FR2954583B1 - Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination - Google Patents

Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination

Info

Publication number
FR2954583B1
FR2954583B1 FR0959235A FR0959235A FR2954583B1 FR 2954583 B1 FR2954583 B1 FR 2954583B1 FR 0959235 A FR0959235 A FR 0959235A FR 0959235 A FR0959235 A FR 0959235A FR 2954583 B1 FR2954583 B1 FR 2954583B1
Authority
FR
France
Prior art keywords
semiconductors
manufacture
controlling
measuring contamination
contamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR0959235A
Other languages
English (en)
Other versions
FR2954583A1 (fr
Inventor
Arnaud Favre
Julien Bounouar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pfeiffer Vacuum SAS
Original Assignee
Alcatel Lucent SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Priority to FR0959235A priority Critical patent/FR2954583B1/fr
Priority to TW099143728A priority patent/TWI493645B/zh
Priority to SG2012042545A priority patent/SG181608A1/en
Priority to CN2010800574557A priority patent/CN102714135A/zh
Priority to KR1020127015654A priority patent/KR101761956B1/ko
Priority to PCT/EP2010/069973 priority patent/WO2011073348A1/fr
Priority to US13/516,376 priority patent/US9779972B2/en
Priority to JP2012543768A priority patent/JP5902626B2/ja
Priority to EP10798766A priority patent/EP2513949A1/fr
Publication of FR2954583A1 publication Critical patent/FR2954583A1/fr
Application granted granted Critical
Publication of FR2954583B1 publication Critical patent/FR2954583B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67389Closed carriers characterised by atmosphere control
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
FR0959235A 2009-12-18 2009-12-18 Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination Active FR2954583B1 (fr)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FR0959235A FR2954583B1 (fr) 2009-12-18 2009-12-18 Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination
TW099143728A TWI493645B (zh) 2009-12-18 2010-12-14 藉由污染程度量測的半導體製造監視裝置和方法
CN2010800574557A CN102714135A (zh) 2009-12-18 2010-12-16 通过测量污染控制半导体制造的方法和装置
KR1020127015654A KR101761956B1 (ko) 2009-12-18 2010-12-16 오염을 측정하여 반도체 제조를 제어하기 위한 방법 및 장치
SG2012042545A SG181608A1 (en) 2009-12-18 2010-12-16 Method and device for controlling the manufacture of semiconductor by measuring contamination
PCT/EP2010/069973 WO2011073348A1 (fr) 2009-12-18 2010-12-16 Procede et dispositif de pilotage de fabrication de semi-conducteurs par mesure de contamination
US13/516,376 US9779972B2 (en) 2009-12-18 2010-12-16 Method and device for controlling the manufacture of semiconductor by measuring contamination
JP2012543768A JP5902626B2 (ja) 2009-12-18 2010-12-16 汚染を測定することにより半導体の製造を制御する方法及び装置
EP10798766A EP2513949A1 (fr) 2009-12-18 2010-12-16 Procede et dispositif de pilotage de fabrication de semi-conducteurs par mesure de contamination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0959235A FR2954583B1 (fr) 2009-12-18 2009-12-18 Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination

Publications (2)

Publication Number Publication Date
FR2954583A1 FR2954583A1 (fr) 2011-06-24
FR2954583B1 true FR2954583B1 (fr) 2017-11-24

Family

ID=42101669

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0959235A Active FR2954583B1 (fr) 2009-12-18 2009-12-18 Procede et dispositif de pilotage de fabrication de semi conducteurs par mesure de contamination

Country Status (9)

