JP7132306B2 - 半導体処理ツール - Google Patents
半導体処理ツール Download PDFInfo
- Publication number
- JP7132306B2 JP7132306B2 JP2020183300A JP2020183300A JP7132306B2 JP 7132306 B2 JP7132306 B2 JP 7132306B2 JP 2020183300 A JP2020183300 A JP 2020183300A JP 2020183300 A JP2020183300 A JP 2020183300A JP 7132306 B2 JP7132306 B2 JP 7132306B2
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- Prior art keywords
- module
- chamber
- vent
- loadlock
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Description
TGAS = T0 + (Tconvection- Tadiabatic) [1]
T0をガスの初期温度とすると、Tadiabatic(adiabatic:断熱)はガスの膨張による温度降下であり、Tconvection(convection:対流)はチャンバ壁からの伝熱による温度上昇である。断熱温度降下の変化率は次の式で表すことができる。
Claims (7)
- 半導体処理ツールであって、
搬送チャンバに1つのユニットとして結合可能なモジュール式ユニットを形成するフレームと、
前記モジュール式ユニット内に形成された積み重なった封止可能なチャンバと、
前記積み重なった封止可能なチャンバの各々に個別に結合された共通の流体搬送通気及び/または真空モジュールと、を含み、
前記共通の流体搬送通気及び/または真空モジュールは、前記モジュール式ユニットの複数の壁部に対して固定された複数の個別の結合インタフェースを有し、前記複数の個別の結合インタフェースの各々は、前記積み重なった封止可能なチャンバの個々のチャンバの各々に個別に結合するように構成されており、前記複数の個別の結合インタフェースの各々は共通の結合インタフェース構成を有しており、前記個別の結合インタフェースの各々は、前記モジュール式ユニットの複数の壁部に対して封止され、かつ前記個別の結合インタフェースの各々が、前記積み重なった封止可能なチャンバの各々に交換可能に結合するために、前記共通の流体搬送通気及び/または真空モジュールが前記共通の流体搬送通気及び/または真空モジュールと異なった流体の流れの制御特性を持つ他の共通の流体搬送通気及び/または真空モジュールと交換可能であるように構成され、前記共通の結合インタフェース構成の前記複数の個別の結合インタフェースの各々は、前記モジュール式ユニットの前記壁部に対して封止されることを特徴とする半導体処理ツール。 - 請求項1に記載の半導体処理ツールであって、前記積み重なった封止可能なチャンバの
各々はロードロックを含むことを特徴とする半導体処理ツール。 - 請求項1に記載の半導体処理ツールであって、前記共通の流体搬送通気及び/または真空モジュールは、1または複数の真空制御弁及び1つ通気弁を含むことを特徴とする半導体処理ツール。
- 請求項1に記載の半導体処理ツールであって、前記共通の流体搬送通気及び/または真空モジュールは、真空制御マニホールドを含むことを特徴とする半導体処理ツール。
- 請求項4に記載の半導体処理ツールであって、前記積み重なった封止可能なチャンバの各々に接続された他の共通の流体搬送通気及び/または真空モジュールを含み、前記他の共通の流体搬送通気及び/または真空モジュールは通気マニホールドを含むことを特徴とする半導体処理ツール。
- 請求項5に記載の半導体処理ツールであって、
前記共通の流体搬送通気及び/または真空モジュールは、前記積み重なった封止可能なチャンバの1つ目に通気を行いかつ前記積み重なった封止可能なチャンバの2つ目を真空引きするように構成され、
前記他の共通の流体搬送通気及び/または真空モジュールは、前記積み重なった封止可能なチャンバの1つ目を真空引きしかつ前記積み重なった封止可能なチャンバの2つ目に通気を行うように構成されていることを特徴とする半導体処理ツール。 - 請求項1に記載の半導体処理ツールであって、
前記共通の流体搬送通気及び/または真空モジュールは、前記共通の流体搬送通気及び/または真空モジュールに接続されている複数の弁体を有し、かつ前記複数の弁体の各々に共通な共通の流体ソース及び共通の流体排気管を形成することを特徴とする半導体処理ツール。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US93892207P | 2007-05-18 | 2007-05-18 | |
US60/938,922 | 2007-05-18 | ||
US12/123,365 | 2008-05-19 | ||
US12/123,365 US8272825B2 (en) | 2007-05-18 | 2008-05-19 | Load lock fast pump vent |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018158802A Division JP6907166B2 (ja) | 2007-05-18 | 2018-08-27 | 半導体処理ツール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021022750A JP2021022750A (ja) | 2021-02-18 |
JP7132306B2 true JP7132306B2 (ja) | 2022-09-06 |
Family
ID=40122197
Family Applications (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010509497A Active JP5795162B2 (ja) | 2007-05-18 | 2008-05-19 | ロードロック高速排気および通気 |
JP2013214185A Active JP5956403B2 (ja) | 2007-05-18 | 2013-10-11 | ロードロック高速排気および通気 |
JP2015125256A Active JP6113227B2 (ja) | 2007-05-18 | 2015-06-23 | 基板処理ツール |
JP2016042596A Active JP6420271B2 (ja) | 2007-05-18 | 2016-03-04 | 半導体処理ツール |
JP2018158802A Active JP6907166B2 (ja) | 2007-05-18 | 2018-08-27 | 半導体処理ツール |
JP2020183300A Active JP7132306B2 (ja) | 2007-05-18 | 2020-10-30 | 半導体処理ツール |
Family Applications Before (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010509497A Active JP5795162B2 (ja) | 2007-05-18 | 2008-05-19 | ロードロック高速排気および通気 |
JP2013214185A Active JP5956403B2 (ja) | 2007-05-18 | 2013-10-11 | ロードロック高速排気および通気 |
JP2015125256A Active JP6113227B2 (ja) | 2007-05-18 | 2015-06-23 | 基板処理ツール |
JP2016042596A Active JP6420271B2 (ja) | 2007-05-18 | 2016-03-04 | 半導体処理ツール |
JP2018158802A Active JP6907166B2 (ja) | 2007-05-18 | 2018-08-27 | 半導体処理ツール |
Country Status (4)
Country | Link |
---|---|
US (3) | US8272825B2 (ja) |
JP (6) | JP5795162B2 (ja) |
KR (1) | KR101522324B1 (ja) |
WO (1) | WO2008144670A1 (ja) |
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US9478446B2 (en) | 2016-10-25 |
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