JP7033303B2 - 基板搬送装置 - Google Patents
基板搬送装置 Download PDFInfo
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- JP7033303B2 JP7033303B2 JP2018015688A JP2018015688A JP7033303B2 JP 7033303 B2 JP7033303 B2 JP 7033303B2 JP 2018015688 A JP2018015688 A JP 2018015688A JP 2018015688 A JP2018015688 A JP 2018015688A JP 7033303 B2 JP7033303 B2 JP 7033303B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Description
ガラス基板およびセラミックス基板等の脆性材料基板や、PET(ポリエチレンテレフタレート樹脂)基板およびポリイミド樹脂基板等の樹脂基板等(以降、単に「基板」と称する。)は、種々の処理を経て最終製品となる。このような処理として、たとえば、基板を所定数の分割要素に切断する処理や、基板を切断した場合に生じる端材を除去する処理、基板の表面をクリーニングする処理等がある。基板は、処理ごとに所定のステージに搬送され、処理が終了すると次の処理のために別のステージへと搬送される。実施形態に係る基板搬送装置1は、所定のステージから次のステージへと基板Fを搬送するときに使用する装置である。
図1は、実施形態に係る基板搬送装置1の外観構成を示す斜視図である。図1に示すように、基板搬送装置1は、基板載置部2と、圧力付与部3と、フレーム4と、フレーム5と、吸着部10と、駆動機構20と、搬送機構30と、を備える。
上記のような構成の基板搬送装置1による基板Fの搬送について、図4(a)~図7(c)に基づいて説明する。図4(a)~図7(c)は、実施形態に係る基板搬送装置1の動作を説明するための模式図である。また、図4(a)~図7(c)は、Y軸正側から見た場合を示している。
次に、基板搬送装置1の動作について説明する。図8は、基板搬送装置1の構成を示すブロック図である。図8に示すように、基板搬送装置1は、基板載置部2と、圧力付与部3と、吸着部10と、駆動機構20の駆動部であるエアーシリンダ200と、搬送機構30と、モータ33と、を備え、さらに、駆動用流量調整弁40と、吸着用流量調整弁50と、入力部60と、検出部70と、制御部80と、を備える。
実施形態によれば、以下の効果が奏される。
(1)切替バルブを備える場合
上記の実施形態に係る基板搬送装置1では、各エアーシリンダ200を駆動させる際、駆動用流量調整弁40により、各ピストンロッド202の移動を制御する。ここで、たとえば、何れかの領域のピストンロッド202の移動が所定よりも早くなり、その領域が隣接する領域よりも早く基板Fに到達した場合、吸着部10は、基板F側に膨らむような円弧状ではなく、波打つような形状に変形する。このような場合、基板Fと吸着部10との間に介在する空気を追い出すことができず、基板Fと吸着部10との間に空気溜まりが生じ、基板Fに皺が生じる原因となり得る。
実施形態に係る基板搬送装置1において、第1のストッパ210の基板Fとの距離は、可変であるように構成してもよい。たとえば、第1のストッパ210を支持部240にネジで嵌め込むようにし、このネジの嵌め込み量により、第1のストッパ210の基板Fとの距離を調整するようにしてもよい。また、第2のストッパ220と移動部材230との距離については、たとえば、フレーム4に複数のネジ孔を設けておき、適当なネジ孔を選択して、フレーム4に第2のストッパ220を取り付けるよう構成すれば、第2のストッパ220と移動部材230との距離を変更できる。
実施形態に係る基板搬送装置1は、吸着部10を駆動する駆動部として、エアーシリンダ200に代えてモータを採用することもできる。この場合、モータは、駆動力を維持した状態で止まることができない。よって、駆動部にモータを採用する場合、モータにバネ等の弾性部材を組み合わせて、圧力を生じさせる必要がある。
10…吸着部
10A~10I…吸着部の領域
20…駆動機構
200…駆動部(エアーシリンダ)
210…第1のストッパ
220…第2のストッパ
241…支持軸
F…基板
Claims (4)
- 基板を吸着して搬送する基板搬送装置であって、
前記基板に接近および離間する方向に変形可能な吸着部と、
前記吸着部を中央部から両端部にかけて順に前記基板に接近させるように前記吸着部を変形させる駆動機構と、を備え、
前記吸着部は、前記中央部から前記両端部に向かう方向に複数の領域に区分され、
前記駆動機構は、前記吸着部の前記各領域を個別に駆動する複数の駆動部を有し、前記中央部から前記両端部に向かう方向に垂直で且つ前記基板に対して平行な支持軸により前記各駆動部を回動可能に支持する、
ことを特徴とする基板搬送装置。 - 請求項1に記載の基板搬送装置において、
前記駆動部は、エアーシリンダである、
ことを特徴とする基板搬送装置。 - 請求項2に記載の基板搬送装置において、
前記駆動機構は、前記基板から離れる方向において前記領域の移動を規制する第1のストッパを前記領域ごとに備え、
前記領域を前記基板から離す方向に前記エアーシリンダが駆動された場合に、前記中央部から前記両端部にかけて前記領域と前記基板との距離が大きくなるように、前記各領域に対応する前記第1のストッパが調整されている、
ことを特徴とする基板搬送装置。 - 請求項1ないし3の何れか一項に記載の基板搬送装置において、
前記駆動機構は、前記駆動部の回動を所定範囲に規制する第2のストッパを備える、
ことを特徴とする基板搬送装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018015688A JP7033303B2 (ja) | 2018-01-31 | 2018-01-31 | 基板搬送装置 |
TW108100377A TW201935605A (zh) | 2018-01-31 | 2019-01-04 | 基板搬送裝置及基板吸附裝置 |
CN201910043236.6A CN110092196B (zh) | 2018-01-31 | 2019-01-17 | 基板输送装置以及基板吸附装置 |