Country Link
US (1) US9779972B2 (fr)
EP (1) EP2513949A1 (fr)
JP (1) JP5902626B2 (fr)
KR (1) KR101761956B1 (fr)
CN (1) CN102714135A (fr)
FR (1) FR2954583B1 (fr)
SG (1) SG181608A1 (fr)
TW (1) TWI493645B (fr)
WO (1) WO2011073348A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2961946B1 (fr) 2010-06-29 2012-08-03 Alcatel Lucent Dispositif de traitement pour boites de transport et de stockage
EP2727137B1 (fr) * 2011-06-28 2022-04-20 Brooks Automation (Germany) GmbH Systèmes et procédés de stockage de dispositifs à semiconducteurs
TWI465282B (zh) * 2012-06-27 2014-12-21 Univ Nat Taiwan 用於偵測氣體中汙染物之裝置及方法
US9405194B2 (en) 2012-11-30 2016-08-02 Semes Co., Ltd. Facility and method for treating substrate
US9579697B2 (en) * 2012-12-06 2017-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. System and method of cleaning FOUP
TWI654695B (zh) * 2012-12-06 2019-03-21 英福康公司 真空工具及測量該真空工具的客真空室中的氛圍的方法
JP6102277B2 (ja) 2013-01-24 2017-03-29 株式会社Sumco 半導体ウェーハの金属汚染評価方法および半導体ウェーハの製造方法
EP3343597B1 (fr) * 2015-08-28 2022-04-20 Murata Machinery, Ltd. Dispositif de stockage et procédé de stockage
FR3040528B1 (fr) * 2015-09-02 2017-09-15 Pfeiffer Vacuum Sas Procede et station de mesure de la contamination d'une boite de transport pour le convoyage et le stockage atmospherique de substrats
CN107065816A (zh) * 2017-06-17 2017-08-18 赵扬 具有集多种模块装置的化学化工实训室管理系统
JP7234527B2 (ja) * 2018-07-30 2023-03-08 Tdk株式会社 センサー内蔵フィルタ構造体及びウエハ収容容器
CN112271151B (zh) * 2020-11-10 2023-04-21 泉芯集成电路制造(济南)有限公司 一种机台污染监测装置及加工设备
US11493909B1 (en) * 2021-04-16 2022-11-08 Taiwan Semiconductor Manufacturing Company Ltd. Method for detecting environmental parameter in semiconductor fabrication facility

