JP7162612B2 - ワーク加工用シートおよび加工済みワークの製造方法 - Google Patents

ワーク加工用シートおよび加工済みワークの製造方法 Download PDF

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Publication number
JP7162612B2
JP7162612B2 JP2019558016A JP2019558016A JP7162612B2 JP 7162612 B2 JP7162612 B2 JP 7162612B2 JP 2019558016 A JP2019558016 A JP 2019558016A JP 2019558016 A JP2019558016 A JP 2019558016A JP 7162612 B2 JP7162612 B2 JP 7162612B2
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Japan
Prior art keywords
work
adhesive layer
active energy
processing sheet
energy ray
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JP2019558016A
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English (en)
Japanese (ja)
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JPWO2019111481A1 (ja
Inventor
孝文 小笠原
美紗季 坂本
尚哉 佐伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Publication of JPWO2019111481A1 publication Critical patent/JPWO2019111481A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Details Of Cutting Devices (AREA)
JP2019558016A 2017-12-07 2018-09-12 ワーク加工用シートおよび加工済みワークの製造方法 Active JP7162612B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017235377 2017-12-07
JP2017235377 2017-12-07
PCT/JP2018/033767 WO2019111481A1 (ja) 2017-12-07 2018-09-12 ワーク加工用シートおよび加工済みワークの製造方法

Publications (2)

Publication Number Publication Date
JPWO2019111481A1 JPWO2019111481A1 (ja) 2020-12-24
JP7162612B2 true JP7162612B2 (ja) 2022-10-28

Family

ID=66750873

Family Applications (2)

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JP2019558016A Active JP7162612B2 (ja) 2017-12-07 2018-09-12 ワーク加工用シートおよび加工済みワークの製造方法
JP2019558150A Active JP7162614B2 (ja) 2017-12-07 2018-11-27 ワーク加工用シートおよび加工済みワークの製造方法

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JP2019558150A Active JP7162614B2 (ja) 2017-12-07 2018-11-27 ワーク加工用シートおよび加工済みワークの製造方法

Country Status (5)

Country Link
JP (2) JP7162612B2 (ko)
KR (2) KR102515877B1 (ko)
CN (2) CN111149191B (ko)
TW (2) TWI783085B (ko)
WO (2) WO2019111481A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021095449A (ja) * 2019-12-13 2021-06-24 日東電工株式会社 粘着シート剥離方法
JP7490399B2 (ja) * 2020-03-13 2024-05-27 日東電工株式会社 再剥離粘着テープ
JP2024010412A (ja) * 2022-07-12 2024-01-24 日東電工株式会社 保護シート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013067708A (ja) 2011-09-21 2013-04-18 Nitto Denko Corp 塗膜保護シートおよびその製造方法
WO2015190432A1 (ja) 2014-06-12 2015-12-17 東レ株式会社 積層体およびその製造方法
WO2016199787A1 (ja) 2015-06-12 2016-12-15 東亞合成株式会社 粘着剤組成物及びその製造方法、並びに粘着製品
JP2017069474A (ja) 2015-10-01 2017-04-06 イビデン株式会社 回路基板及びその製造方法
JP2018172596A (ja) 2017-03-31 2018-11-08 株式会社クレハ フッ化ビニリデン共重合体粒子及びその利用

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JPS5019657B2 (ko) 1972-02-08 1975-07-09
JPS5352496Y2 (ko) 1973-06-21 1978-12-15
JPH09213663A (ja) * 1996-02-06 1997-08-15 Mitsui Toatsu Chem Inc 半導体ウエハの加工方法
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP2007069476A (ja) * 2005-09-07 2007-03-22 Toppan Printing Co Ltd インク吐出ヘッドのノズル面インク付着低減方法およびインク吐出ヘッド
WO2010067857A1 (ja) * 2008-12-12 2010-06-17 リンテック株式会社 積層体、その製造方法、電子デバイス部材および電子デバイス
WO2012032907A1 (ja) 2010-09-07 2012-03-15 リンテック株式会社 粘着シート、及び電子デバイス
JP5027321B2 (ja) * 2010-09-24 2012-09-19 古河電気工業株式会社 半導体加工用テープ
JP2011046964A (ja) 2010-11-19 2011-03-10 Nitto Denko Corp 粘着テープ及び粘着テープ用基材
JP5117630B1 (ja) * 2012-07-06 2013-01-16 古河電気工業株式会社 半導体ウェハ表面保護用粘着テープおよびそれを用いた半導体ウェハの製造方法
JP6343883B2 (ja) * 2013-07-29 2018-06-20 東亞合成株式会社 活性エネルギー線硬化型樹脂組成物
JP6210827B2 (ja) * 2013-10-04 2017-10-11 リンテック株式会社 半導体加工用シート
JP6140066B2 (ja) * 2013-12-10 2017-05-31 リンテック株式会社 半導体加工用シート
JP6424205B2 (ja) * 2014-03-03 2018-11-14 リンテック株式会社 半導体関連部材加工用シートおよび当該シートを用いるチップの製造方法
JP6019054B2 (ja) * 2014-03-24 2016-11-02 富士フイルム株式会社 ガスバリアフィルムおよびガスバリアフィルムの製造方法
JP6272109B2 (ja) * 2014-03-31 2018-01-31 リンテック株式会社 粘着剤組成物、粘着シート、および粘着シートの製造方法
JP6610256B2 (ja) * 2014-07-22 2019-11-27 三菱ケミカル株式会社 活性エネルギー線硬化性粘着剤組成物、これを用いてなる粘着剤、及び粘着シート
JP6521823B2 (ja) 2015-10-01 2019-05-29 リンテック株式会社 ダイシングダイボンディングシート
JP2017132874A (ja) * 2016-01-27 2017-08-03 リンテック株式会社 電子部品貼付用アースラベル

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013067708A (ja) 2011-09-21 2013-04-18 Nitto Denko Corp 塗膜保護シートおよびその製造方法
WO2015190432A1 (ja) 2014-06-12 2015-12-17 東レ株式会社 積層体およびその製造方法
WO2016199787A1 (ja) 2015-06-12 2016-12-15 東亞合成株式会社 粘着剤組成物及びその製造方法、並びに粘着製品
JP2017069474A (ja) 2015-10-01 2017-04-06 イビデン株式会社 回路基板及びその製造方法
JP2018172596A (ja) 2017-03-31 2018-11-08 株式会社クレハ フッ化ビニリデン共重合体粒子及びその利用

Also Published As

Publication number Publication date
CN111149191A (zh) 2020-05-12
KR20200094727A (ko) 2020-08-07
TWI783085B (zh) 2022-11-11
CN111149191B (zh) 2023-08-29
KR102579064B1 (ko) 2023-09-15
TW202010807A (zh) 2020-03-16
CN111149192A (zh) 2020-05-12
JPWO2019111760A1 (ja) 2020-12-17
JP7162614B2 (ja) 2022-10-28
TW201927964A (zh) 2019-07-16
CN111149192B (zh) 2023-09-15
KR20200094728A (ko) 2020-08-07
JPWO2019111481A1 (ja) 2020-12-24
TWI809030B (zh) 2023-07-21
KR102515877B1 (ko) 2023-03-30
WO2019111481A1 (ja) 2019-06-13
WO2019111760A1 (ja) 2019-06-13

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