JP7112099B2 - 炭化シリコンショットキーダイオード - Google Patents
炭化シリコンショットキーダイオード Download PDFInfo
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- JP7112099B2 JP7112099B2 JP2019532038A JP2019532038A JP7112099B2 JP 7112099 B2 JP7112099 B2 JP 7112099B2 JP 2019532038 A JP2019532038 A JP 2019532038A JP 2019532038 A JP2019532038 A JP 2019532038A JP 7112099 B2 JP7112099 B2 JP 7112099B2
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims description 174
- 229910010271 silicon carbide Inorganic materials 0.000 title claims description 173
- 238000000034 method Methods 0.000 claims description 30
- 229920002120 photoresistant polymer Polymers 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000001020 plasma etching Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 27
- 229910052751 metal Inorganic materials 0.000 description 27
- 230000002441 reversible effect Effects 0.000 description 13
- 239000010936 titanium Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 230000005684 electric field Effects 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000005641 tunneling Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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Description
N型SiC層と、
N型SiC層に接触してP-N接合を形成するP型SiC層と、
N型SiC層およびP型SiC層の双方に接触してN型SiC層およびP型SiC層の双方との間でショットキー接触を形成するアノードと、
を備え、
P型SiC層のエッジは電気的に活性であり、P-N接合にてテーパ状負電荷密度を有する、炭化シリコン(SiC)ショットキーダイオードに属する。
N型SiC層と接触するP型SiC層を形成してP-N接合を形成するステップと、
アノードをP型SiC層およびN型SiC層の双方に接触させて、アノードとP型SiC層およびN型SiC層の双方との間にショットキー接触を形成するステップと、
P-N接合にてテーパ状負電荷密度を有するP型SiC層の電気的活性エッジを形成するステップと、
を含むことを特等とする炭化シリコンショットキーダイオードの製造方法に属する。
Claims (13)
- 炭化シリコン(SiC)ショットキーダイオードであって、
N型SiC層と、
前記N型SiC層に接触してP-N接合を形成するP型SiC層と、
前記N型SiC層および前記P型SiC層の双方に接触して前記N型SiC層および前記P型SiC層の双方との間にショットキー接触を形成するアノードと、
を備え、
前記P型SiC層のエッジは電気的に活性であり、前記P-N接合にてテーパ状負電荷密度を形成するために、前記アノードから離れて傾斜しているスロープを含むことを特徴とする炭化シリコンショットキーダイオード。 - 前記N型SiC層はエピタキシャル層である、請求項1に記載の炭化シリコンショットキーダイオード。
- 前記P型SiC層はエピタキシャル層である、請求項1または2に記載の炭化シリコンショットキーダイオード。
- 前記P型SiC層の所与のドーピングレベル(NP)に対する前記スロープの角度(α)は、NP×tanα<4×1019cm-3である、請求項1~3のいずれか一項に記載の炭化シリコンショットキーダイオード。
- 前記P型SiC層のエッジのスロープの領域において、前記アノードはP型SiC層と接触していない、請求項1~4のいずれか一項に記載の炭化シリコンショットキーダイオード。
- 前記P型SiC層はリングの形態にある、請求項1~5のいずれか一項に記載の炭化シリコンショットキーダイオード。
- 前記P型SiC層のドーピングレベル(NP)は、約1017cm-3~約1019cm-3の範囲にある、請求項1~6のいずれか一項に記載の炭化シリコンショットキーダイオード。
- 前記P型SiC層の厚さとドーピング濃度との積は、1.6×1013cm-2より大きく、ドーピングレベルが1019cm-3未満であることを特徴とする、請求項1~7のいずれか一項に記載の炭化シリコンショットキーダイオード。
- 炭化シリコンショットキーダイオードの製造方法であって、
N型SiC層と接触するP型SiC層を形成してP-N接合を形成するステップと、
アノードを前記P型SiC層および前記N型SiC層の双方に接触させて、前記アノードと前記P型SiC層および前記N型SiC層の双方との間にショットキー接触を形成するステップと、
前記P-N接合部にてテーパ状負電荷密度を形成するために前記アノードから離れて傾斜するスロープを形成するステップによって、前記P型SiC層の電気的活性エッジを形成するステップと、
を含むことを特徴とする炭化シリコンショットキーダイオードの製造方法。 - 前記N型SiC層および/または前記P型SiC層は、エピタキシャル層である、請求項9に記載の炭化シリコンショットキーダイオードの製造方法。
- 前記スロープを形成するステップは、フォトレジストの形態でソフトエッチングマスクを用いてプラズマエッチングするステップを含む、請求項9または10に記載の炭化シリコンショットキーダイオードの製造方法。
- 前記フォトレジストを140℃でハードベーキングするステップをさらに含む、請求項11に記載の炭化シリコンショットキーダイオードの製造方法。
- 150℃と160℃との間の温度であるがそれに限定されない推奨されるハードベーキング温度より高い温度で前記フォトレジストをオーバーベーキングするステップをさらに含む、請求項11に記載の炭化シリコンショットキーダイオードの製造方法。
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PCT/AU2017/051377 WO2018107222A1 (en) | 2016-12-15 | 2017-12-13 | Silicon carbide schottky diodes |
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JP3187454B2 (ja) * | 1991-07-05 | 2001-07-11 | 松下電工株式会社 | 充電回路 |
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JP2020502801A (ja) | 2020-01-23 |
AU2017377655B2 (en) | 2022-02-17 |
CN110291646A (zh) | 2019-09-27 |
US20200091281A1 (en) | 2020-03-19 |
EP3555925A1 (en) | 2019-10-23 |
EP3555925B1 (en) | 2022-01-12 |
CN110291646B (zh) | 2023-03-28 |
EP3555925A4 (en) | 2020-11-18 |
WO2018107222A1 (en) | 2018-06-21 |
KR20190095305A (ko) | 2019-08-14 |
US10971580B2 (en) | 2021-04-06 |
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