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3250038A (en) 1963-02-18 1966-05-10 Kota Products Inc Window structure
US5284412A (en) 1990-08-17 1994-02-08 Tokyo Electron Sagami Limited Stock unit for storing carriers
JP2971184B2 (ja) 1991-06-28 1999-11-02 中部電力株式会社 空気再生機
DE69205573T2 (de) 1992-08-04 1996-06-13 Ibm Fertigungsstrasse Architektur mit vollautomatisierten und rechnergesteuerten Fördereinrichtungen geeignet für abdichtbaren tragbaren unter Druck stehenden Behältern.
DE4237767A1 (de) 1992-11-09 1994-05-11 Siemens Ag Verfahren und Vorrichtung zum Reinigen von Bauteiloberflächen, insbesondere von mit Partikeln kontaminierten hochreinen Oberflächen von für die Elektronikfertigung bestimmten Bauteilen, wie Masken, Wafern od. dgl.
JP2741156B2 (ja) 1993-09-17 1998-04-15 東京エレクトロン株式会社 マルチチャンバー処理装置のクリーニング方法
US5616208A (en) 1993-09-17 1997-04-01 Tokyo Electron Limited Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus
US5827118A (en) 1996-08-28 1998-10-27 Seh America, Inc. Clean storage unit air flow system
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
SG76561A1 (en) * 1997-09-22 2000-11-21 Tokyo Electron Ltd Processing apparatus and method
JPH11168135A (ja) 1997-12-03 1999-06-22 Toshiba Corp 基板保管装置および基板保管方法
US6168672B1 (en) 1998-03-06 2001-01-02 Applied Materials Inc. Method and apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
JPH11274282A (ja) * 1998-03-23 1999-10-08 Toshiba Corp 基板収納容器、基板収納容器清浄化装置、基板収納容器清浄化方法および基板処理装置
US6193601B1 (en) * 1998-11-10 2001-02-27 Sandia Corporation Module bay with directed flow
DE19922936B4 (de) 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
EP1119039A1 (fr) * 1999-07-28 2001-07-25 Shin-Etsu Handotai Company Limited Procede de stockage de plaquette, contenant de stockage destine a cet effet et procede de transfert de plaquette dans ce contenant
DE19941399A1 (de) 1999-08-31 2001-04-19 Infineon Technologies Ag Reinigung von Stencilmasken mit Hilfe einer durch Maskenöffnungen hindurchtretenden Gasströmung
US6791661B2 (en) 1999-12-09 2004-09-14 Nikon Corporation Gas replacement method and apparatus, and exposure method and apparatus
US6346986B1 (en) 2000-03-14 2002-02-12 Wafertech, Inc. Non-intrusive pellicle height measurement system
JP2001267200A (ja) 2000-03-14 2001-09-28 Nikon Corp ガス置換方法及び装置、並びに露光方法及び装置
KR20010095087A (ko) 2000-03-30 2001-11-03 시마무라 테루오 노광장치, 노광방법 및 디바이스의 제조방법
AU2001286453A1 (en) * 2000-08-11 2002-02-25 Chem Trace Corporation System and method for cleaning semiconductor fabrication equipment parts
US6710845B2 (en) 2000-12-29 2004-03-23 Intel Corporation Purging gas from a photolithography enclosure between a mask protective device and a patterned mask
JP2002372777A (ja) 2001-06-18 2002-12-26 Canon Inc ガス置換方法および露光装置
JP2003031641A (ja) * 2001-07-19 2003-01-31 Mitsubishi Electric Corp 製品保管方法および製品保管装置
US20040023419A1 (en) * 2001-09-24 2004-02-05 Extraction Systems, Inc System and method for monitoring contamination
JPWO2003034475A1 (ja) 2001-10-10 2005-02-03 株式会社ニコン ガス置換方法及び装置、マスク保護装置、マスク、露光方法及び装置
JP4006235B2 (ja) 2002-02-05 2007-11-14 キヤノン株式会社 不活性ガス置換方法及び装置、レチクル保管庫、レチクル検査装置、レチクル搬送ボックス、デバイスの製造方法
JP4355488B2 (ja) 2002-05-13 2009-11-04 富士通株式会社 分子汚染監視システム
US7221993B2 (en) * 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
WO2004097927A1 (fr) 2003-04-28 2004-11-11 Tdk Corporation Appareil de purge et procede de purge
JP2005093697A (ja) 2003-09-17 2005-04-07 Canon Inc 面位置検出装置及び方法、露光装置並びに収差補正方法
JP2005140536A (ja) * 2003-11-04 2005-06-02 Mitsubishi Heavy Ind Ltd 真空乾燥システム
US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
EP2128890B1 (fr) * 2004-02-05 2012-10-17 Entegris, Inc. Nettoyage d'un conteneur à transporter de plaquettes
JP2005256983A (ja) 2004-03-12 2005-09-22 Shin Etsu Polymer Co Ltd 基板収納容器
CN100500526C (zh) 2004-12-28 2009-06-17 友达光电股份有限公司 卡匣仓储系统
FR2883412B1 (fr) * 2005-03-18 2007-05-04 Alcatel Sa Procede et dispositif pour le controle de la contamination des plaquettes de substrat
KR100719373B1 (ko) 2005-08-11 2007-05-17 삼성전자주식회사 반도체 노광 설비 및 펠리클 검사 방법
US20070059144A1 (en) * 2005-09-14 2007-03-15 Applied Materials, Inc. Methods and apparatus for a transfer station
US20070062561A1 (en) * 2005-09-19 2007-03-22 International Business Machines Corporation Method And Apparatus For Testing Particulate Contamination In Wafer Carriers
JP2007123673A (ja) 2005-10-31 2007-05-17 Asyst Shinko Inc 物品収納用容器の防振機構
US8308418B2 (en) 2006-05-09 2012-11-13 Taiwan Semiconductor Manufacturing Co., Ltd. High efficiency buffer stocker
FR2901546B1 (fr) 2006-05-24 2010-10-15 Cit Alcatel Procede et dispositif de depollution d'environnement confine
FR2908674A1 (fr) 2007-01-29 2008-05-23 Alcatel Sa Dispositif de nettoyage et de depollution d'un objet a environnement confine non etanche limite par une paroi a membrane souple
US7610111B2 (en) 2007-02-13 2009-10-27 Tech Semiconductor Singapore Pte Ltd Method and system for wafer lot order
KR101522324B1 (ko) 2007-05-18 2015-05-21 브룩스 오토메이션 인코퍼레이티드 로드 락 빠른 펌프 벤트
FR2920046A1 (fr) * 2007-08-13 2009-02-20 Alcatel Lucent Sas Procede de post-traitement d'un support de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs, et station de post-traitement pour la mise en oeuvre d'un tel procede
US20090162170A1 (en) 2007-12-19 2009-06-25 Asm Japan K.K. Tandem type semiconductor-processing apparatus
US20100021273A1 (en) 2008-07-28 2010-01-28 Applied Materials, Inc. Concrete vacuum chamber
JP5517182B2 (ja) 2008-08-08 2014-06-11 村田機械株式会社 保管庫システム
FR2961946B1 (fr) 2010-06-29 2012-08-03 Alcatel Lucent Dispositif de traitement pour boites de transport et de stockage
FR2964334B1 (fr) 2010-09-08 2012-09-14 Alcatel Lucent Procede et dispositif de depollution d'un photomasque pellicule

Also Published As

Publication number Publication date
US20120259449A1 (en) 2012-10-11
JP2013514646A (ja) 2013-04-25
EP2513949A1 (fr) 2012-10-24
US9779972B2 (en) 2017-10-03
KR20120099726A (ko) 2012-09-11
CN102714135A (zh) 2012-10-03
KR101761956B1 (ko) 2017-07-26
JP5902626B2 (ja) 2016-04-13
WO2011073348A1 (fr) 2011-06-23
FR2954583A1 (fr) 2011-06-24
TWI493645B (zh) 2015-07-21
TW201138005A (en) 2011-11-01
SG181608A1 (en) 2012-07-30

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