KR1020190011449A KR20190093151A (ko) | 2018-01-31 | 2019-01-29 | 기판반송장치 및 기판흡착장치 |
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---|---|---|---|
JP2018015688A JP7033303B2 (ja) | 2018-01-31 | 2018-01-31 | 基板搬送装置 |
Publications (2)
Publication Number | Publication Date |
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JP2019131371A JP2019131371A (ja) | 2019-08-08 |
JP7033303B2 true JP7033303B2 (ja) | 2022-03-10 |
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JP2018015688A Active JP7033303B2 (ja) | 2018-01-31 | 2018-01-31 | 基板搬送装置 |
Country Status (4)
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JP (1) | JP7033303B2 (ja) |
KR (1) | KR20190093151A (ja) |
CN (1) | CN110092196B (ja) |
TW (1) | TW201935605A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112010040B (zh) * | 2020-08-10 | 2021-11-02 | Tcl华星光电技术有限公司 | 基板传送装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013180891A (ja) | 2012-03-05 | 2013-09-12 | Ushio Inc | 基板搬送装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2534842B2 (ja) * | 1994-12-26 | 1996-09-18 | 富山日本電気株式会社 | 基板分離装置および基板分離方法 |
JPH09100042A (ja) * | 1995-10-03 | 1997-04-15 | Hitachi Chem Co Ltd | 多層プリント板の吸着搬送装置 |
TW200301211A (en) | 2001-12-11 | 2003-07-01 | Mitsuboshi Diamond Ind Co Ltd | Method of suckingly holding substrate, and suckingly and holdingly carrying machine using the method |
KR20110047941A (ko) * | 2009-10-30 | 2011-05-09 | 선 에흐웨이 | 기판흡착장치 및 기판흡착어셈블리 |
WO2011074474A1 (ja) * | 2009-12-16 | 2011-06-23 | 株式会社ニコン | 基板支持部材、基板搬送装置、基板搬送方法、露光装置及びデバイス製造方法 |
JP2012129228A (ja) * | 2010-12-13 | 2012-07-05 | Toppan Printing Co Ltd | 基板移載装置並びに基板の取り出し方法および基板の収納方法 |
US9130484B2 (en) * | 2011-10-19 | 2015-09-08 | Sri International | Vacuum augmented electroadhesive device |
JP5979594B2 (ja) * | 2012-09-13 | 2016-08-24 | 村田機械株式会社 | 吸引チャック、及びこれを備えた移載装置 |
EP2911833B1 (en) * | 2012-10-12 | 2018-02-21 | SRI International | Vacuum augmented electroadhesive device |
CN204980362U (zh) * | 2015-09-23 | 2016-01-20 | 合肥鑫晟光电科技有限公司 | 一种显示面板传输系统 |
-
2018
- 2018-01-31 JP JP2018015688A patent/JP7033303B2/ja active Active
-
2019
- 2019-01-04 TW TW108100377A patent/TW201935605A/zh unknown
- 2019-01-17 CN CN201910043236.6A patent/CN110092196B/zh active Active
- 2019-01-29 KR KR1020190011449A patent/KR20190093151A/ko active Search and Examination
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013180891A (ja) | 2012-03-05 | 2013-09-12 | Ushio Inc | 基板搬送装置 |
Also Published As
Publication number | Publication date |
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CN110092196A (zh) | 2019-08-06 |
KR20190093151A (ko) | 2019-08-08 |
CN110092196B (zh) | 2022-04-08 |
TW201935605A (zh) | 2019-09-01 |
JP2019131371A (ja) | 2019-08-08 |
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