JP7043225B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7043225B2
JP7043225B2 JP2017215465A JP2017215465A JP7043225B2 JP 7043225 B2 JP7043225 B2 JP 7043225B2 JP 2017215465 A JP2017215465 A JP 2017215465A JP 2017215465 A JP2017215465 A JP 2017215465A JP 7043225 B2 JP7043225 B2 JP 7043225B2
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JP
Japan
Prior art keywords
semiconductor device
conductive member
distance
recess
connecting member
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JP2017215465A
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English (en)
Japanese (ja)
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JP2019087657A5 (enExample
JP2019087657A (ja
Inventor
英敏 倉谷
聡 服部
京 田靡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Devices and Storage Corp
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Toshiba Corp
Toshiba Electronic Devices and Storage Corp
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Application filed by Toshiba Corp, Toshiba Electronic Devices and Storage Corp filed Critical Toshiba Corp
Priority to JP2017215465A priority Critical patent/JP7043225B2/ja
Priority to CN201810165539.0A priority patent/CN109755205B/zh
Priority to CN202310692264.7A priority patent/CN116705746A/zh
Priority to US15/914,628 priority patent/US11037863B2/en
Priority to EP18160683.1A priority patent/EP3483931A1/en
Publication of JP2019087657A publication Critical patent/JP2019087657A/ja
Publication of JP2019087657A5 publication Critical patent/JP2019087657A5/ja
Priority to US17/316,157 priority patent/US11735505B2/en
Priority to JP2022037813A priority patent/JP7340056B2/ja
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Publication of JP7043225B2 publication Critical patent/JP7043225B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0116—Apparatus for manufacturing strap connectors
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/016—Manufacture or treatment of strap connectors
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
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    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07621—Aligning
    • H10W72/07627—Aligning involving guiding structures, e.g. spacers or supporting members
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07652—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in structures or sizes
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H10W72/07653—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting changes in shapes
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/621—Structures or relative sizes of strap connectors
    • H10W72/627—Multiple strap connectors having different structures or shapes
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/631—Shapes of strap connectors
    • H10W72/634—Cross-sectional shape
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
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    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
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    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
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    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP2017215465A 2017-11-08 2017-11-08 半導体装置 Active JP7043225B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2017215465A JP7043225B2 (ja) 2017-11-08 2017-11-08 半導体装置
CN201810165539.0A CN109755205B (zh) 2017-11-08 2018-02-28 半导体装置
CN202310692264.7A CN116705746A (zh) 2017-11-08 2018-02-28 半导体装置
US15/914,628 US11037863B2 (en) 2017-11-08 2018-03-07 Semiconductor device
EP18160683.1A EP3483931A1 (en) 2017-11-08 2018-03-08 Semiconductor device
US17/316,157 US11735505B2 (en) 2017-11-08 2021-05-10 Semiconductor device
JP2022037813A JP7340056B2 (ja) 2017-11-08 2022-03-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017215465A JP7043225B2 (ja) 2017-11-08 2017-11-08 半導体装置

Related Child Applications (1)

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JP2022037813A Division JP7340056B2 (ja) 2017-11-08 2022-03-11 半導体装置

Publications (3)

Publication Number Publication Date
JP2019087657A JP2019087657A (ja) 2019-06-06
JP2019087657A5 JP2019087657A5 (enExample) 2020-12-24
JP7043225B2 true JP7043225B2 (ja) 2022-03-29

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JP2017215465A Active JP7043225B2 (ja) 2017-11-08 2017-11-08 半導体装置
JP2022037813A Active JP7340056B2 (ja) 2017-11-08 2022-03-11 半導体装置

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US (2) US11037863B2 (enExample)
EP (1) EP3483931A1 (enExample)
JP (2) JP7043225B2 (enExample)
CN (2) CN116705746A (enExample)

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EP3584829A4 (en) * 2017-02-20 2021-03-10 Shindengen Electric Manufacturing Co., Ltd. ELECTRONIC DEVICE
WO2019082346A1 (ja) * 2017-10-26 2019-05-02 新電元工業株式会社 半導体装置、及び、半導体装置の製造方法
JP6752981B2 (ja) * 2017-10-26 2020-09-09 新電元工業株式会社 半導体装置の製造方法
JP7043225B2 (ja) * 2017-11-08 2022-03-29 株式会社東芝 半導体装置
EP3761358A1 (en) * 2019-07-02 2021-01-06 Nexperia B.V. A lead frame assembly for a semiconductor device
JP7271381B2 (ja) 2019-09-20 2023-05-11 株式会社東芝 半導体装置
JP7341078B2 (ja) * 2020-02-07 2023-09-08 日立Astemo株式会社 半導体装置
JP7278986B2 (ja) 2020-03-18 2023-05-22 株式会社東芝 半導体装置
JP2022045072A (ja) 2020-09-08 2022-03-18 株式会社東芝 半導体装置
US12648455B2 (en) * 2020-12-03 2026-06-02 Semiconductor Components Industries, Llc Clip interconnect with micro contact heads
JP7451455B2 (ja) * 2021-03-19 2024-03-18 株式会社東芝 半導体装置
JP2022146341A (ja) * 2021-03-22 2022-10-05 株式会社東芝 半導体装置
JP2023046065A (ja) * 2021-09-22 2023-04-03 株式会社東芝 半導体装置
IT202200001649A1 (it) 2022-02-01 2023-08-01 St Microelectronics Srl Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
IT202200001646A1 (it) * 2022-02-01 2023-08-01 St Microelectronics Srl Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
WO2023181957A1 (ja) * 2022-03-24 2023-09-28 ローム株式会社 半導体装置
CN217280758U (zh) * 2022-04-08 2022-08-23 力特半导体（无锡）有限公司 分立功率半导体封装
US12283538B2 (en) * 2022-05-10 2025-04-22 Infineon Technologies Ag Molded semiconductor package having an embedded inlay
JP7855461B2 (ja) * 2022-09-02 2026-05-08 株式会社東芝 半導体装置
JP7771030B2 (ja) * 2022-09-16 2025-11-17 株式会社東芝 半導体装置
JP7871149B2 (ja) 2022-09-22 2026-06-08 株式会社東芝 半導体装置
JP7802640B2 (ja) * 2022-09-22 2026-01-20 株式会社東芝 半導体装置

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JP2006216736A (ja) 2005-02-03 2006-08-17 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2011049244A (ja) 2009-08-25 2011-03-10 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置
US20130009295A1 (en) 2011-07-06 2013-01-10 Infineon Technologies Ag Semiconductor Device Including a Contact Clip Having Protrusions and Manufacturing Thereof
JP2013232566A (ja) 2012-04-28 2013-11-14 Shindengen Electric Mfg Co Ltd 電子回路パッケージ

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