JP6985267B2 - 耐食性構成部品および製造方法 - Google Patents
耐食性構成部品および製造方法 Download PDFInfo
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- JP6985267B2 JP6985267B2 JP2018525431A JP2018525431A JP6985267B2 JP 6985267 B2 JP6985267 B2 JP 6985267B2 JP 2018525431 A JP2018525431 A JP 2018525431A JP 2018525431 A JP2018525431 A JP 2018525431A JP 6985267 B2 JP6985267 B2 JP 6985267B2
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- layer
- corrosion
- corrosion resistant
- exemplary embodiment
- rare earth
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- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Description
この非仮特許出願は、2015年11月16日に出願された米国仮特許出願第62/255,769号の優先権および利益を主張する。上記仮出願は、あらゆる目的のためにその全体が参照により本明細書に援用される。
実施例
60μmのダイヤモンド:表面を平坦化するために必要とされる場合、
15μmのダイヤモンド、固定研磨パッド:2分、
9μmのダイヤモンド、ラルゴ(プラスチック)パッド:8分、
3μmのダイヤモンド、DAC(ナイロン)パッド:6分、
1μmのダイヤモンド、起毛布:3分。
本開示のいくつかの変形形態および変更形態を用いることができる。本開示の特徴の一部のみを提供し、他の特徴を提供しないことも可能である。
110 セラミック絶縁基板
120 耐食性非多孔質層
130 介在層
150 耐食性非多孔質層
t1 層120の厚さ
t2 層130の厚さ
200 プラズマエッチング反応器アセンブリ
210 セラミック絶縁基板
220 耐食性非多孔質層
225 蓋体
240 誘導コイル
250 反応器
300 ヒータ装置
320 耐食性非多孔質層
330 介在層
330 絶縁セラミック
340 加熱素子
360 高周波(RF)シールド
380 支持ディスク
400 CVD反応器アセンブリ
410 シャワーヘッド
420 耐食性非多孔質層
440 ヒータ
450 処理中のウェハ
Claims (6)
- 半導体処理反応器と共に使用するように構成された、耐食性構成部品(100)であって、
a)セラミック絶縁基板(110)と、
b)前記セラミック絶縁基板に接着された耐食性非多孔質層(120)であって、50μm以上の厚さ、および1%以下の多孔度を有し、前記耐食性非多孔質層の総重量に基づいて15重量%以上の希土類化合物を有し、前記希土類化合物の総重量に基づいて1重量%のZrO 2 を有する組成の耐食性非多孔質層と、
c)1000ppm以下の炭素含有量および1×10−4未満の損失正接と、を有する耐食性構成部品。 - 前記セラミック絶縁基板が酸化アルミニウムである、請求項1に記載の耐食性構成部品。
- 前記希土類化合物が酸化イットリウム(Y2O3)である、請求項1または2に記載の耐食性構成部品。
- 前記耐食性非多孔質層が、1mm2あたり50個未満の微小亀裂および亀裂を有する微細構造を有する、請求項1、2または3に記載の耐食性構成部品。
- 前記耐食性非多孔質層が、
a.0.5%以下の多孔度と、
b.30MPa以上の接着強度と、
c.100μm以上の厚さと、
d.300nm以上、30μm以下の平均粒径とを有する、請求項1、2、3または4に記載の耐食性構成部品。 - 前記セラミック絶縁基板が酸化アルミニウムであり、前記希土類化合物が酸化イットリウム(Y2O3)である、請求項1に記載の耐食性構成部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US201562255769P | 2015-11-16 | 2015-11-16 | |
US62/255,769 | 2015-11-16 | ||
PCT/US2016/062210 WO2017087474A1 (en) | 2015-11-16 | 2016-11-16 | Corrosion-resistant components and methods of making |
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JP2019504470A JP2019504470A (ja) | 2019-02-14 |
JP6985267B2 true JP6985267B2 (ja) | 2021-12-22 |
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US (2) | US20170140902A1 (ja) |
EP (1) | EP3377318A1 (ja) |
JP (1) | JP6985267B2 (ja) |
KR (1) | KR102674364B1 (ja) |
CN (1) | CN108463345B (ja) |
TW (1) | TWI821183B (ja) |
WO (1) | WO2017087474A1 (ja) |
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US10060041B2 (en) * | 2014-12-05 | 2018-08-28 | Baker Hughes Incorporated | Borided metals and downhole tools, components thereof, and methods of boronizing metals, downhole tools and components |
JP6985267B2 (ja) | 2015-11-16 | 2021-12-22 | クアーズテック,インコーポレイティド | 耐食性構成部品および製造方法 |
US9620466B1 (en) * | 2015-11-30 | 2017-04-11 | Infineon Technologies Ag | Method of manufacturing an electronic device having a contact pad with partially sealed pores |
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US11376822B2 (en) | 2022-07-05 |
WO2017087474A1 (en) | 2017-05-26 |
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EP3377318A1 (en) | 2018-09-26 |
CN108463345A (zh) | 2018-08-28 |
KR20180083912A (ko) | 2018-07-23 |
US20170250057A1 (en) | 2017-08-31 |
US20170140902A1 (en) | 2017-05-18 |
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