JP6812262B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP6812262B2
JP6812262B2 JP2017022006A JP2017022006A JP6812262B2 JP 6812262 B2 JP6812262 B2 JP 6812262B2 JP 2017022006 A JP2017022006 A JP 2017022006A JP 2017022006 A JP2017022006 A JP 2017022006A JP 6812262 B2 JP6812262 B2 JP 6812262B2
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JP
Japan
Prior art keywords
substrate
chemical solution
liquid
landing position
nozzle
Prior art date
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Active
Application number
JP2017022006A
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English (en)
Japanese (ja)
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JP2018129422A (ja
Inventor
喬 太田
喬 太田
山田　邦夫
邦夫 山田
友明 相原
友明 相原
次郎 奥田
次郎 奥田
昌之 林
昌之 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017022006A priority Critical patent/JP6812262B2/ja
Priority to PCT/JP2017/041506 priority patent/WO2018146897A1/ja
Priority to KR1020197020576A priority patent/KR102269436B1/ko
Priority to CN201780083713.0A priority patent/CN110192267B/zh
Priority to TW106140563A priority patent/TWI686243B/zh
Publication of JP2018129422A publication Critical patent/JP2018129422A/ja
Application granted granted Critical
Publication of JP6812262B2 publication Critical patent/JP6812262B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2017022006A 2017-02-09 2017-02-09 基板処理装置および基板処理方法 Active JP6812262B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017022006A JP6812262B2 (ja) 2017-02-09 2017-02-09 基板処理装置および基板処理方法
PCT/JP2017/041506 WO2018146897A1 (ja) 2017-02-09 2017-11-17 基板処理装置および基板処理方法
KR1020197020576A KR102269436B1 (ko) 2017-02-09 2017-11-17 기판 처리 장치 및 기판 처리 방법
CN201780083713.0A CN110192267B (zh) 2017-02-09 2017-11-17 基板处理装置及基板处理方法
TW106140563A TWI686243B (zh) 2017-02-09 2017-11-22 基板處理裝置及基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017022006A JP6812262B2 (ja) 2017-02-09 2017-02-09 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
JP2018129422A JP2018129422A (ja) 2018-08-16
JP6812262B2 true JP6812262B2 (ja) 2021-01-13

Family

ID=63107352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017022006A Active JP6812262B2 (ja) 2017-02-09 2017-02-09 基板処理装置および基板処理方法

Country Status (5)

Country Link
JP (1) JP6812262B2 (zh)
KR (1) KR102269436B1 (zh)
CN (1) CN110192267B (zh)
TW (1) TWI686243B (zh)
WO (1) WO2018146897A1 (zh)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931285B2 (ja) * 2000-04-20 2012-05-16 アイメック 基板の表面の局所化された液体処理のための方法及び装置
JP2005138053A (ja) * 2003-11-07 2005-06-02 Sumitomo Precision Prod Co Ltd 基板洗浄装置
JP4451175B2 (ja) * 2004-03-19 2010-04-14 大日本スクリーン製造株式会社 ノズル洗浄装置および基板処理装置
JP4347765B2 (ja) * 2004-07-21 2009-10-21 大日本スクリーン製造株式会社 基板処理装置
JP2006120666A (ja) * 2004-10-19 2006-05-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007237363A (ja) * 2006-03-10 2007-09-20 Komatsu Machinery Corp 基板表面加工装置
JP2008098227A (ja) * 2006-10-06 2008-04-24 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5516447B2 (ja) * 2011-02-08 2014-06-11 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP6265702B2 (ja) * 2012-12-06 2018-01-24 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
JP2015015284A (ja) * 2013-07-03 2015-01-22 株式会社荏原製作所 基板洗浄装置および基板洗浄方法
JP6298277B2 (ja) * 2013-12-03 2018-03-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP5994804B2 (ja) * 2014-03-17 2016-09-21 東京エレクトロン株式会社 基板洗浄方法
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
JP6375160B2 (ja) * 2014-07-08 2018-08-15 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
US9460944B2 (en) * 2014-07-02 2016-10-04 SCREEN Holdings Co., Ltd. Substrate treating apparatus and method of treating substrate
KR102285832B1 (ko) * 2014-07-25 2021-08-05 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US10037902B2 (en) * 2015-03-27 2018-07-31 SCREEN Holdings Co., Ltd. Substrate processing device and substrate processing method

Also Published As

Publication number Publication date
TW201829073A (zh) 2018-08-16
KR102269436B1 (ko) 2021-06-24
WO2018146897A1 (ja) 2018-08-16
CN110192267A (zh) 2019-08-30
JP2018129422A (ja) 2018-08-16
KR20190094427A (ko) 2019-08-13
TWI686243B (zh) 2020-03-01
CN110192267B (zh) 2023-03-17

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