Publication Number Publication Date
JP2019079990A JP2019079990A (ja) 2019-05-23
JP7173728B2 true JP7173728B2 (ja) 2022-11-16

Family

ID=66246398

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2017207237A Active JP7173728B2 (ja) 2017-10-26 2017-10-26 撮像素子実装基板
JP2022158201A Pending JP2022186738A (ja) 2017-10-26 2022-09-30 撮像素子実装基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022158201A Pending JP2022186738A (ja) 2017-10-26 2022-09-30 撮像素子実装基板

Country Status (5)

Country Link
US (1) US11647269B2 (zh)
JP (2) JP7173728B2 (zh)
CN (1) CN111201604B (zh)
TW (1) TWI794301B (zh)
WO (1) WO2019082608A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022168735A (ja) * 2021-04-26 2022-11-08 日東電工株式会社 集合体シート、および、集合体シートの製造方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068328A (ja) 1998-08-21 2000-03-03 Olympus Optical Co Ltd フリップチップ実装用配線基板
JP2008306350A (ja) 2007-06-06 2008-12-18 Hitachi Maxell Ltd カメラモジュール及び撮像装置
JP2009081357A (ja) 2007-09-27 2009-04-16 Shinko Electric Ind Co Ltd 配線基板の製造方法及び配線基板
JP2010080808A (ja) 2008-09-29 2010-04-08 Ngk Spark Plug Co Ltd 補強材付き配線基板の製造方法
JP2010103516A (ja) 2008-09-29 2010-05-06 Ngk Spark Plug Co Ltd 補強材付き配線基板
JP2010192546A (ja) 2009-02-16 2010-09-02 Ngk Spark Plug Co Ltd 補強材付き配線基板
JP2013118364A (ja) 2011-11-01 2013-06-13 Sumitomo Bakelite Co Ltd 半導体パッケージの製造方法
JP2016139633A (ja) 2015-01-26 2016-08-04 京セラ株式会社 シート基板およびその製造方法
WO2017135395A1 (ja) 2016-02-05 2017-08-10 大日本印刷株式会社 貫通電極基板及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183438A (ja) * 1998-12-16 2000-06-30 Mitsubishi Electric Corp 半導体レーザ装置の製造方法
JP4178542B2 (ja) 2002-05-08 2008-11-12 日本電気株式会社 裏面電極型半導体パッケージの実装構造
JP2005210628A (ja) 2004-01-26 2005-08-04 Mitsui Chemicals Inc 撮像装置用半導体搭載用基板と撮像装置
US7538433B2 (en) 2005-06-16 2009-05-26 Panasonic Corporation Semiconductor device
JP4844216B2 (ja) 2006-04-26 2011-12-28 凸版印刷株式会社 多層回路配線基板及び半導体装置
US7741652B2 (en) * 2008-03-07 2010-06-22 Visera Technologies Company Limited Alignment device and application thereof
US20100224397A1 (en) 2009-03-06 2010-09-09 Ibiden Co., Ltd. Wiring board and method for manufacturing the same
TWI484873B (zh) * 2009-04-07 2015-05-11 Au Optronics Corp 軟性電路板
WO2012035857A1 (ja) 2010-09-13 2012-03-22 株式会社カネカ 補強板一体型フレキシブルプリント基板、及び補強板一体型フレキシブルプリント基板の製造方法
JP6141760B2 (ja) 2013-12-19 2017-06-07 京セラ株式会社 撮像素子搭載用基板及び撮像装置
US9832860B2 (en) 2014-09-26 2017-11-28 Intel Corporation Panel level fabrication of package substrates with integrated stiffeners

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068328A (ja) 1998-08-21 2000-03-03 Olympus Optical Co Ltd フリップチップ実装用配線基板
JP2008306350A (ja) 2007-06-06 2008-12-18 Hitachi Maxell Ltd カメラモジュール及び撮像装置
JP2009081357A (ja) 2007-09-27 2009-04-16 Shinko Electric Ind Co Ltd 配線基板の製造方法及び配線基板
JP2010080808A (ja) 2008-09-29 2010-04-08 Ngk Spark Plug Co Ltd 補強材付き配線基板の製造方法
JP2010103516A (ja) 2008-09-29 2010-05-06 Ngk Spark Plug Co Ltd 補強材付き配線基板
JP2010192546A (ja) 2009-02-16 2010-09-02 Ngk Spark Plug Co Ltd 補強材付き配線基板
JP2013118364A (ja) 2011-11-01 2013-06-13 Sumitomo Bakelite Co Ltd 半導体パッケージの製造方法
JP2016139633A (ja) 2015-01-26 2016-08-04 京セラ株式会社 シート基板およびその製造方法
WO2017135395A1 (ja) 2016-02-05 2017-08-10 大日本印刷株式会社 貫通電極基板及びその製造方法

Also Published As

Publication number Publication date
TW201933591A (zh) 2019-08-16
CN111201604A (zh) 2020-05-26
JP2022186738A (ja) 2022-12-15
US11647269B2 (en) 2023-05-09
WO2019082608A1 (ja) 2019-05-02
TWI794301B (zh) 2023-03-01
JP2019079990A (ja) 2019-05-23
US20210195070A1 (en) 2021-06-24
CN111201604B (zh) 2024-02-27

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